Application Note AN 2011-03 V1.0 June 2011 AN2011-03 F3L020E07-F-P_EVAL Evaluation Driver Board for EconoPACKTM 4 3-Level Modules in NPC1-Topology with 1ED020I12-F gate driver IC IFAG IMM INP M AE Evaluation Driver Board for EconoPACKTM 4 3-Level Modules Application Note AN 2011-03 V1.0 June 2011 Edition 2011-06-01 Published by Infineon Technologies AG 59568 Warstein, Germany © Infineon Technologies AG 2011. All Rights Reserved. Attention please! THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. 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Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. AN 2011-03 Revision History: date (2011-06-01) , V1.0 Previous Version: none Subjects: none Author: Alain Siani (IFAG IMM INP M AE) We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: [[email protected]] 2 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules Application Note AN 2011-03 V1.0 June 2011 1 Introduction .................................................................................................................................................. 4 1.1 Part Number explanation ................................................................................................................... 5 2 Design features ............................................................................................................................................ 5 2.1 Key Data ............................................................................................................................................ 6 3 Pin assignments .......................................................................................................................................... 7 3.1 Mechanical dimensions ....................................................................................................................10 4 Functionality of the board ........................................................................................................................10 4.1 Power supply....................................................................................................................................10 4.2 Input stage .......................................................................................................................................11 4.3 Short circuit detection ......................................................................................................................12 4.4 Output stage.....................................................................................................................................12 5 Paralleling...................................................................................................................................................13 6 Temperature measurement ......................................................................................................................14 7 Schematics and Layouts ..........................................................................................................................16 7.1 Schematics.......................................................................................................................................16 7.2 Layouts .............................................................................................................................................18 8 Bill of Material of F3L020E07-F-P_EVAL .................................................................................................21 9 How to order the Evaluation Driver Board ..............................................................................................22 10 Literature ....................................................................................................................................................22 The board described is an evaluation board dedicated for laboratory environment only. It operates at high voltages. This board must be operated by qualified and skilled personnel familiar with all applicable safety standards. 3 Application Note AN 2011-03 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules V1.0 June 2011 1 Introduction TM The evaluation driver board F3L020E07-F-P_EVAL for 3-Level EconoPACK 4 modules as shown in Figure 1 was developed to support customers during their first steps designing applications with TM EconoPACK 4 3-Level modules. This evaluation board was designed in addition to the module adapter 1 board MA3L080E07_EVAL or could be a complementary part for an existing customer driver solution. For more details about the 3-Level topology, please refer to [1]. The board is available from Infineon in small quantities. The properties of this part are described in the datasheet chapter of this document, whereas the remaining paragraphs provide information intended to enable the customer to copy, modify and qualify the design for production, according to their own specific requirements. Environmental conditions