Datenblatt

LX_M&S_FE005
High efficiency digital light source
3000K
Warm white
(actual size)
Technical Specifications
power XED
3000K WARM WHITE
High CRI
Part number: LX-01PXX-30W-00-00 *)
*) Note:
Description of
part number
refer to page 14.
Rev.01 (03/08)
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High efficiency digital light source
UNIQUE FEATURES
. CCT: 3000K
-
Proprietary Chip-in-Silicon [CiS] technology
-
Silicon (Si-wafer) generic package
-
Miniature form factor: 2.5mm x 2.5mm x 0.6mm
-
Single chromatic range with tight tolerance: Mac Adams 6
-
Best-in-class Thermal Resistance: 5K/W
. Typical Average Lifetime*):
> 50,000 hours (T70)
-
Suitable for assembly on standard FR4 PCB
. ESD-withstand voltage: 2kV
. Luminous Flux: 36 Lumen
. CRI > 85 (Ra8)
. Standard SMT assembly
DESIGNED & SPECIFIED FOR
-
Automotive interior lighting
-
Medical & dental lighting
-
Transportation equipment interior lighting (aircraft, train, vessels)
-
Emergency luminaries
-
Backlight light source for LCD displays
-
Substitution of halogen lamps
-
Decorative and architectural lighting
-
Accent lighting
-
High quality torch & recreational lamps
-
Industrial equipment lighting
*)Note:
Conditions at
Ta=25 °C,
RthJA=35K/W,
IF=350mA
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High efficiency digital light source
Absolute Maximum Ratings
Ta=25°C
Parameter
Symbol
Value
Unit
Power Dissipation
PD
1.6
W
DC Forward Current
IF
400
mA
Pulsed Forward Current
IFP
1000
mA
Reverse Voltage
VR
5
V
Operating Temperature
Top
-40 ~ +100
°C
Storage Temperature
Tstg
Junction Temperature
Tj
-40 ~ +100
145
°C
°C
(10ms pulse width of duty 10%)
Allowable Forward Current vs. Ambient Temperature
IF [mA]
RthJA=35K/W
Ta [°C]
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High efficiency digital light source
Electro-Optical Characteristics
Ta=25°C
Parameter
Symbol
Condition
typ
max
Unit
Forward Voltage
VF
IF=350 mA
3.6
3.9
V
DC Forward Current
IF
350
400
mA
-
deg
Viewing Angle
2Θ ½
IF=350 mA
120
Colour Temperature
CT
warm white
3000
CRI (Ra8)
IF=350 mA
88
X
IF=350 mA
Y
IF=350 mA
0.440
0.403
φV
IF=350 mA
32
Colour Rendering Index
Chromaticity Coordinate
Luminous Flux
Ranking
Ranking
Rank
A
B
LX-01PXX-30W-00-rev01.doc
lm
IF=350 mA, Ta=25°C
Luminous Flux φ V
[lm]
Rank
A
B
K
Min.
28
32
Max.
32
36
IF=350 mA, Ta=25°C
Luminous Intensity I V *)
[cd]
Min.
Max.
10.6
12.1
12.1
13.6
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*) Note:
XEDs have a 100%
final testing
procedure in the
production.
The measurement
includes the luminous
intensity (cd) and
chromaticity
coordinates.
Tolerance ranges:
IV - ± 10%
CIE - ± 0,01
These measured
values are basis for
the release of the
delivery.
High efficiency digital light source
Chromaticity Coordinates Diagram
CIE Coordinates: Tolerance area
MacAdams 6*)
Warm white 3000 K
Target Coordinates:
x=0,440 y=0,403
at IF=350 mA, Ta=25°C
*) Note:
The CIE-area inside the
MacAdams Ellipse 6
(acc. to IEC 60081)
appears as an equal
color so that the
chromaticity differences
between the center of
the ellipse and any
point on the ellipse can
hardly be perceived .
