INTERSIL ISL87060DIK

ISL837030, ISL83740
®
Datasheet
FN8013.5
May 2002
Modem Reference
Designs
Features
• Programmable modulation
Both: QPSK, 8PSK, 16QAM, 32QAM
ISL83740 only: 64QAM, 128QAM
The ISL837030 and ISL83740 Broadband Wireless Modem
Reference Designs support a wide range of modulation
orders and symbol rates.*
• Flexible data rates
ISL83740: up to 238Mbps
ISL837030: up to 160Mbps
In both Reference Designs, sophisticated coding,
equalization, and symbol recovery techniques are employed,
resulting in robust wireless link performance.
• Programmable symbol rates
The ISL837030 and ISL83740 Reference Designs support
high-capacity digital microwave radios with data rates up to
238Mbps (ISL83740) and 160Mbps (ISL837030). They
provide a flexible, high performance, economical solution for
fixed wireless applications.
• Reed Solomon (RS) encoding/decoding
• Concatenated coding using RS and PTCM inner code
• FCC and ETSI spectral mask compliance
• Powerful equalization
* Differences between the ISL837030 and ISL83740 are marked in text as
needed. Also see Release Notes on page 25.
Includes
• Sample ISL87060MIK Modulator and ISL87060DIK
Demodulator Chip Sets for development and test.
Benefits
• Eliminates the need to develop custom ASICs
• Optimizes wireless link capacity and Bit Error Rate (BER)
performance
• Complete Manufacturing Documentation Package: Bill of
Materials, Schematics, PCBA Fabrication Files, including
Gerber Files.
• Enables rapid prototyping and compliance testing
• Test Documentation.
• Proven technology
• Embedded Monitor and Control Software provides
comprehensive setup and test capabilities. Accepts
commands in binary or ASCII format.
• Optional Evaluation Kit supports demo requirements,
performance evaluation, and lab testing
Optional Evaluation Kit
Modem Digital/Power Connector (P2)
The modem PCBA is mounted on an Evaluation Platform,
allowing the modem to be set up and tested in a standard lab
environment. Includes VHF and L-band IF Interfaces and a
sophisticated Graphical User Interface for Windows
operating systems. (ISL83700EVAL/ISL83740EVAL)
Data
ISL87060MIK
Modulator/
Encoder
Differential
Baseband
Outputs
LPF
DAC
Level
TrimDAC
ASYNC
Serial
Offset
Baseband
Loopback
Controller
Modem PCBA
FLASH
Data
ISL87060DIK
Demodulator/
Decoder
Decimating
Matched
Filter
ADC
LPF
Differential
Baseband
Inputs
FIGURE 1 Simplified Block Diagram
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
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ISL837030, ISL83740
CONTENTS
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . 3
Modulator Functions . . . . . . . . . . . . . . . . . . . . . . 5
1. ISL87060MIK Modulator ASSP . . . . . . . 5
2. Digital to Analog Converter (DAC) . . . . . 5
3. Low Pass Filter (LPF) . . . . . . . . . . . . . . 5
4. Rate Exchange . . . . . . . . . . . . . . . . . . . 5
Demodulator Functions . . . . . . . . . . . . . . . . . . . 5
1. Low Pass Filter (LPF) . . . . . . . . . . . . . . 5
2. ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. FPGA Decimating Filter . . . . . . . . . . . . . 5
4. ISL87060DIK Demodulator ASSP . . . . . 5
5. Baseband Loopback . . . . . . . . . . . . . . . 5
6. Automatic Gain Control (AGC) . . . . . . . . 6
The Controller . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Monitor and Control Software . . . . . . . . . . . . . . 6
Performance Specifications . . . . . . . . . . . . . . . . . . . . 7
Modem Parameters . . . . . . . . . . . . . . . . . . . . . . 7
Modulation, Inner Code Rates, and Ranges . . . 7
Modulator Performance Specifications . . . . . . . 8
Modulator Input Requirements . . . . . . . . . . . . . . 8
Modulator Output Electrical Specifications . . . . . 8
Demodulator Input Requirements . . . . . . . . . . . 9
Demodulator Input Electrical Specifications . . . . 9
Demodulator Performance Specifications . . . . 10
BER Performance (Typical) . . . . . . . . . . . . . . . 10
Controller Parameters . . . . . . . . . . . . . . . . . . . 11
Environmental & Physical Specifications . . . . . . . . . 12
Physical Interface Definition . . . . . . . . . . . . . . . . . . . 13
80-Pin Digital/Power Connector . . . . . . . . . . . . 14
Power Supply Signals . . . . . . . . . . . . . . . 15
M&C Port Signals . . . . . . . . . . . . . . . . . . . 15
Modulator Data Interface Signals . . . . . . . 15
Demodulator Data Interface Signals . . . . 16
Miscellaneous Signals . . . . . . . . . . . . . . . 17
Reserved . . . . . . . . . . . . . . . . . . . . . . . . . 17
8-Pin Baseband Connectors . . . . . . . . . . . . . . 18
Data Timing and Packet Definition . . . . . . . . . . . . . . 19
Modulator Data Input Timing . . . . . . . . . . . . . . 19
Modulator Packet Definition . . . . . . . . . . . . . . . 19
Demodulator Data Output Timing . . . . . . . . . . 20
Demodulator RS Data Packet Definition . . . . . 20
AGC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . 22
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Support
Related Documentation . . . . . . . . . . . . . . . . . . . . . . 25
Release Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Customer Support . . . . . . . . . . . . . . . . . . . . . . . . . . 25
LIST OF FIGURES
1. Simplified Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. Modem Printed Circuit Board Assembly (PCBA) . . . . . . . . . . . . 4
4. Acquisition/Tracking Range at Low Baud Rates . . . . . . . . . . . 10
5. Modem PCBA Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6. Digital/Power Connector Pin Configuration . . . . . . . . . . . . . . . 14
7. Modulator Connector Pin Configuration . . . . . . . . . . . . . . . . . . 18
8. Demodulator Connector Pin Configuration . . . . . . . . . . . . . . . 18
9. Modulator Data Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 19
10. Modulator Packet Definition . . . . . . . . . . . . . . . . . . . . . . . . . . 19
11. Demodulator Data Output Timing . . . . . . . . . . . . . . . . . . . . . 20
12. Demodulator Data Packet Definition . . . . . . . . . . . . . . . . . . . 20
13. AGC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
14. Modem PCBA Mechanical Dimensions (Top View) . . . . . . . . 22
15. Modulator Baseband Interface to ISL83740EVAL/ISL83700EVAL
Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
16. Unbalanced Demodulator Baseband Interface, Shorter Runs 24
17. Unbalanced Demodulator Baseband Interface, Longer Runs 24
Ordering Information
PART NUMBER
DESCRIPTION
ISL83740REF-CD
ISL83740 Reference Design (QPSK,
8PSK, 16QAM, 32QAM, 64QAM,
128QAM)
ISL837030REF-CD
ISL837030 Reference Design (QPSK,
8PSK, 16QAM, 32QAM)
ISL837030KIT-xxx
Kit versions supply sample chips in
lots of 24 to 120, in 24-unit increments.