were considered in the design of the F3L020E07-F-P _EVAL. Components qualified for a lead-free reflow soldering process were selected. The design was tested as described in this document but not qualified regarding manufacturing and operation over the whole operating temperature range or lifetime. The boards provided by Infineon are subjected to functional testing only. Due to their purpose evaluation boards are not subjected to the same procedures regarding Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD) as regular products. See Legal Disclaimer and Warnings for further restrictions on Infineon’s warranty and liability. Figure 1: Evaluation Driver Board F3L020E07-F-P_EVAL, adapter board and EconoPACK module as evaluation kit 1 TM Evaluation Adapter Board for 3-Level EconoPACK 4 AN2011-04 4 TM 4 3-Level Evaluation Driver Board for EconoPACKTM 4 3-Level Modules 1.1 Application Note AN 2011-03 V1.0 June 2011 Part Number explanation 2 Design features The following sections provide an overview of the board including main features, key data, pin assignments and mechanical dimensions. Figure 2: The Evaluation Driver Board F3L020E07-F-P_EVAL for EconoPACK TM 4 3-Level modules The driver board F3L020E07-F-P_EVAL as presented in Figure 2 offers four independent channels to drive IGBTs. It is based on Infineon’s 1ED020I12-F CoreLess Transformer driver IC. 5 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules Application Note AN 2011-03 V1.0 June 2011 The board operates as single module driver or as main driver for up to three IGBT modules in parallel configuration. The evaluation board is developed to operate in combination with the MA3L080E07_EVAL TM evaluation adapter board mounted in conjunction with a 3-Level EconoPACK 4 module. The F3L020E07-F-P_EVAL driver board provides: 2.1 - Functional isolation between logic and power side utilizing CoreLess Transformer technology. - Short circuit protection and Under Voltage Lock Out (UVLO) - Active clamping protection for the two IGBTs directly connected to the DC-bus bar. - Bipolar power supply of the driver’s secondary side with +15V/-8V - Isolated IGBT DCB temperature measurement - Positive or negative input logic with 5 V CMOS level for PWM, RDY and /FLT signals. Key Data General key data and characteristic values are given in Table 1. These are typical values, measured at an ambient temperature of Tamb = 25 °C. Table 1: Electrical Parameters Parameter VDD VEE IDD+ IEEULS ILOGIC IOUT tPDELAY VDESAT Top Description IGBT driver positive supply voltage each channel IGBT driver negative supply voltage each channel IGBT driver positive supply current each channel IGBT driver negative supply current each channel Logic power supply voltage Logic power supply current Maximum peak output current; each channel Propagation delay time Desaturation reference level Operating temperature Value 15 -8 5 4 +5 100 2 200 9 -40...+85 TM Unit V V mA mA V mA A ns V °C The EconoPACK 4 3-Level IGBT module has four series connected IGBTs. As a reference, Figure 3 presents the positions of the IGBTs with their designation used throughout this document. Figure 3: IGBT module with the designation of each IGBT 6 Application Note AN 2011-03 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules V1.0 June 2011 Figure 4 hints out the functional groups of the F3L020E07-F-P_EVAL evaluation board’s top side. 1: Connectors outer high side IGBT 2: Connectors inner high side IGBT 3: Connectors inner low side IGBT 4: Connectors outer low side IGBT 5: Power side outer high side IGBT 6: Power side inner high side IGBT 7: Power side inner low side IGBT 8: Power side outer low side IGBT 9: Logic connector 10: Power supply connector 11: Temperature measurements Figure 4: Functional groups of the F3L020E07-F-P_EVAL evaluation board’s top side Figure 5 illustrates the functional groups of the F3L020E07-F-P_EVAL evaluation board’s bottom side. 1: 2: 3: 4: Connector outer high side IGBT Connector inner high side IGBT Connector inner low side IGBT Connector outer low side IGBT Figure 5: Functional groups of the F3L020E07-F-P_EVAL evaluation board’s bottom side 3 Pin assignments All PWM, logic signals and voltage supplies have to be applied as listed in Tables 2 to 5. Table 2: Pin assignment of the connector X6 for the outer high side IGBT Pin name Pin function X6-1 X6-2 X6-3 X6-4 X6-5 DESAT1 OUT_T1 -8V_T1 GND_T1 +15V_T1 For paralleling, connectors X3, X4 and X5 for the outer high side IGBT share a common pin assignment with the connector X6. 