Measurement equipment:
Integrating sphere
(inner diameter: 500mm)
Measurement tolerance:
± 0,01
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High efficiency digital light source
Reference Curves (typical values)
Luminous Intensity
IV= f (IF); TA= 25 °C
IV [cd]
IF [mA]
Forward Current
IF= f (VF); TA= 25 °C
IF [mA]
VF [V]
Forward Voltage
VF=f (Ta); IF=350 mA
VF [V]
φV [lm]
Luminous Flux
φV= f (IF); TA= 25 °C
Ta [°C]
IF [mA]
Luminous Flux
φVrel= f (TS); IF=350mA
Y
Relative φV
CIE-Shift
XY=f (IF), Ta=25°C
TS [°C]
X
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High efficiency digital light source
Relative Luminous Intensity [%]
Relative Spectral Emission
Iv-rel = f (λ);IF=350mA, Ta=25°C
λ [nm]
Radiation Characteristic
Ta=25°C
0°
10°
20°
30°
40°
50°
60°
70°
80°
90°
Relative Intensity [%]
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High efficiency digital light source
Soldering Guidelines
Soldering paste and optical layer must not come into contact. This could affect the
performance of the component.
Do not exert external pressure on any part of the resin when soldering.
The component should be cooled to room temperature before further
processing.
This product is not suitable for wave soldering. Use re-flow solder or use a hot plate
when soldering.
Soldering under N2-atmosphere is recommended to maintain reliability.
Soldering rework is not recommended.
Do not implement multiple re-flow methods.
After soldering, do not bend the circuit board.
Solder Pad / Footprint
(Unit:mm)
Recommended dimensions
Note: The solder pad should be close to the electrode area, as recommended.
The larger the metal area with solder resist, the better the heat transfer.
Reflow Soldering Conditions / Profile
Preheat to be at maximum 200°C for maximum 2 minutes.
Soldering temperature should not exceed 260°C for maximum 10 seconds.
Recommended soldering conditions (surface of circuit board) –lead-free solder
Maximum soldering profile
260 °C for max. 10 s
1 ~ 3°C/sec.
Recommended soldering profile
250 °C for max. 15 s
Minimum soldering profile
240 °C for max. 20 s
Preheating
180 ~ 200°C
60sec. max.
above 220°C
1 ~ 3°C/sec.
120sec. max.
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High efficiency digital light source
Please check the mounting reliability based on the application.
Excessive coating of solder paste on the board may result in the formation of a
“Solder Ball” on the board and/ or on the side surface of the XED after reflow.
Customer should take note that the “Solder Ball” may cause a short circuit.
A too large solder pad area can cause the XED to move out of place. Therefore it
is our recommendation that only our recommended footprint with an adapted
solder paste quantity should be used.
Thermal Management
Thermal design of the end product is critical to the performance of the XED. The
heat generation of the XED must be considered when making the system design.
Operate XEDs within the maximum ratings given in this specification.
Please choose only an operating current according to XED’s ambient temperature
given in this specification and connect the XED to a suitable cooling system.
The equation below indicates correlation between TJ and TA.
TJ=TA + Rth JA∗P
Definitions and Abbreviations:
TJ
TA
RJA
P
=
=
=
=
Junction Temperature: [°C]
Ambient Temperature: [°C]
Thermal resistance from XED Junction to Ambient: [K/W]
Power Input (IF ∗ VF) : [W]
Typical Thermal Resistance Junction-Solder Point:
Rth JS typ. = 5 K/W
Schematic diagram of thermal package
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High efficiency digital light source
General Guidelines
The XEDs described in this brochure are intended for ordinary electronic
equipment such as office equipment, communications equipment, measurement
instruments and household appliances. Consult LEXEDIS sales staff in advance
for information on the applications in which exceptional quality and reliability are
required, particularly when the failure or malfunction of the XEDs may directly
harm life or health (such as for airplanes, aerospace, submersible repeaters,
nuclear reactor control systems, automobiles, traffic control equipment, life
support systems and safety devices).
