Data Sheet

BUK7675-100A
N-channel TrenchMOS standard level FET
Rev. 02 — 31 July 2009
Product data sheet
1. Product profile
1.1 General description
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic
package using TrenchMOS technology. This product has been designed and qualified to
the appropriate AEC standard for use in automotive critical applications.
1.2 Features and benefits
„ Low conduction losses due to low
on-state resistance
„ Suitable for standard level gate drive
sources
„ Q101 compliant
„ Suitable for thermally demanding
environments due to 175 °C rating
1.3 Applications
„ 12 V, 24 V and 42 V loads
„ Motors, lamps and solenoids
„ Automotive and general purpose
power switching
1.4 Quick reference data
Table 1.
Quick reference
Symbol Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage Tj ≥ 25 °C; Tj ≤ 175 °C
-
-
100
V
ID
drain current
VGS = 10 V; Tmb = 25 °C;
see Figure 1 and 3
-
-
23
A
Ptot
total power
dissipation
Tmb = 25 °C; see Figure 2
-
-
99
W
ID = 14 A; Vsup ≤ 100 V;
RGS = 50 Ω; VGS = 10 V;
Tj(init) = 25 °C; unclamped
-
-
100
mJ
VGS = 10 V; ID = 13 A;
Tj = 175 °C; see Figure 12
and 13
-
-
187
mΩ
VGS = 10 V; ID = 13 A;
Tj = 25 °C; see Figure 12
and 13
-
64
75
mΩ
Avalanche ruggedness
EDS(AL)S non-repetitive
drain-source
avalanche energy
Static characteristics
RDSon
drain-source
on-state resistance
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
2. Pinning information
Table 2.
Pinning information
Pin
Symbol
Description
Simplified outline
1
G
gate
2
D
drain
3
S
source
mb
D
mounting base; connected to
drain
Graphic symbol
D
mb
G
mbb076
S
2
1
3
SOT404
(D2PAK)
3. Ordering information
Table 3.
Ordering information
Type number
BUK7675-100A
Package
Name
Description
Version
D2PAK
plastic single-ended surface-mounted package (D2PAK); 3 leads (one
lead cropped)
SOT404
BUK7675-100A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 31 July 2009
2 of 13
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
Tj ≥ 25 °C; Tj ≤ 175 °C
-
100
V
VDGR
drain-gate voltage
RGS = 20 kΩ
VGS
gate-source voltage
ID
drain current
-
100
V
-20
20
V
Tmb = 25 °C; VGS = 10 V; see Figure 1 and 3
-
23
A
Tmb = 100 °C; VGS = 10 V; see Figure 1
-
16.2
A
IDM
peak drain current
Tmb = 25 °C; tp ≤ 10 µs; pulsed; see Figure 3
-
92
A
Ptot
total power dissipation
Tmb = 25 °C; see Figure 2
-
99
W
Tstg
storage temperature
-55
175
°C
Tj
junction temperature
-55
175
°C
-
100
mJ
Avalanche ruggedness
non-repetitive
ID = 14 A; Vsup ≤ 100 V; RGS = 50 Ω; VGS = 10 V;
drain-source avalanche Tj(init) = 25 °C; unclamped
energy
EDS(AL)S
Source-drain diode
IS
source current
Tmb = 25 °C
-
23
A
ISM
peak source current
tp ≤ 10 µs; pulsed; Tmb = 25 °C
-
92
A
03aa24
120
03na19
120
Ider
(%)
Pder
(%)
80
80
40
40
0
0
0
50
100
150
200
0
Fig 1.
Normalized continuous drain current as a
function of mounting base temperature
Fig 2.
100
150
200
Normalized total power dissipation as a
function of mounting base temperature
BUK7675-100A_2
Product data sheet
50
Tmb (°C)
Tmb (°C)
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 31 July 2009
3 of 13
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
03nb34
103
δ=
P
ID
(A)
102
t
tp
RDSon = VDS/ID
tp
T
T
tp = 10 us
100 us
10
D.C.