Applies to either Reference Design.
ISL83740EVAL
ISL83740 Evaluation Kit (QPSK,
8PSK, 16QAM, 32QAM, 64QAM,
128QAM)
ISL83700EVAL
ISL837030 Evaluation Kit (QPSK,
8PSK, 16QAM, 32QAM)
ISL87060MIK
Modulator Chip
ISL87060DIK
Demodulator Chip
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
7585 Irvine Center Drive
Suite 100
Irvine, CA 92618
TEL: (949) 341-7000
FAX: (949) 341-7123
FN8013.5
Intersil Corporation
2401 Palm Bay Rd.
Palm Bay, FL 32905
TEL: (321) 724-7000
FAX: (321) 724-7946
2
EUROPE
Intersil Europe Sarl
Ave. William Graisse, 3
1006 Lausanne
Switzerland
TEL: +41 21 6140560
FAX: +41 21 6140579
ASIA
Intersil Corporation
Unit 1804 18/F Guangdong Water Building
83 Austin Road
TST, Kowloon Hong Kong
TEL: +852 2723 6339
FAX: +852 2730 1433
ISL837030, ISL83740
Functional Description
.
The modem PCBA architecture implements a complete
baseband transmit and receive function:
Intersil’s broadband wireless modem devices are fully
integrated and support a wide range of modulation
orders and symbol rates. Sophisticated coding,
equalization, and symbol recovery techniques are
employed to enable robust wireless link performance.
1. Modulator Function
Converts byte-wide parallel data, encodes and digitizes
it, and generates a differential baseband analog signal.
This signal can then be up-converted to any IF/RF
frequency the user requires.
The complete modem Printed Circuit Board Assemblies
(PCBAs) with standard hardware and software
interfaces enable equipment manufacturers to rapidly
integrate Intersil modem functionality into their system
products.
2. Demodulator Function
Accepts a differential analog baseband signal. Filters,
decodes, corrects, and converts it to byte-wide digital
data and clock.
The ISL837030 and ISL83740 Modem Reference
Designs provide a flexible, high performance,
economical solution for fixed wireless applications. The
modem design provides an off-the-shelf solution for
users interested in easily integrating a complete modem
into their products.
3. Controller
Incorporates everything necessary to control and monitor
the modem.
10
External Sync
ISL87060MIK
Modulator/
Encoder
Data Input
Byte Clock
2-1
Mux
10 200 Msps
DAC
Passive
LPF
10 200 Msps
DAC
Passive
LPF
Modulator Baseband
Connector
I Data
Q Data
10
2-1
Mux
+3.3V
+5V
Rate
Exchange Sample Clock
FPGA
-12V
Q Level/Bal
I Level/Bal
VCO
ASYNC Serial
Q Offset
Controller
FLASH
512k X 16
Digital AGC
Analog AGC
I Offset
TrimDAC
Baseband
Loopback
XO
AGC
DAC
Clock PLL
Modem PCBA
AGC
Packet Sync
8
10
ISL87060DIK
Demodulator/
Decoder
Data Output
Data Clock
I Data
10
Q Data
Data Flag
10
FPGA
Decimating
Matched
Filter
100 Msps
ADC
Passive
LPF
100 Msps
ADC
Passive
LPF
8
FIGURE 2 Functional Block Diagram
FN8013.5
3
Demodulator Baseband
Connector
Digital/Power Connector
+12V
ISL837030, ISL83740
Functional Description
D1
Controller
FPGA
D4
Rate
Exchange
D3
ISL87060DIK
Demodulator
FLASH
Memory
ISL87060MIK
Modulator
FPGA
Decimating
Matched
Filter
D5
D6
MUX
MUX
DAC
MUX
DAC
MUX
Trim
DAC
ADC
FIGURE 3 Modem Printed Circuit Board Assembly (PCBA)
LED INDICATORS
D1 Controller Status
D3 Modem Ready
D4 PLL Lock Detect
D5 Alarm IRQ
D6 Demod Lock
FN8013.5
4
LIGHT INDICATORS
Blinking indicates controller is functional. Solid off or on indicates not functional.
Light on indicates modem is ready to accept user commands. Equivalent to the
MODEM_RDY signal on the interface connector.
Light on indicates that the modulator rate exchange has successfully locked to
the interface input byte clock.
Light on signals active alarm condition. Equivalent to the IRQ signal on the
interface connector.
Light on indicates that the demodulator has successfully locked to the input
baseband signal.
ISL837030, ISL83740
Functional Description
Modulator Functions
Demodulator Functions
The modulator accepts byte-wide parallel data, encodes it,
digitizes it, and produces a balanced analog signal output.
