Sh ort Pro duct In fo rmation M a rc h 2 00 9 my-d™ vicinity plain SRF SRF SRF SRF 55V02P 55V02P HC 55V10P 55V10P HC Intelligent EEPROM with Contactless Interf ace compliant to ISO/IEC 15693 or ISO/IEC 18000-3 Mode 1 Chip Card & S ecurity Important: For further information please contact: Infineon Technologies AG in Munich, Germany, Chip Card & Security, Fax +49 (0)89 / 234-955 9372 E-Mail: [email protected] Edition 2009-03-31 Published by Infineon Technologies AG 81726 Munich, Germany © 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. my-d™ vicinity SRF 55VxxP my-d™ vicinity plain - SRF 55VxxP Short Product Information Revision History: Current Version 2009-03-31 Previous Release: 2007-07-02 Page Subjects (major changes since last revision) all editorial changes 5 update of ordering information EAS feature removed Trademarks of Infineon Technologies AG my-d™ Short Product Information 3 / 14 2009-03-31 my-d™ vicinity SRF 55VxxP Features Intelligent EEPROM with Contactless Interface compliant to ISO/IEC 15693 or ISO/IEC 18000-3 Mode 1 Contactless Interface • Physical interface and Anticollision compliant to ISO/IEC 15693 – contactless transmission of data and supply energy – data rate up to 26 kbit/s – operation frequency: 13.56 MHz – anticollision logic: several cards may be operated in the field simultaneously with identification of up to 30 Tags per second • Read / write distance up to 150 cm (influenced by external circuitry i.e. reader and inlay design) EEPROM • Up to 10 kbit EEPROM memory • ISO mode - block organization of memory, accessible with ISO optional commands – up to 248 blocks of user memory (block size 4 bytes) applicable for plain memory only • Custom mode - page organization of memory, accessible with ISO custom commands – up to 128 pages of user memory (page size 8 bytes for data storage and 2 bytes for administration purposes) • Unique IDentification number (UID) • EEPROM programming time per page < 4 ms • EEPROM endurance minimum 100,000 erase/write cycles1) • Data retention minimum 10 years1) Value Counters: up to 65536 (value range from 0 to 216-1) • Each page in the User Area is configurable as a Value Counter • Support of Anti-Tearing Electrical characteristics • • • • ESD protection minimum 2 kV Ambient temperature -25°C ... +70°C (for the chip) Chip capacitance 23.5 pF ± 5% High on-chip capacitance chip available (97pF ± 5%) allowing small tag antenna designs Development Tool • Evaluation Kit my-d™ including my-d™ Manager Software 1) Values are temperature dependent Short Product Information 4 / 14 2009-03-31 my-d™ vicinity SRF 55VxxP 1 Ordering and packaging information Table 1-1 Type Ordering Information my-d™ vicinity Package Total1) / User Total / User Memory User Blocks3) [bytes] Pages2) SRF 55V02P C wafer unsawn/sawn 320 / 232 32 / 56 29 SRF 55V02P NB NiAu Bumped SRF 55V02P MCC2 P-MCC2-2-1 SRF 55V02P MCC8 P-MCC8-2-3 SRF 55V10P C wafer unsawn/sawn 1280 / 1000 128 / 248 125 SRF 55V10P NB NiAu Bumped SRF 55V10P MCC2 P-MCC2-2-1 SRF 55V10P MCC8 P-MCC8-2-3 Ordering code on request on request on request on request on request on request on request on request 1) Total memory size and page count includes the Service Area and the 2 administrative bytes per page whereas user memory size and page count is freely programmable for user data. 2) Page size 8 bytes, accessible via ISO custom commands 3) Block size 4 bytes, accessible via ISO optional commands Table 1-2 Type Ordering Information my-d™ vicinity High on-chip capacitance Package Total1) / User Total / User Ordering 3) Memory User Blocks code [bytes] Pages2) SRF 55V02P HC C wafer unsawn/sawn 320 / 232 32 / 29 56 on request SRF 55V02P HC NB NiAu Bumped on request SRF 55V10P HC C wafer unsawn/sawn SRF 55V10P HC NB NiAu Bumped 1280 / 1000 128 / 125 248 on request on request 1) Total memory size and page count includes the Service Area and the 2 administrative