1 ms
10 ms
100 ms
1
1
10
102
103
VDS (V)
Fig 3.
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
BUK7675-100A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 31 July 2009
4 of 13
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
5. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Rth(j-mb)
Rth(j-a)
Conditions
Min
Typ
Max
Unit
thermal resistance from see Figure 4
junction to mounting
base
-
-
1.5
K/W
thermal resistance from
junction to ambient
-
50
-
K/W
03nb35
10
Zth(j-mb)
(K/W)
1
δ = 0.5
0.2
0.1
10−1
δ=
P
0.05
tp
T
0.02
t
tp
10−2
10−6
T
Single Shot
10−5
10−4
10−3
10−2
10−1
1
tp (s)
Fig 4.
Transient thermal impedance from junction to mounting base as a function of pulse duration
BUK7675-100A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 31 July 2009
5 of 13
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
6. Characteristics
Table 6.
Symbol
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
V(BR)DSS
VGS(th)
IDSS
IGSS
RDSon
drain-source
breakdown voltage
ID = 0.25 A; VGS = 0 V; Tj = 25 °C
100
-
-
V
ID = 0.25 A; VGS = 0 V; Tj = -55 °C
89
-
-
V
gate-source threshold
voltage
ID = 1 mA; VDS = VGS; Tj = 175 °C;
see Figure 11
1
-
-
V
ID = 1 mA; VDS = VGS; Tj = -55 °C;
see Figure 11
-
-
4.4
V
ID = 1 mA; VDS = VGS; Tj = 25 °C;
see Figure 11
2
3
4
V
drain leakage current
gate leakage current
drain-source on-state
resistance
VDS = 100 V; VGS = 0 V; Tj = 175 °C
-
-
500
µA
VDS = 100 V; VGS = 0 V; Tj = 25 °C
-
0.05
10
µA
VDS = 0 V; VGS = 20 V; Tj = 25 °C
-
2
100
nA
VDS = 0 V; VGS = -20 V; Tj = 25 °C
-
2
100
nA
VGS = 10 V; ID = 13 A; Tj = 175 °C;
see Figure 12 and 13
-
-
187
mΩ
VGS = 10 V; ID = 13 A; Tj = 25 °C;
see Figure 12 and 13
-
64
75
mΩ
VGS = 0 V; VDS = 25 V; f = 1 MHz;
Tj = 25 °C; see Figure 15
-
907
1210
pF
-
127
150
pF
-
78
110
pF
-
8
-
ns
-
39
-
ns
-
26
-
ns
Dynamic characteristics
Ciss
input capacitance
Coss
output capacitance
Crss
reverse transfer
capacitance
td(on)
turn-on delay time
tr
rise time
td(off)
turn-off delay time
tf
fall time
LD
internal drain
inductance
LS
internal source
inductance
VDS = 30 V; RL = 2.2 Ω; VGS = 10 V;
RG(ext) = 5.6 Ω; Tj = 25 °C
-
24
-
ns
from drain lead 6 mm from package to
centre of die; Tj = 25 °C
-
4.5
-
nH
from upper edge of drain mounting base to
centre of die; Tj = 25 °C
-
2.5
-
nH
from source lead to source bond pad;
Tj = 25 °C
-
7.5
-
nH
Source-drain diode
VSD
source-drain voltage
IS = 25 A; VGS = 0 V; Tj = 25 °C;
see Figure 14
-
0.85
1.2
V
trr
reverse recovery time
-
64
-
ns
Qr
recovered charge
IS = 13 A; dIS/dt = -100 A/µs; VGS = -10 V;
VDS = 30 V; Tj = 25 °C
-
120
-
nC
BUK7675-100A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 31 July 2009
6 of 13
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
03nb31
60
ID
(A)
9
VGS (V) = 8
RDSon
(mΩ)
10
20
50
03nb30
90
85
7.5
80
40
6.5
75
30
70
65
20
5.5
60
10
55
4.5
0
0
Fig 5.
2
4
6
8
VDS (V)
50
10
Output characteristics: drain current as a
function of drain-source voltage; typical values
Fig 6.
