LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only INFRARED EMITTING DIODES Pb Lead-Free Parts LSIR21931F/S1-PF/TR1 DATA SHEET DOC. NO : QW0905-LSIR21931F/S1-PF/TR1 REV :B DATE : 05- Nov. - 2012 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LSIR21931F/S1-PF/TR1 Package Dimensions 5.0 0.6 1.6 5.8 5.0 4.1 6.4 4.35 2.5 5.5±0.5 TYP0.5 2.54 2.25 Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Features: 1. High radiant intensity. 2. Suitable for pulse applications. 3. Low average degradation. Descriptions: The LSIR21931F/S1-PF/TR1 series are super-high efficiency Gallium Aluminum Arsenide infrared emitting diodes encapsulated in water clear plastic T-1 3/4 package individually Device Selection Guide: PART NO LSIR21931F/S1-PF/TR1 MATERIAL AlGaAs LENS COLOR Blue Transparent LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSIR21931F/S1-PF/TR1 Page2/8 Reel Dimensions 1.75 2.0 8.0 4.0 12.7±0.2 5.0 11.5 1.55 24.0±0.5 3.4 1.5MIN 5.15±0.2 5.4±0.2 6.2±0.2 3.1 0.4±0.1 Carrier Type Dimensions 21.5TYP 100±2.0 330±2.0 28.4TYP 13.0TYP Part No. Quantity/Reel LSIR21931F/S1-PF/TR1 1500 devices LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/8 PART NO. LSIR21931F/S1-PF/TR1 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT SIR (F) Forward Current IF 50 mA Peak Forward Current (200uS every 4 seconds ) IFP 0.5 A Peak Forward Current (300PPS,1μs Pulse) IFP 3 A Power Dissipation PD 100 mW Reverse Voltagev Vr 5 V Electrostatic Discharge( * ) ESD 2000 V Operating Temperature Topr -55 ~ +100 ℃ Storage Temperature Tstg -55 ~ +100 ℃ Storage Term Shelf life of the products in unopened bag is 3 months(max) at <30° C and 70% RH from the delivery date.If the shelf life exceeds 3 months or more, the LEDs need to be stored in a sealed container with desiccant(silica gel) to ensure their shelf life will not exceed 1 year LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSIR21931F/S1-PF/TR1 Page 4/8 Electrical Optical Characteristics (Aa=25℃) SYMBOL Min. Typ. Radiant Intensity Le 35 Aperture Radiant Incidence Ee 5 PARAMETER Max. UNIT TEST CONDITION 75 mW/sr IF=50mA 15 mW/cm IF=50mA 2 λpeak 880 nm IF=50mA △λ 40 nm IF=50mA Forward Voltage VF 1.4 1.7 V IF=50mA Reverse Current IR 100 μA VR=5V Peak Wavelength Spectral Line Half Width Viewing Angle 2θ1/2 22 deg Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The radiant intensity data did not including ±15% testing tolerance. Brightness Code For Standard LED Lamps SIR(F) CHIP Group Luminous Intensity(mcd) at 50 mA Min. Max. A14 35 42 A15 42 50 A16 50 60 A17 60 75 A18 75 85 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page5/8 PART NO. LSIR21931F/S1-PF/TR1 Typical Electro-Optical Characteristics Curve SIR(F) CHIP Fig.2 Relative Radiant Power vs. Wavelength Fig.1 Forward Current vs. Rorward Voltage Relative Radiant Power Normalize @20mA Forward Current[mA] 1000 100 10 1 0.1 1.0 2.0 1.5 2.5 3.0 3.5 1.0 0.5 0.0 4.0 750 Forward Voltage[V] 950 1000 Fig.4 Relative Radiant Power vs. Forward Peak Current 10.0 Relative Radiant Power Normalize @100 mA 10.0 1.0 0.1 1 1.0 0.1 100 10 1000 100 10 IFPK [mA] IFDC [mA] Fig.5 Forward DC Voltage vs. Temperature Fig.6 Relative Radiant Power vs. Temperature 1.2 3.0 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 Ambient Temperature [℃] 100 Relative Radiant Power Normalize @ 20mA, 25 ℃ Forward DC Voltage Normalize @20mA, 25 ℃ 900 Wavelength[nm] Fig.3 Relative Radiant Power vs. Forward DC Current Relative Radiant Power Normalize @20mA 850 800 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature[ ℃] 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSIR21931F/S1-PF/TR1 Page6/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSIR21931F/S1-PF/TR1 Page 7/8 Recommended Soldering Conditions 3-1. LEAD Reflow Solder Temp. (℃ ) 240 Rising +5 ℃/sec Cooling -5 ℃/sec Preheat 150 120 60 ~ 120 sec Time 5sec 3-2 PB-Free Reflow Solder 1~5¢XC/sec Preheat 180~200¢XC 1~5¢XC/sec Above 220¢XC 60 sec.Max. 120 sec.Max. Reflow Soldering should not be done more than two times. 260¢XC MaX. 10sec.Max