Datenblatt

Oven Controlled Crystal Oscillators
SXO-8000K SERIES
OCXO
± 0.01 to ± 0.05 ppm
(+3.3V FIXED MODELS) 14.3x9.4 mm
XTAL
Specifications
SXO-8000K*1
General part number
Frequency range
5.000 MHz to 40.000 MHz
±0.5 ppm max.
(VDD = +3.3V, Vcon = +1.65V, CL = 15 pF & 1 hour after warm-up time)
Initial frequency tolerance at +25゜
C ±2゜
C
CLK OSC
1.27 gm (wt.)
SXO-8000K
Frequency
Stability
9.4±0.3
6.5±0.2
VCXO
Absolute
Max. Ratings
1.0
#3
#6
#5
#4
6.4±0.1
#2
TCXO
Pin Connection Pin Connection
Output
Vcon
4
1
NC*
NC*
5
2
VDD
GND
6
3
(*) #2 & #5 : Pulled up internally and connected to #6 / +V DC.
Connect #2, #5 & #6 to outer NC’s.
SOLDERING PATTERN
3.0
OCXO
8.8
1.27
2.54
Temperature range
Aging (after 30 days) at +25゜
C ±2゜
C
Operating
Conditions
#1
AA2 / iii : ±10 ppb max. over -20゜
C to +70゜
C (referred to +25゜
C)
BB2 / iii : ±20 ppb max. over -20゜
C to +70゜
C (referred to +25゜
C)
CC2 / iii : ±30 ppb max. over -20゜
C to +70゜
C (referred to +25゜
C)
EE2 / iii : ±50 ppb max. over -20゜
C to +70゜
C (referred to +25゜
C)
BB2 / mll : ±20 ppb max. over -40゜
C to +85゜
C (referred to +25゜
C)
CC2 / mll : ±30 ppb max. over -40゜
C to +85゜
C (referred to +25゜
C)
EE2 / mll : ±50 ppb max. over -40゜
C to +85゜
C (referred to +25゜
C)
±10 ppb max. at VDD = +3.3V ±5% DC
±10 ppb max. at CL = 15 pF ±10%
±5 ppb max. per day
±500 ppb max. per year
C to +70゜
C (Standard)
-20゜
C to +85゜
C (W = Option)
-40゜
+3.3V DC ±5%
+1.65V DC ±1.65V
-0.6V to +4.0V DC
-0.6V to VDD +0.6V DC
C to +85゜
C
-55゜
600 mA (during warm-up)
200 mA (steady state at +25゜
C)
45% to 55% at 1/2 VDD level
4 ns max. (10% VDD to 90% VDD level)
Input voltage change
Output load change
14.3±0.3
2.54
OUTPUT WAVEFORM
Operating temperature
Supply voltage (VDD)
Control voltage (Vcon)
Supply voltage
Control voltage
Storage temperature
Input current (max.)
Output
(-40゜
C to +85゜
C)
Frequency
Adjustment
Frequency slope
Linearity
Symmetry
Rise and fall times
"0" Level
VOL : 10% VDD max.
"1" Level
Load
Voltage control
(+0.2V to +2.8V)
VOH : 90% VDD min.
15 pF max. (CMOS)
±5 ppm min.
Positive
5% max.
SSB phase noise
(at 19.200 MHz & +25゜
C)
10 Hz
100 Hz
1 kHz
10 kHz
-94 dBc / Hz, Typical -124 dBc / Hz, Typical -145 dBc / Hz, Typical -155 dBc / Hz, Typical
5 minutes to ±20 ppb of final frequency at +25゜
C
1 MΩ max.
±1 ppb max. (Allan variance Tau = 0.1 sec.)
+250゜
C ±10゜
C for 10 seconds
+170゜
C ±10゜
C for 1 to 2 minutes (preheating)
10.000, 12.800, 13.000, 16.384, 19.200, 20.000, 25.000, 26.000, 30.720,
38.400, 38.880, 40.000
Warm-up time
Vcon input impedance
Short-term frequency stability
Reflow condition
Standard frequencies (MHz)
( * 1 ) Fi nal par t n um ber to be as s i gned w i th pac k age ty pe, fr equenc y s tabi l i ty and fr equenc y.
e. g. S X O- 8000K -C C 2/i i i- 13.000M H z
4.0±0.1
SXO-8000K
L
∅
1.5 +
0
-0 .1
Metal
Reflow soldering (4 corners)
Terminal
Tungsten (metalized)
Terminal plating
RoHS
( * ) C leani ng i s not r ec ommended.
Gold / Nickel
(surface) / (under)
Compliant (Pb-free)
D
PCB
Sealing
C
Base
2.0±0.1
M
B
J
Lid
136
TAPE SPECIFICATIONS
1.75±0.1
Package
A
MCF
PACKAGE DATA
Item
CMOS
● CMOS OUTPUT
● PACKAGE SIZE 14.3x9.4 mm
Item
Actual size
14.3x9.4 mm
STANDARD SMD OCXO
STANDARD SPECIFICATIONS
SXO-8000K
5.08
5 to 40 MHz
F
A
B
C
D
F
J
L
M
ReelDia.
Qty/Reel
14.7
10
24.0
11.5
16
2.0
0.5
7.0
330
500pcs
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