Product Brief New OptiMOS revolutionizes Oring TM 40 A in 30 mm² footprint Features Best in class on-state resistance Excellent 5V gate drive performance RoHS compliant and halogen free Benefits With the new OptiMOSTM product family Infineon sets a new standard in power density and Energy Efficiency for discrete power MOSFETs. Ultra low RDS(ON) (0.9 mΩ) together with a wide package portfolio (D²PAK-7, CanPAK™*, SuperSO8, S3O8 ) gives the designer the possibility to meet today’s challenges in application design. The products are developed to meet the space requirements in board design as well as to give the maximum safe operating area. Power density can further be increased with the double side cooling product like the BSB009NE2LS which merges a very low RDS(ON) with the CanPAK™ package technology. With the new OptiMOSTM products Infineon has the best solution to: Save overall system costs by reducing the number of Oring devices needed Reduce power losses and increase Energy Efficiency Save space with smallest packages like CanPAK™ or S3O8 Minimize design effort due to the wide Safe Operating Area (SOA) Double side cooling Save overall system costs by reducing the number of MOSFETs used in the Oring stage Lowest power losses Smallest footprint and highest power density with S3O8 & CanPAK™ Easy to design-in Can be driven from 5V system rail Applications Oring-FET HOT-SWAP E-Fuse Performance on 2 layers board 70 µm each, no airflow D2PAK IPB009N03LS VOUT = 12V IOUT = 30A continuous Tpackage_MAX = 52°C SuperSO8 BSC010NE2LS VOUT = 12V IOUT = 30A continuous Tpackage_MAX = 80°C CanPAK™ BSB009N03LS VOUT = 12V IOUT = 20A continuous Tpackage_MAX = 70°C S308 BSZ018NE2LS VOUT = 12V IOUT = 20A continuous Tpackage_MAX = 90°C www.infineon.com/optimos * CanPAK™ uses DirectFET™ technology licensed from International Rectifier Corporation. DirectFET™ is a registered trademark of International Rectifier Corporation. Product Brief New OptiMOSTM revolutionizes Oring 30 A in 30 mm² footprint Package portfolio for Oring Four packages are recommended for the Oring application. The suitable choice depends on current and space requirements. D2PAK-7pin SuperSO8 CanPAK™ S3O8 footprint [mm²] 160 30 30 20 application current [A]* 40 40 40 25 *may require airflow Safe Operating Area (SOA) For the selection of the suitable product the engineer has to consult the SOA diagram. A wide SOA is advantageous (e.g.: IPB09N03LS) to reduce the risk of thermal runaway. 104 limited by on-state resistance High pulse current for not current limited start up 1 µs µ 103 ID [A] 10 µs Low resistance High continous current 100 µs 102 DC 1 ms 101 10 ms 10 ID=f(VDS); TC= 25°C; D=0 parameter: tp 0 100 10-1 VDS[V] 101 102 Product Portfolio OptiMOSTM 25/30V D2PAK >= 0.9 mΩ SuperSO8 IPB009N03LS BSC010NE2LS 1.6 - 2.0 mΩ BSC018NE2LS 2.1 - 2.5 mΩ BSC024NE2LS © 2011 Infineon Technologies AG. All Rights Reserved. Visit us: www.infineon.com Order Number: B152-H9577-X-X-7600-DB2011-0006 Date: 02 / 2011 S3O8 BSB008NE2LS; BSB009N03LS 1.0 - 1.5 mΩ Published by Infineon Technologies Austria AG 9500 Villach, Austria CanPAK™ BSB012NE2LX Attention please! The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/ or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). BSZ018NE2LS Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.