03aa35
10−1
10−2
typ
10
15
VGS (V)
20
Drain-source on-state resistance as a function
of gate-source voltage; typical values
03nb28
20
ID
(A)
min
5
gfs
(S)
max
15
10−3
10
10−4
5
10−5
10−6
0
0
2
4
6
0
VGS (V)
Fig 7.
Sub-threshold drain current as a function of
gate-source voltage
Fig 8.
20
30
ID (A)
40
Forward transconductance as a function of
drain current; typical values
BUK7675-100A_2
Product data sheet
10
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 31 July 2009
7 of 13
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
ID
(A)
03nb29
35
03nb27
10
VGS
(V) 9
30
8
25
VDS = 14 V
7
VDS = 80 V
6
20
5
15
4
3
10
Tj = 175 °C
Tj = 25 °C
2
5
1
0
Fig 9.
0
2
4
6
VGS (V)
Transfer characteristics: drain current as a
function of gate-source voltage; typical values
03aa32
5
0
8
0
QG (nC)
max
30
Fig 10. Gate-source voltage as a function of turn-on
gate charge; typical values
03nb32
RDSon
(mΩ)
3
20
120
VGS(th)
(V)
4
10
VGS (V)= 5.5
6
6.5
7
8
10
100
typ
80
2
min
60
1
0
−60
40
0
60
120
180
0
Tj (°C)
Fig 11. Gate-source threshold voltage as a function of
junction temperature
20
30
40
ID (A)
50
Fig 12. Drain-source on-state resistance as a function
of drain current; typical values
BUK7675-100A_2
Product data sheet
10
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 31 July 2009
8 of 13
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
03aa29
3
03nb26
IS 45
(A)
40
a
35
2
30
25
20
1
15
10
Tj = 175 °C
Tj = 25 °C
5
0
-60
0
0
60
120
Tj (°C)
180
0.2
0.4
0.6
0.8
1.0
1.2
VSD (V)
Fig 14. Reverse diode current as a function of reverse
diode voltage; typical values
Fig 13. Normalized drain-source on-state resistance
factor as a function of junction temperature
2000
C
(pF) 1800
0.0
03nb33
Ciss
1600
1400
1200 Coss
1000
800 Crss
600
400
200
0
10−2
10−1
1
10
VDS(V)
102
Fig 15. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values
BUK7675-100A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 31 July 2009
9 of 13
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
7. Package outline
SOT404
Plastic single-ended surface-mounted package (D2PAK); 3 leads (one lead cropped)
A
A1
E
mounting
base
D1
D
HD
2
Lp
1
3
c
b
e
e
Q
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
b
c
D
max.
D1
E
e
Lp
HD
Q
mm
4.50
4.10
1.40
1.27
0.85
0.60
0.64
0.46
11
1.60
1.20
10.30
9.70
2.54
2.90
2.10
15.80
14.80
2.60
2.20
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
05-02-11
06-03-16
SOT404
Fig 16. Package outline SOT404 (D2PAK)
BUK7675-100A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 31 July 2009
10 of 13
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
8. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BUK7675-100A_2
20090731
Product data sheet
-
BUK7575_7675-100A-01
Modifications:
BUK7575_7675-100A-01
(9397 750 07623)
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Type number BUK7675-100A separated from data sheet BUK7575_7675-100A-01.
20001024
Product specification
-
BUK7675-100A_2
Product data sheet
-
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 31 July 2009
11 of 13
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
9. Legal information
9.1
Data sheet status
Document status [1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term 'short data sheet' is explained in section "Definitions".
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
9.3
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
TrenchMOS — is a trademark of NXP B.V.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BUK7675-100A_2
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 02 — 31 July 2009
12 of 13
BUK7675-100A
NXP Semiconductors
N-channel TrenchMOS standard level FET
11. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
9.1
9.2
9.3
9.4
10
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
Thermal characteristics . . . . . . . . . . . . . . . . . . .5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Contact information. . . . . . . . . . . . . . . . . . . . . .12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 31 July 2009
Document identifier: BUK7675-100A_2
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