This signal can then be up-converted to whatever RF/IF
frequency the application requires. It consists of four
functions:
The demodulator accepts differential analog baseband I and
Q signals, then filters, decodes, corrects, and converts them
to byte-wide digital data and clock. It consists of six functions:
1. ISL87060MIK Modulator ASSP
The modulator ASSP provides a digital representation of a
modulated analog signal. The chip accepts byte-wide TTL
data and applies:
• Energy Dispersal
• Reed-Solomon Forward Error Correction (FEC)
• Convolutional Interleaving
• Symbol Generation for various modulation formats with
or without Convolutional Coding
• Pulse Shaping
• Tuning
The digital output from the ASSP consists of eight 10-bit
ports, four for I and four for Q. Each port represents at least
one of four samples per symbol which requires multiplexing
before it is applied to the Digital to Analog Converter (DAC).
2. Digital to Analog Converter (DAC)
The DAC section muxes each of the four 10-bit ports and
converts them into an analog signal representation of the
digital values produced by the ASSP. The DAC samples at a
minimum of four samples per symbol based on the ASSP’s
Interpolator setting.
TrimDACs, controlled by the processor, provide fine
adjustment of the amplitude and DC offset of the I and Q
output signals. Two of the TrimDACs control the reference
voltage used by the output DACs, thereby adjusting the
output signal amplitude. The default setting corresponds to a
zero adjustment.
3. Low Pass Filter (LPF)
The analog signal from the DAC is then filtered to eliminate
undesired digitizing effects. The TrimDAC is used to control
the offset voltage of the output signal, allowing the user to
adjust the balance between the I and Q baseband output
signals for upconverter optimization.
4. Rate Exchange
The Rate Exchange function generates clocks by converting
the byte-wide interface clock to an ASSP processing clock. It
then provides the sample clocks to the DAC and Mux
sections. The relationship between the byte clock input and
the other clocks varies dramatically depending on the FEC
and Interpolator settings within the ASSP.
FN8013.5
5
1. Low Pass Filter (LPF)
The LPF eliminates any undesired baseband high frequency
artifacts caused by the down conversion process.
2. ADC
The Analog to Digital Converter (ADC) provides a digital
representation of the modulated baseband analog signal. It
provides eight bits of data for each of the I and Q channels.
3. FPGA Decimating Filter
A Field Programmable Gate Array (FPGA) based Decimating
Matched Filter is provided for additional filtering based on the
desired symbol rate. Multiple FPGA designs are required to
cover the full symbol range. They are stored in the
processor’s FLASH memory and loaded as required, based
on configuration parameters. The modem automatically
toggles between the FPGA designs depending on the baud
rate.
4. ISL87060DIK Demodulator ASSP
The demodulator ASSP accepts quantized baseband I and Q
signals and provides all necessary demodulation functions
including:
• Carrier and Symbol Acquisition and Tracking
• Adaptive Equalization
• Data Estimation
• Convolutional Deinterleaving
• Energy Dispersal Removal
• Decoding Functions, including Reed-Solomon
decoding
5. Baseband Loopback
The modulator baseband output can be configured to be
connected to the input of the demodulator. This allows insystem functional verification of the modem. The loop-back
circuit is implemented with a fully differential buffered/switch
circuit. When engaged, the loop-back signals are summed
with the normal I and Q input signals to the demodulator. This
configuration does not require that either the normal
modulator I/Q outputs or the normal demodulator I/Q inputs
be disconnected. Operation is transparent to the normal
loading on these interfaces.
The loop-back signals are summed with the
normal input signals. Therefore, when loopback
is enabled the system must be set to minimize
the signal input from the normal demodulator I/Q
input path.
ISL837030, ISL83740
Functional Description
Demodulator (Continued)
Monitor and Control Software
6. Automatic Gain Control (AGC)
The demodulator ASSP provides a parallel data word to be
used by the AGC to optimize the dynamic range of the input
signal to the demodulator. The ASSP averages the
magnitude of the input baseband signal, subtracts that from a
target value, and accumulates the results. The AGC value is
available in either serial digital or analog form. The AGC
value output is proportional to the amount by which the
incoming signal’s amplitude must be increased in order for its
level to reach the desired target. Therefore, an increase in
the AGC value indicates that the signal level at the input to
the AGC amplifier/attenuator has actually decreased. The
modem operates in two different AGC modes:
The modem PCBA is configured and monitored using
Intersil’s embedded Monitor and Control (M&C) software.
This software is used to set parameters such as:
• Open loop is used when there is no external AGC loop
implemented.
• Closed loop is used when the modem’s AGC features
are to be used.
For best performance, closed loop mode is suggested. This
automatically sets the demodulator input level to the optimum
value. The system default is open loop mode until any AGC
parameter is initialized from the host.
The Controller
The Controller is a highly integrated device used to eliminate
the complexities of interfacing with the Intersil ASSPs
directly. It incorporates everything necessary to control and
monitor the modem.
• modulation type
• code rate
• payload rate
• symbol rate
• output level/offset
• AGC control
• diagnostics
• self-test
• loopback
• alarms
• baseband loopback
• Alpha (pulse shape)
• statistics
•
•
•
•
BER
EVM
demodulator stress
phase & amplitude imbalance
• and more
For details, see the Programmer’s Reference AN9935.
The Controller’s processor takes high-level commands from
the user and determines what is required to configure and
monitor the ASSPs. This relieves the user from any real-time
interfacing and algorithm implementation issues.
The executable firmware is held in FLASH memory that is incircuit upgradeable. This allows the user to upgrade the code
or load in a new algorithm as required via the asynchronous
serial port (the Monitor and Control port).