bytes per page whereas user memory size and page count is freely programmable for user data. 2) Page size 8 bytes, accessible via ISO custom commands 3) Block size 4 bytes, accessible via ISO optional commands For more ordering information (wafer thickness and height of NiAu-Bump) please contact your local Infineon sales office. Short Product Information 5 / 14 2009-03-31 my-d™ vicinity SRF 55VxxP Pin description Figure 1-1 Pin configuration Module Contactless Card - MCC2 (top / bottom view) Figure 1-2 Pin configuration Module Contactless Card - MCC8 (top / bottom view) LA my-d™ vicinity SRF 55VxxP (HC) Figure 1-3 Pad configuration die my-d™ vicinity Plain Table 1-3 Symbol LA LB Pin description and function Function Antenna connection Antenna connection Short Product Information 6 / 14 LB 2009-03-31 my-d™ vicinity SRF 55VxxP 2 my-d™ Product Family The my-d™ products are designed to meet increased demands for basic security and design flexibility. The my-d™ family of contactless memories supplies the user with different memory sizes and incorporates security features to enable considerable flexibility in the application design. The functional architecture, meaning the memory organization and authentication of my-d™ products is the same for both my-d™ proximity (ISO/IEC 14443) and my-d™ vicinity (ISO/IEC 15693 or ISO/IEC 18000-3 Mode 1). This eases the system design and allows simple adaptation between applications. 2.1 Product Variants - Plain / Secure Operation, High On-Chip Capacitance my-d™ products are available in – plain mode with open memory access, – secure mode with both memory access controlled by authentication procedures (up to 14 sectors) and plain mode operation (plain sector). – additional small tag antenna designs are possible with the HC variant providing high onchip capacitance chip for small communication distances Applications may start with the my-d™ ICs in plain mode operation and individual page locking; for more complex applications various settings in secure mode can be used for multi user or multi application configurations. In secure mode a cryptographic algorithm based on a 64-bit key is available. Mutual authentication, message authentication codes (MAC) and customized access conditions protect the memory against unauthorized access. Configurable value counters, featuring anti-tearing functionality, are suitable for value token applications such as limited use applications. Architectural interoperability of all my-d™ products enables an easy migration from simple to more demanding applications. In addition, the my-d™ light (ISO/IEC 15693 or ISO/IEC 18000-3 Mode 1) is part of the my-d™ family. Its optimized command set and memory expands the range of cost optimized applications. Short Product Information 7 / 14 2009-03-31 my-d™ vicinity SRF 55VxxP 2.2 General Memory Structure The fundamental structure of my-d™ vicinity and my-d™ proximity products consists of a • User Area for storing user data • Service Area storing the Unique serial number UID and manufacturer data • Administration Area for storing – Sector Index (SI), defining either plain or secure memory access – Access Condition (AC) holding information on access rights (e.g. read/write, read only) User Area Data Administration Area SI AC Data SI AC Data SI AC Data SI AC Service Area SI AC SI AC SI AC : : : Unique serial number (UID) Figure 2-1 General Memory Structure of my-d™ products Communication The physical contactless interface and communication protocol is defined for proximity by ISO/IEC 14443 and for vicinity by ISO/IEC 15693 respectively. my-d™ products support a set of standardized commands. Additionally Custom commands are implemented providing e.g. 8-byte page memory access and optionally authentication (secure variant). Security The memory can be accessed without security precaution (i.e. authentication) in plain mode. The secure variants additionally