User shall not reverse engineer by disassembling or analysis of the XEDs without
having prior written consent from LEXEDIS. In the rare occurrence that XEDs are
found faulty, the user shall inform LEXEDIS directly before disassembling or
analysis.
The formal specifications must be agreed and signed by both parties prior to large
volume purchase begins.
The appearance and specifications of the product may be modified for
improvement without prior notice.
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High efficiency digital light source
Outline Dimensions
Item
Package
Encapsulating
Material
Silicon (Si)
Silicone and Phosphor
Packing
Quantity is 2000 pcs/reel.
The reel is packed in an antistatic plastic pack.
The XEDs are packaged in cardboard boxes for transportation.
The packages should be handled carefully to avoid damage of the components.
The boxes are not waterproof and therefore must be protected from water and
moisture.
When the XEDs are transported, we recommend using the same packing
method as LEXEDIS.
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High efficiency digital light source
Reel Packing Structure (Reel φ 180mm)
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High efficiency digital light source
Labeling
The label on the packing units shows the material number, lot number, date code
and quantity.
Label positions
Label
Reel (φ180)
Label
Plastic Pack
Reel
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High efficiency digital light source
Description Part Number and Label
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High efficiency digital light source
Precautions in Handling
Safety Precautions
The XED light output is intense enough to cause injury to human eyes if
viewed directly. Precautions must be taken to avoid looking directly at the
XEDs with unprotected eyes
[according IEC 60825-1 (EN 60825-1)].
Protection against electrostatic discharge – ESD
XEDs are electronic components and sensitive to electrostatic discharge.
Appropriate ESD protection measures must be taken when working with
XED products. For example, earthed shoes or ESD wristbands have to be
applied. Non-compliance with ESD protection measures may lead to
damage or destruction of the product.
Precaution in driving
Products are designed exclusively for forward current driving. Please
avoid driving system with reverse voltage, which may cause migration
which damages the product.
Baking
If the moisture absorbent material (silica gel) is no longer effective or the
products have exceeded the storage time, baking treatment should be
performed under the following condition:
Baking treatment : more than 12 hours at 60±5°C.
Cleaning
Chemical solvents or cleaning agents must not be used to clean the XED
component.
Mechanical stress on the XED component must be avoided. It is best to
use a soft brush, damp cloth or low-pressure compressed air.
Storage
XEDs should ideally be stored in as-delivered condition and in the original
packaging. The products should be stored away from direct light in dry
location.
After opening the package:
The XEDs should be kept at 30°C or less and 70%RH or less. The XEDs
should be soldered within 12 hours after opening the package. If unused
XEDs remain, they should be stored in the moisture proof packages, such
as sealed containers with packages of moisture absorbent material (silica
gel). It is also recommended to return the XEDs to the original moisture
proof bag and to reseal the moisture proof bag again.
Please avoid rapid transitions in ambient temperature, especially in high
humidity environments where condensation could occur.
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High efficiency digital light source
©2007 LEXEDIS Lighting GmbH. All rights reserved.
Company information:
LEXEDIS Lighting GmbH, a joint venture company between TridonicAtco of Austria and
Toyoda Gosei of Japan, invents and produces innovative and high-performance digital light
sources marketed worldwide under the XED brand. Founded in 2005, LEXEDIS is a fastgrowing and customer-oriented company providing advanced opto-semiconductor products
for the advancement of energy-efficient lighting solutions in automotive, general lighting,
industrial and display applications. As the creator of XED technology, LEXEDIS is the
leading company in the development of intelligent light sources.
For technical assistance or the location of your nearest customer-service office contact the
following:
LEXEDIS Lighting GmbH
Technologiepark 10
A-8380 Jennersdorf
Austria
Tel No:0043-(0)5-9010-650-00
www.lexedis.com
[email protected]
Product specifications are subject to change without notice. XED is a registered trademark
of Lexedis lighting GmbH in Europe and other countries.
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