FN8013.5
6
ISL837030, ISL83740
Performance Specifications
Modem Parameters
ITEM
DESCRIPTION
Symbol Rate Range
Payload Data Rate Range
3.0Mbaud to 42.514Mbaud
5.6Mbps to 238Mbps (ISL83740)
5.6Mbps to 160Mbps (ISL837030)
(255, 238) Internal Sync Mode only
(240, 223) External Sync Mode only
See Demodulator RS Data Packet Definition on
page 20.
18.75W Maximum
FEC disabled, RS FEC only, concatenated
convolutional inner code with RS outer code
Square Root Nyquist, programmable
α (0.15 to 0.35) in 0.05 steps
± 500kHz, programmable in 1kHz steps
Non-zero tuner offsets may not meet more stringent
mask requirements.
32-tap Root Raised Cosine
0.20 rolloff factor
Bandwidth tracks selected symbol rate
Outer Code (Reed Solomon)
Packet Size
Power Consumption
FEC Modes
Pulse Shape (Alpha)
Tx Carrier Tuning Range
Rx Digital Matched Filter
Modulation, Inner Code Rates, and Ranges
MODULATION
TYPE
INNER CODE
RATE1
PAYLOAD RATE
RANGE IN Mbps2
SYMBOL RATE
RANGE IN Mbaud
BINARY
ASCII
BINARY
QPSK
0
1
12
5.6000 to 79.3595
5.6000 to 79.3595
8PSK
1
1
12
8.4000 to 119.0392
8.4000 to 119.0392
16QAM
2
3/4
2
8.4000 to 119.0392
8.4000 to 119.0392
7/8
6
9.8000 to 138.8791
9.8000 to 138.8791
ASCII
32QAM
64QAM
128QAM
4
6
8
ISL83740
ISL837030
ISL83740
ISL837030
3.0000 to 42.5140
1
12
All Payload Rates:
11.2000 to 158.7189 11.2000 to 158.7189 3.0000 to 42.5140
4/5
3
11.2000 to 158.7189 11.2000 to 158.7189
9/10
8
12.6000 to 178.5588 12.6000 to 160.0000
3.0000 to 38.0953
3.0000 to 34.2857
1
12
14.0000 to 198.3987 14.0000 to 160.0000
5/6
4
14.0000 to 198.3987
11/12
9
15.4000 to 218.2385
1
12
16.8000 to 238.0784
5
16.8000 to 238.0784
6/7
N/A
N/A
1
A rate of 1 is equivalent to No Inner Code.
2Ranges valid for Internal Sync (RS 255, 238).
To avoid significant performance degradation, interleaving must be enabled when using
concatenated coding rates (any rate other than 1). See the mdLeaver command in the
Programmer’s Reference AN9935.
FN8013.5
7
ISL837030, ISL83740
Performance Specifications
Modulator Performance Specifications
ITEM
Baseband Amplitude Imbalance
DESCRIPTION
< 0.1dB after initial trim, over temperature and life
< 0.2dB typical without trim
Spectral flatness (relative to ideal RRC spectrum) +0.1dB, -0.5dB
Baseband Phase Imbalance
< 0.5°, over temperature and life
I/Q Average Group Delay Imbalance
0.3ns maximum
Residual Output Voltage Noise Floor (>100MHz) Less than -110dBmV/Hz rms differential
I/Q Anti-alias Filter Low Pass Response
3-pole, -3dB at 32.0MHz
I/Q AC Coupling High Pass Response
1-pole, -3dB at 75Hz
Tx Symbol Timing Jitter (1kHz to baud/2)
1.0° rms, referred to symbol period
Spurious Components (below 140MHz)
DAC Aliasing Component (15Mbaud to
17.5Mbaud, 29.75Mbaud to 35Mbaud)
-55dBc or better
DAC Aliasing Component (other baud rates) -65dBc or better
Miscellaneous Spurious Components
Spurious Outputs (above 140MHz)
Less than -80dBc
Modulator Input Requirements
ITEM
DESCRIPTION
Input Data Byte Clock Phase Noise
FBYTE
< (2.0 X F
BAUD
FBYTE
) rms, when integrated from 300Hz to 2
EVM and BER may be degraded if this parameter When integrated over an offset bandwidth of 500Hz to half the byte
is exceeded.
rate frequency, then scaled proportionally to the symbol rate
frequency.
Modulator Output Electrical Specifications
ITEM
Output Signal Type
DESCRIPTION
Fully balanced differential, AC Coupled
Baseband Output Level into recommended load1 Nominal: 1.9V p-p. Maximum: 2.2V p-p
Baseband Output Adjust/Resolution1
Programmable -4dB to +1.5dB, in approximately 0.04dB steps.
Baseband Offset Trim
Programmable ± 31mV in 0.244mV steps into 1.2kΩ load
at +2.5V bias (Offset adjustment of 0VDC to +5VDC through 95kΩ
connected to output). For details, see the Programmer’s Reference
AN9935.
Load Impedance (Required)
1.20kΩ ± 20%, < 20pF, each leg to ground
1
The modulator pulse shaping, interpolation, and Applicable Standards: FCC 47CFR 101.111; ETSI EN 300-197,
analog anti-alias filtering have been designed to 198, 430, and 431; ETSI EN 301-128.
meet the requirements of applicable FCC, IC,
ITU, and ETSI standard spectral masks.
1
FN8013.5
Output levels are not guaranteed when using the modulator tuner.