require the mutual authentication procedure before memory access is granted. Short Product Information 8 / 14 2009-03-31 my-d™ vicinity SRF 55VxxP 2.3 Application Segments my-d™ products are optimized for personal and object identification. Please find in the following table some dedicated examples. Table 2-1 my-d™ products overview Product Features my-d™ vicinity plain − • ISO/IEC 15693 or SRF 55V02P ISO/IEC 18000-3 Mode 1 SRF 55V10P • up to 1000 byte free user memory • Plain access my-d™ vicinity plain HC − • ISO/IEC 15693 or SRF 55V02P HC ISO/IEC 18000-3 Mode 1 SRF 55V10P HC • High on-chip capacitance • up to 1000 byte free user memory • Plain access my-d™ vicinity secure − • ISO/IEC 15693 or SRF 55V02S ISO/IEC 18000-3 Mode 1 SRF 55V10S • up to 992 byte free user memory • Secure access my-d™ vicinity secure HC − • ISO/IEC 15693 or SRF 55V02S HC ISO/IEC 18000-3 Mode 1 SRF 55V10S HC • High on-chip capacitance • up to 992 byte free user memory • Secure access my-d™ light − • ISO/IEC 15693 or SRF 55V01P ISO/IEC 18000-3 Mode 1 • 52 byte free user memory • Plain access my-d™ NFC − • ISO/IEC 14443 SLE 66R04P • up to 4072 byte free user SLE 66R16P memory (up to 2048 bytes SLE 66R32P NFC Memory) • Plain access my-d™ proximity 2 − • ISO/IEC 14443 SLE 66R04S • up to 4056 byte free user SLE 66R16S memory SLE 66R32S • Secure access Short Product Information 9 / 14 Application Factory Automation, Health Care, Ticketing, Access Control Ticketing, Brand Protection, Loyalty Schemes, Ski passes Ticketing, Brand protection, Loyalty Schemes, Access Control Ticketing, Brand protection, Loyalty Schemes, Access Control Libraries, Laundry, Factory Automation, Media Management, Event Ticketing, Leisure Park Access Smart Poster, Public Transport, Event Ticketing, Access Control, Consumer Goods information Access Control, Entertainment, Public Transport, Customer Loyalty Schemes, Micro Payment 2009-03-31 my-d™ vicinity SRF 55VxxP 3 my-d™ vicinity plain - SRF 55VxxP The my-d™ vicinity products are based on ISO/IEC 15693 or ISO/IEC 18000-3 Mode 1 standards for contactless vicinity cards. The my-d™ vicinity focuses on applications with memory demands of up to 10 kbit EEPROM. 3.1 Circuit Description The my-d™ vicinity is made up of an EEPROM memory unit, an analog interface for contactless energy and data transmission and a control unit. LA POWER Analog Contactless Interface CLOCK Memory Unit Operational Mode Power Circuit Antenna Rectifier Clock Extractor DATA Parallel Power On Reset Voltage Regulator Serial IO Command Anticollision LB Memory Access Control Unit Figure 3-1 Block diagram of the my-d™ vicinity Plain • Analog Contactless Interface – The Analog Contactless Interface comprises the voltage rectifier, voltage regulator and system clock to supply the IC with appropriate power. Additionally the data stream is modulated and demodulated. • Operational mode – The access to the memory depends on the actual configuration of the my-d™ vicinity. The memory is accessible after the VICC is selected. • Memory Unit – The Memory Unit consists of up to 1280 bytes of memory organized in up to 128 pages each of 8 user and 2 administration bytes. • Control Unit – The Control Unit decodes and executes all commands. Additionally the control unit is responsible for the correct anticollision flow. Short Product Information 10 / 14 2009-03-31 my-d™ vicinity SRF 55VxxP 3.2 Memory Access Organization: Using ISO optional commands the memory is accessed in 4 byte blocks, whereas ISO custom commands support 8 byte page accesses and further my-d™ vicinity commands. Write protection is possible for each page respectively each block. Security: The memory can be accessed (e.g. read, write) without security (i.e. authentication) in plain mode. Commands: my-d™ vicinity supports according to ISO/IEC 15693 – Mandatory commands (Inventory, Stay Quiet) – Optional commands (e.g. read / write 