8
ISL837030, ISL83740
Performance Specifications
Demodulator Input Requirements
ITEM
Symbol Frequency Error
Spectral Slope Error
Average I/Q Group Delay
Imbalance
I/Q Group Delay Response
Flatness (p-p delay variation
across 3dB spectrum)
Carrier Leakage Component
Baseband Source Amplitude
Error
Baseband Source Phase
Imbalance
DESCRIPTION
± 200 ppm of symbol rate
Up to ± 2dB average tilt across passband
< 6% of symbol period, up to 40Mbaud
< 1.5ns for 40Mbaud to 42.5Mbaud
-30dBc or better for QPSK, 8PSK, 16QAM
-35dBc or better for 32QAM, 64QAM, 128QAM
(64QAM and 128QAM available in ISL83740 only)
< 1.0dB maximum
< 5° maximum
Demodulator Input Electrical Specifications
ITEM
Input Signal Type
Input Impedance
Baseband Input Level
Baseband Input Bias
Open Circuit Input Bias Voltage
Input Overload Level
FN8013.5
9
DESCRIPTION
Balanced differential, DC Coupled
Balanced: 1.00kΩ differential
Unbalanced: 1.00kΩ
In unbalanced mode, source impedances of both legs should be
approximately equal to avoid DC offset at the ADCs. Matched source
impedances of < 100Ω are recommended.
1.00V p-p for full scale at ADC
Current: Source outputs must sink 0.4mA for 0.00VDC input source,
each leg Offset: < 10µA
600mVDC (baseband loopback off)
Approximately 2.5V p-p
ISL837030, ISL83740
Performance Specifications
Demodulator Performance Specifications
ITEM
DESCRIPTION
± 400kHz
1
Rx Carrier Tracking Range
Rx Carrier Acquisition Range1
Programmable from 50kHz to 400kHz in increments of 1kHz. For
details, see the Programmer’s Reference AN9935.
1The maximum Acquisition and Tracking Rate Range is less than 400kHz when the baud rate is less than
6.6Mbaud, as shown in FIGURE 4.
450
Max rxAcqRange (kHz)
400
350
300
250
200
150
100
3
4
5
6
Symbol Rate (MBaud)
7
8
FIGURE 4 Acquisition/Tracking Range at Low Baud Rates
BER Performance (Typical)
PARAMETERS
BER
1.0E-8 BER
1.0E-10 BER
64QAM and
128QAM available
in ISL83740 only.
MODULATION
TYPE
CONDITIONS
1
8.1dB
8PSK,
1
11.6dB
16QAM
1
12.2dB
32QAM
1
14.8dB
64QAM
1
18.7dB
16QAM
3/4
7.8dB
7/8
9.0dB
4/5
9.7dB
9/10
11.4dB
5/6
12.7dB
11/12
15.0dB
128QAM
6/7
17.2dB
32QAM
1
BER < 1.0E-11 • Standard setup using low-cost VHF IF
interface loopback1
• No added noise
• Baseband loopback, no noise
0
64QAM
1 Performance
Eb/No
QPSK
32QAM
Residual BER,
FEC disabled
INNER
CODE RATE
• Standard setup using low-cost VHF IF
interface loopback1
is based on a standard setup using the Evaluation Platform’s VHF interface under typical operating
conditions at baud rates > 10Mbaud as defined in Demodulator Input Requirements on page 9. All loop
bandwidths are set by default to accommodate severe multipath distortions. Performance can be increased
significantly by adjusting loop bandwidths for a less severe environment. Performance is 0.5dB to 1dB better when
using the Evaluation Platform’s high performance L-band interface.
FN8013.5
10
ISL837030, ISL83740
Performance Specifications
Controller Parameters
ITEM
Monitor and Control (M&C) Port
FPGA Configuration Update
FN8013.5
DESCRIPTION
•
•
•
•
•
•
•
•
•
Application Code Update
•
•
•
•
Reset Time from Power Up
•
11
TTL Level UART, RXD, TXD only, no handshake
115.2kBaud
8 bits
No Parity
1 Stop Bit
Can be performed via M&C port
Independent of Application Code Update
Cannot be done during modem operation
On-board FLASH memory holds up to four Decimating
Matched Filter configurations
Can be performed via M&C port
Independent of FPGA Configuration Update
Cannot be done during modem operation
Boot-loader write protected to ensure unconditional
recovery.
8 seconds
ISL837030, ISL83740
Environmental & Physical Specifications
Reliability
MTBF 457,000 hours (52 years) per Bellcore Standard TR-332
Power Supply Requirements
VOLTAGE
CURRENT
+5VDC ± 5%
+3.3VDC ± 5%
-8.75VDC to -12VDC
+8.75VDC to +12VDC
100mA
5A
100mA
100mA
Temperature and Humidity Tolerances
ENVIRONMENT
OPERATING
Temperature
Humidity (non-condensing)
-40°C to 85°C
<95%
Operating humidity
tolerance can be
increased by
conformal coating.
STORAGE
-50°C to 150°C
99%
Board Size and Weight
(Excluding connectors)
Length and Width
Height on Top
Height on Bottom
Weight
6” X 6”
0.3” plus heatsink
0.11”
5 oz.
Demodulator ASSP Airflow Requirements
AAVID
HEATSINK
372024
3719241
372824
1Included
FN8013.5
12
HEATSINK
HEIGHT
1.100”
0.550”
0.230”
FOR 85°C OPERATION
(4.3°C/W REQUIRED)
≥ 125
≥ 265
≥ 400
FOR 70°C OPERATION
(6.1°C/W REQUIRED)
0
≥ 165
≥ 300
UNIT
linear feet
per minute
in ISL83740EVAL/ISL83700EVAL Evaluation Platform configurations.
ISL837030, ISL83740
Physical Interface Definition
The following figure highlights the board connectors:
BOTTOM VIEW
80-pin Connector
Pin 1
2
4
6
1
3
5
80
79
Actual Connector Pins
are on Bottom
8-Pin Modulator
Baseband Connector
2
4
6
8
1
3
5
7
8-Pin Demodulator
Baseband Connector
TOP VIEW
80-pin Connector
80
78
76
79
77
75
2
1
8-Pin Demodulator
Baseband Connector
8
6
4
2
8-Pin Modulator
Baseband Connector
Pin 1
FIGURE 5 Modem PCBA Connectors
FN8013.5
13
7
5
3
1
ISL837030, ISL83740
Physical Interface Definition
80-Pin Digital/Power Connector
Modem Connector Part #: Samtec TSW-140-07-T-D
Suggested Mating Connector: SAMTEC SSW-140-22-T-D
The following figure shows the pin configuration for the 80-pin digital/power connector. For additional
details, see the following pages.
DGROUND
DIN 1
DIN 3
DIN 5
DIN 7
DGROUND
MOD _PSYNC
reserved
reserved
RESET
RXD
DGROUND
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
MODEM_PRESENT 2
reserved
reserved
DGROUND
MODEM_RDY
+5VDC
DMD _DCLK
DGROUND
DMD _DFLAG
DOUT1
DOUT3
DOUT5
DOUT 7
DMD_DATAOK
reserved
AGROUND
+ANALOG_VDC
ANALOG_AGC
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
+3.3VDC
DIN 0
DIN 2
DIN 4
DIN 6
+3.3VDC
MOD_DCLK
reserved
reserved
IRQ
TXD
+3.3VDC
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
MODEM_PRESENT1
AGC _DATA
AGC _CLK
+3.3VDC
AGC _SYNC
DEMOD _LK
D GROUND
+3.3VDC
DMD_PSYNC
DOUT0
DOUT2
DOUT4
DOUT6
D GROUND
reserved
AGROUND
-ANALOG_VDC
reserved
FIGURE 6 Digital/Power Connector Pin Configuration
FN8013.5
14
ISL837030, ISL83740
Physical Interface Definition
Power Supply Signals
PIN(S)
78
77
1
11
23
51
59
56
75
76
2
12
24
52
57
60
71
SIGNAL NAME
+ANALOG_VDC
-ANALOG_VDC
+3.3VDC
DESCRIPTION
CHARACTERISTIC
Positive Analog Voltage
Negative Analog Voltage
+8.75VDC to +12VDC
-8.75VDC to -12VDC
Digital Voltage
± 5%
+5VDC
AGROUND
Analog Ground
DGROUND
Digital Ground
M&C Port Signals
PIN(S)
SIGNAL NAME
DESCRIPTION
22
RXD
Status data from modem (output)
21
TXD
Control data to modem (input)
CHARACTERISTIC
TTL VOH = 2.4V minimum
VOL = 0.6V maximum
TTL VIH = 2.3V minimum
VIL = 0.8V maximum
Modulator Data Interface Signals
PIN(S)
FN8013.5
SIGNAL NAME
3
4
5
6
7
8
9
10
13
DIN0
DIN1
DIN2
DIN3
DIN4
DIN5
DIN6
DIN7
MOD_DCLK
14
MOD_PSYNC
15
DESCRIPTION
CHARACTERISTIC
Data input LSB
Data Input
TTL VIH = 2.3V minimum
VIL = 0.8V maximum
Data input MSB
Byte rate input clock. Data
sampled on rising edge.
When in external sync byte mode,
active high flag indicates sync
byte location in input transport
stream. When not used leave
open or tie low.
ISL837030, ISL83740
Physical Interface Definition
Demodulator Data Interface Signals
PIN(S)
FN8013.5
SIGNAL NAME
63
64
65
66
67
68
69
70
61
DOUT0
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
DOUT6
DOUT7
DMD_PSYNC
62
DMD_DFLAG
58
DMD_DCLK
72
DMD_DATAOK
80
ANALOG_AGC
49
AGC_CLK
53
AGC_SYNC
47
AGC_DATA
16
DESCRIPTION
CHARACTERISTIC
Data output LSB
Data Output
Data output MSB
Active high signal indicates sync
byte is available on bus.
Active high signal indicates valid
data is available on bus. Low
indicates Reed Solomon Parity or
sync byte is on bus.
Byte output clock. Data transitions
on falling edge. This clock is
ASSP Process Clock gated when
valid data is output from the
ASSP. Valid data includes sync
and parity bytes.
Active high signal indicates
presence of RS-correctable
packet. Indicates the current
output packet contains no errors.
A voltage representative of the
digital value calculated by the
ASSP. The ASSP averages the
magnitude of the input baseband
signal, subtracts that from a target
value, and accumulates the
results.
Serial clock output. Data
transitions on rising edge, should
be stored on the falling edge.
Active low signal used to bound
valid data out.
Serial data, 12 bits AGC, 4 bits
padding. Data transitions on rising
edge of AGC_CLK. See AGC
Timing on page 21.
TTL VOH ≥ 2.4V minimum
VOL ≤ 0.4V maximum
Range: 0VDC to 3.0VDC
Impedance: 100Ω
Current: ± 3mA maximum
Update Rate: approximately
every 2,000 symbols
TTL VOH ≥ 2.4V minimum
VOL ≤ 0.4V maximum
ISL837030, ISL83740
Physical Interface Definition
Miscellaneous Signals
PIN(S)
SIGNAL NAME
20
RESET
19
IRQ
55
DEMOD_LK
54
MODEM_RDY
45
OR
46
MODEM_PRESENT1
MODEM_PRESENT2
DESCRIPTION
Active low hard reset.
Resets processor and ASSPs to
their initial conditions. This signal
is extended by 350ms by a device
used to monitor VCC and the
state of the reset signal.
Active low interrupt request
indicates modem requires
attention.
When enabled this signal asserts,
indicating that a fault condition
exists on the modem.
Demodulator lock indicator.
low = lock
Active high indicates modem is
Ready.
Indicates modem is available after
power up or reset. Typical time is
less than 8 seconds after valid
3.3V or RESET.
4.7k pullup to 3.3V
Use either 45 or
46; do not tie
together.
Reserved
PIN(S)
15-18
25-44
48
50
73-74
79
FN8013.5
17
DESCRIPTION
Leave all unused pins
unconnected. Some are
used for test and some
are reserved for future
expansion.