4 byte blocks) – Custom commands (e.g. read / write 8 byte pages) 3.3 Memory Principle The memory is organized in 3 areas: • User Area • Service Area • Administration Area ISO Optional command Memory Structure (4 byte / block) Addr. User Area 00h block (plain ) addressable memory Administration Area SI AC SI AC SI AC SI AC block (plain ) ISO Custom command Memory Structure (8 byte / page) Addr. User Area end page (plain) : : : SI page (plain) SI AC page (plain) SI AC SI AC : : : Administration Area AC block (plain ) block (plain ) block (plain ) end block (plain ) Service Area 00h Figure 3-2 Unique serial number (UID) Unique serial number (UID) my-d™ vicinity plain Memory Organization Short Product Information 11 / 14 2009-03-31 my-d™ vicinity SRF 55VxxP The User Area stores User Data in up to 125 pages. Data in the plain sector are accessible both via ISO optional and ISO custom commands. The Service Area stores the UID, manufacturer data and configuration data. This information is programmed at manufacture of the chip and cannot be changed. Data are accessible via ISO custom commands only, except the UID being available also via the Inventory command. The Administration Area stores 2 bytes of information about page administration (SI - Sector Index and AC - Access Condition). - Sector Index (SI) defines plain memory access - Access Condition (AC) holds information on access rights (e.g. read/write, read only) The Sector Index and Access Condition of each page store each bit non-inverted and inverted to ensure data integrity. Data are accessible via ISO custom commands only. 3.4 System Overview The system consists of a host system (i.e. computer with data base), one or more my-d™ vicinity plain or other ISO/IEC 15693 compliant cards and tags (VICC) and an ISO/IEC 15693 compatible contactless reader (VCD) with an antenna. Host System e.g. PC/SC USB for data exchange µC Analog Circuitry Data Antenna VICC Identification Terminal (VCD) (ISO/IEC 15693 Reader) Figure 3-3 SRF 55VxxP (HC) my-d™ vicinity Energy Clock my-d™ vicinity Plain RFID System Short Product Information 12 / 14 2009-03-31 my-d™ vicinity SRF 55VxxP 3.5 Product Versions ISO/IEC 15693 or ISO/IEC 18000-3 Mode 1 respectively define procedures to identify VICCs being in the reader field. The UID (Unique IDentification number) is used to perform the anticollision procedure identifying each VICC. Then a reader (VDC) is able to recognize the Infineon chip functionality based on the UID as described. 3.5.1 UID Coding To identify the different types of my-d™ vicinity contactless memories chip type information is coded into the UID according to the format defined in ISO/IEC 15693-3. The table below briefly describes the values for the different chip versions. Table 3-1 Type UID Coding Byte 7 Byte 6 ISO SRF 55V02P (HC) SRF 55V10P (HC) SRF 55V02S (HC) SRF 55V10S (HC) Byte 5 IC Mfg code E0H E0H E0H E0H Byte 4 ... Byte 0 IC manufacturer serial number Chip ID byte Unique number 40H 00H 50H 10H xxH xxH xxH xxH xxH xxH xxH xxH xxH xxH xxH xxH xxH xxH xxH xxH xxH xxH xxH xxH 05H 05H 05H 05H The 64 bit Unique Identification Number (UID) is stored in the Service Area in page 00H and programmed by the IC manufacturer. According to ISO/IEC 7816-6 the IC manufacturer Code (IC Mfg code) for Infineon is 05H. The UID is unique for each single IC within the ISO/IEC 15693 world and cannot be changed. 3.5.2 Memory Sizes my-d™ vicinity contactless memories are available with following memory sizes Table 3-2 Type Memory size of my-d™ vicinity (in bytes) Memory Total SRF 55V02P (HC) SRF 55V10P (HC) SRF 55V02S (HC) SRF 55V10S (HC) 320 1280 320 1280 Service Area1) 24 24 24 24 User Area (addressable memory) ISO optional ISO custom 224 992 224 992 232 1000 232 1000 1) Addressable only via ISO custom command Short Product Information 13 / 14 2009-03-31 14 www.infineon.com/rfid Published by Infineon Technologies AG