CHARACTERISTIC
Open Drain
VIH ≥ 2.0V minimum
VIL ≤ 0.8V maximum
5k pullup to 3.3V on modem
TTL VOH ≥ 2.4V minimum
VOL ≤ 0.4V maximum
Can be used for modem presence
detect.
ISL837030, ISL83740
Physical Interface Definition
8-Pin Baseband Connectors
Modem Connector Part Number: Samtec TSW-104-07-T-D
Modulator Analog Baseband Connector
MOD IGND
MOD QGND
2
4
6
8
1
3
5
7
MOD I+
GND
MOD Q+
GND
FIGURE 7 Modulator Connector Pin Configuration
PIN(S)
1
2
5
6
3
4
7
8
SIGNAL NAME
MOD
MOD
MOD
MOD
GND
DESCRIPTION
CHARACTERISTIC
I Baseband Analog Output
I+
IQ+
Q-
Q Baseband Analog Output
1.9V p-p differential with
1.2kΩ, < 20pF load
Ground
Demodulator Analog Baseband Connector
DMD IGND
DMD QGND
2
4
6
8
1
3
5
7
DMD I+
GND
DMD Q+
GND
FIGURE 8 Demodulator Connector Pin Configuration
PIN(S)
1
2
5
6
3
4
7
8
FN8013.5
18
SIGNAL NAME
DMD
DMD
DMD
DMD
GND
I+
IQ+
Q-
DESCRIPTION
CHARACTERISTIC
I Baseband Analog Input
Q Baseband Analog Input
Ground
1.0V p-p nominal
1.0kΩ, < 25pF load
ISL837030, ISL83740
Data Timing and Packet Definition
Modulator Data Input Timing
Tscpw
Tscf
MOD_DCLK
Tddhld
Tddsu
FIGURE 9 Modulator Data Input Timing
SYMBOL
DESCRIPTION
MIN
Tscf
Shift_Clk Clock Period
50.0
Tscpw
Shift_Clk Pulse Width
Tddsu
Data Setup Time
12.0
Tddhld
Data Hold Time
1.0
8.0
UNITS
nsec
Modulator Packet Definition
Reed Solomon Packet
DIN [7..0]
Sync Byte
(1)
Data
(223 bytes)
MOD_PSYNC
External Sync Byte Mode.1
FIGURE 10 Modulator Packet Definition
1
FN8013.5
When using Internal Sync Byte Mode, byte-wide data is input to the modulator at a constant rate defined by the
configured data rate. Reed Solomon packetization is transparent to the input interface.
19
ISL837030, ISL83740
Data Timing and Packet Definition
Demodulator Data Output Timing
Tper
Thpul
1
DMD_DCLK
Tdcf
DMD_PSYNC,
DMD_DFLAG,
DMD_DATAOK
Tdcd
DOUT[7..0]
1The DMD_DCLK is asynchronous to the output data rate and is a gated version of the demodulator’s process clock. Its
periodicity varies significantly based on Symbol Rate and Decimating Filter configurations. If a continuous output
clock is desired, the user must provide some form of “elastic buffer” external to the modem.
FIGURE 11 Demodulator Data Output Timing
SYMBOL
Tper
Thpul
Tdcf
Tdcd
DESCRIPTION
MIN
DMD_DCLK Clock Period
Note: Worst case, assumes consecutive
pulses are gated by the demodulator.
DMD_DCLK High Width
Delay Clock to DMD_DFLAG, DMD_PSYNC
Delay Clock to DOUT
11.76
MAX
UNITS
N/A
nsec
3.7
-.05
N/A
2
Demodulator RS Data Packet Definition
DOUT[7..0]
Sync Byte
(1)
Payload Bytes
Reed Solomon
1
Parity
DMD_PSYNC
DMD_DFLAG
DMD_DATAOK
Valid Packet
1
Sixteen Reed Solomon parity bytes are output whether encoding is enabled or disabled.
FIGURE 12 Demodulator Data Packet Definition
Reed Solomon (RS) packet size is calculated as follows:
• RS Packet Size = 1 Sync Byte + Payload Bytes + 16 RS Parity Bytes
•
Sync byte: (external sync mode) supplied by the host connected to the transmitting modem, (internal sync
mode) supplied internally by the transmitting modem
•
Payload bytes: supplied by the host connected to the transmitting modem
•
RS parity bytes: supplied internally by the transmitting modem
• An RS packet length of 240 = 1 Sync Byte + 223 Payload Bytes + 16 RS Parity Bytes.
Supported by External Sync Mode only.
• An RS packet length of 255 = 1 Sync Byte + 238 Payload Bytes + 16 RS Parity Bytes.
Supported by Internal Sync Mode only.
FN8013.5
20
ISL837030, ISL83740
Data Timing and Packet Definition
AGC Timing
Tper
AGC_CLK
//
Tsdly
/
AGC_SYNC
//
Tddly
/
Tupdate
Tupdate
AGC_DATA
Ignore First 4 Clock Cycles
D11
(MSB)
D10
//
//
D1
D0
(LSB)
FIGURE 13 AGC Timing
SYMBOL
Tper
Tsdly
Tddly
Tupdate
FN8013.5
21
DESCRIPTION
AGC_CLK Clock Period, 50% ± 5% Duty Cycle
AGC_SYNC delay from AGC_CLK
AGC_DATA delay from AGC_CLK
Delay between updates
MIN
MAX
200
N/A
0
5
0
10
3.2 Typical
UNITS
nsec
µs
ISL837030, ISL83740
Mechanical Drawings
Measurements are in inches.
.000 .125
.175
5.616
.858
.125 .000
SAMTEC P/N
TSW-140-07-T-D
2
.125 DIA.
NON-PLATED THRU HOLES
4 PLC'S
80
79
1
MODEM PCBA
SAMTEC P/N
TSW-104-07-T-D
2
8
1
7
1
7
5.741
5.741
8
3.308
2
2.008
5.335
5.616
FIGURE 14 Modem PCBA Mechanical Dimensions (Top View)
FN8013.5
22
ISL837030, ISL83740
Applications
Suggested Baseband Interfaces to the Modem
I DAC
0mA to 20mA
+
1.8mf
0.42VDC
124
0.1%
V bias
143
0.1%
I-input
124
0.1%
0mA to 20mA
-
+
143
0.1%
12k
0.42VDC
4x
2.43k*
1.8mF
2.2V p-p
max
12k
95k
1
2
3
4
5
6
7
8
-
Opt. TrimDACs
I level/bal
I offset
-Vr
Q offset
Q level/bal
AD8346
Direct U/C
V bias
Q-input
+
95k
Q DAC
12k
0mA to 20mA
+
0.42VDC
143
0.1%
2.2V p-p
max
-
143
0.1%
124
0.1%
-
4x
2.43k*
12k
124
0.1%
0mA to 20mA
1.8mf
0.42VDC
1.8mF
Modem PCBA
*Matched resistor networks recommended.
FIGURE 15 Modulator Baseband Interface to ISL83740EVAL/ISL83700EVAL Platform
This figure shows an IF interface to an L-band daughterboard (included with the Evaluation Platform).
FN8013.5
23
ISL837030, ISL83740
Applications
.
1.00k
Modem PCBA
270nH, 5%
1.00k
Direct Down Convert
Baseband Output Amplifiers
I Ch. ADC
AD8132
+
-
-
+
1.00k
49.9
56.2
15pF
5%
2x 3.9pF
85Msps
68pF
2%
270nH, 5%
49.9
1
2
3
4
5
6
7
8
I Data
+
56.2
I Ch.
1.05V p-p
-
1.30k
1.00V p-p
1.00k
49.9
Q Ch.
1.05V p-p
49.9
1.00k
270nH, 5%
1.00k
For Shorter Runs
Q Ch. ADC
AD8132
56.2
+
-
-
+
1.00k
15pF
5%
2x 3.9pF
-
1.30k
68pF
2%
85Msps
Q Data
+
56.2
270nH, 5%
1.00V p-p
1.00k
FIGURE 16 Unbalanced Demodulator Baseband Interface, Shorter Runs
1.00k
Modem PCBA
270nH, 5%
1.00k
Direct Down Convert
Baseband Output Amplifiers
I Ch.
+
-
-
+
1.00k
49.9
I Ch. ADC
AD8132
56.2
15pF
5%
2x 3.9pF
1
2
3
4
5
6
7
8
68pF
2%
56.2
270nH, 5%
2.00V p-p
-
1.30k
85Msps
I Data
+
1.00V p-p
1.00k
52.3
24.9
49.9
Q Ch.
2.00V p-p
52.3
1.00k
270nH, 5%
24.9
1.00K
For Longer Runs
AD8132
+
-
-
+
1.00K
1.30k
15pF
5%
2x 3.9pF
68pF
2%
56.2
270nH, 5%
1.00k
Q Ch. ADC
56.2
1.00V p-p
FIGURE 17 Unbalanced Demodulator Baseband Interface, Longer Runs
FN8013.5
24
85Msps
+
Q Data
ISL837030, ISL83740
Support
Note: In some cases, users may enter parameters outside of ranges listed in this document; however, only
listed ranges are supported.
Related Documentation
For a list and description of documentation included with Intersil CommLink Broadband products, see the
ReadMeFirst Application Note (AN9940).
Additional documentation, product information, and press releases may be posted on the Intersil web
page: www.intersil.com/design/commlink/broadbandmodem.asp.
Release Notes
ISL83740
Rev 5
The following is a change to the documentation to make it match the system.
Changed Binary modulation type for 128QAM to 8 (was 7). See Modulation, Inner
Code Rates, and Ranges on page 7.
ISL837030
and
ISL83740
Rev 4
Added support for ISL83740 functionality, higher data rates. See Modulation,
Inner Code Rates, and Ranges on page 7. Manual updated in other places where
rates are listed to show which rates apply to ISL83740 and ISL837030.
Changed Baseband Output Level into recommended load: Nominal 1.9V p-p (was
1.95V p-p), Maximum 2.2V p-p (was 2.45V p-p). Changed Baseband Output Adjust
Resolution: Programmable +1.5dB to -4dB (was +2dB to -4dB). See Modulator
Output Electrical Specifications on page 8, FIGURE 7 Modulator Connector
Pin Configuration on page 18 (configuration), and FIGURE 15 Modulator
Baseband Interface to ISL83740EVAL/ISL83700EVAL Platform on page 23.
Updated BER performance table to add new data rates/related information. See
BER Performance (Typical) on page 10.
Changed ANALOG_AGC current to be ± 3mA maximum (was ± 6mA maximum).
See ANALOG_AGC on page 16.
Added Acquisition and Tracking Range chart. See Demodulator Performance
Specifications on page 10.
A reference to baud rates being > 10Mbaud added to note under BER
performance. See BER Performance (Typical) on page 10.
Added support for mdleaver command (ISL83740 only). See Programmer’s
Reference AN9935.
ISL837030
Rev 3
Added Tupdate to AGC Timing Diagram. Changed Tper MIN to be 200 (was 100).
See AGC Timing on page 21.
Rev 2
Corrected Thpul minimum from 5.29 to 3.7. , page 20.
Updated Demodulator Airflow Requirements. Demodulator ASSP Airflow
Requirements on page 12.
Corrected MTBF. Reliability on page 12
Rev 1
Initial Release
Customer Support
Intersil CommLink Broadband creates reference designs and related products for broadband wireless
digital communications. If you have questions, comments, or suggestions concerning the product or this
manual, please contact Intersil Customer Support at www.intersil.com.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN8013.5
25