7 Application Note AN 2011-03 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules V1.0 June 2011 Table 3: Pin assignment of the connector X10 for the inner high side IGBT Pin name X10-1 X10-2 X10-3 X10-4 X10-5 Pin function NC OUT_T2 -8V_T2 GND_T2 +15V_T2 For paralleling, connectors X7, X8 and X9 for the inner high side IGBT share a common pin assignment with the connector X10. Table 4: Pin assignment of the connector X14 for the inner low side IGBT Pin name X14-1 X14-2 X14-3 X14-4 X14-5 Pin function NC OUT_T3 -8V_T3 GND_T3 +15V_T3 For paralleling, connectors X11, X12 and X13 for the inner low side IGBT share a common pin assignment with the connector X14. Table 5: Pin assignment of the connector X19 for the outer low side IGBT Pin name X19-1 X19-2 X19-3 X19-4 X19-5 Pin function DESAT4 OUT_T4 -8V_T4 GND_T4 +15V_T4 For paralleling, connectors X16, X17 and X18 for the outer low side IGBT share a common pin assignment with the connector X19. 8 Application Note AN 2011-03 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules V1.0 June 2011 The connector pin assignment of X15 and X2 are listed in Table 6 and 7. Table 6: Pin assignment of the logic connector X15 Pin name Pin function X15-1 +5V X15-2 S_GND X15-3 /RST X15-4 /FLT_T1 X15-5 IN+_T1 X15-6 IN-_T1 X15-7 IN+_T2 X15-8 IN-_T2 X15-9 IN+_T3 X15-10 IN-_T3 X15-11 /FLT_T4 X15-12 IN+_T4 X15-13 IN-_T4 X15-14 TEMP Table 7: Pin assignment of the power supply connector X2 Pin name X2-1 X2-2 X2-3 X2-4 X2-5 X2-6 X2-7 X2-8 X2-9 X2-10 X2-11 X2-12 X2-13 X2-14 X2-15 X2-16 X2-17 X2-18 X2-19 X2-20 X2-21 X2-22 Pin function GND_T3 NC -8V_T3 +15V_T3 NC NC GND_T4 +15V_T4 -8V_T4 NC NC NC GND_T2 +15V_T2 -8V_T2 NC NC NC +15V_T1 -8V_T1 GND_T1 NC 9 Application Note AN 2011-03 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules 3.1 V1.0 June 2011 Mechanical dimensions The dimensions of the F3L020E07-F-P_EVAL Evaluation board are given in Figure 6. Figure 6: Mechanical dimensions of the F3L020E07-F-P_EVAL 4 Functionality of the board The F3L020E07-F-P_EVAL driver board is a complementary part to the evaluation kit to drive one 3-Level 2 TM IGBT Module as displayed in Figure 7. The adapter board should be pressed to the EconoPACK 4. F3L020E07-F-P_EVAL MA3L080E07_EVAL F3L300R07PE4 Figure 7: Driver board, adapter board and IGBT module of the 3-level evaluation kit 4.1 Power supply Four external power supplies for the IGBT driver ICs and external booster stages are needed. These -8V/+15V power supplies are applied to the F3L020E07-F-P_EVAL board using connector X2. 2 Further assembly instructions of EconoPACK TM 4 can be found in AN2010-06 10 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules Application Note AN 2011-03 V1.0 June 2011 The logic side has to be powered with +5V via the connector X15, further pin assignments can be found in Table 6 and Table 7 on page 9. Figure 8: Principle diagram of the F3L020E07-F-P_ EVAL 3 The 1ED020I12-F IGBT driver IC monitors the supply voltage and activates the UVLO as soon as the supply voltage drops below the UVLO reference value. In order to assure a proper shutdown sequence of all IGBTs in case of an under-voltage of the driver ICs, it is important to turn off the outer high side and the outer low side IGBTs first. There are two high voltage blocking diodes D3 and D12 each in series with the according +15V power line of the outer high side and the outer low side IGBT drivers as can be seen in Figure 8. This generates an additional voltage drop so that the outer high side and the outer low side IGBT will be switched off first when their driver ICs detect an undervoltage. 4.2 Input stage The Evaluation Driver Board is designed for one leg of a 3-Level IGBT configuration; therefore it is necessary to apply four separate PWM signals dedicated to each IGBT. Schematic details for a single IGBT driver are depicted in Figure 9. Figure 9: Schematic details of the input stage for a single IGBT driver. 3 Infineon IGBT Gate Driver IC 1ED020I12-F 11 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules Application Note AN 2011-03 V1.0 June 2011 It is possible to choose positive or negative logic according to individual designs. For the use of IN+ as PWM input, the IN- pin needs to be connected to S_GND via RJ1- or it can be used as enable signal pin. For the use of IN- pin as PWM input, the IN+ pin needs to be connected to +5V via RJ1+ or it can be used as enable signal pin. 4 If the power supply voltage of the logic side exceeds the power-up voltage VUVLOL1 and the power supply 5 voltage of the high side exceeds the power-up voltage VUVLOH2 , green RDY LEDs shown in Figure 10 for IGBT1 to IGBT4 are turned on. 4.3 Short circuit detection Short circuit is monitored individually by the outer high side and outer low side driver channels. Each of the two channels provides an independent fault signal; they share a common reset input. Failure handling has to be part of the superordinated control. When a short circuit occurs, the voltage increase across the IGBT is detected by the desaturation protection of the 1ED020I12-F and the IGBT is turned off. The fault is reported to the primary side of the driver as a low active signal. A red LED /FLT_T1 or /FLT_T4 as presented in Figure 10 is turned on to signalize the failure condition. The fault status remains active as long as there is no reset signal applied to the driver. The /FLT signal is active low. Figure 10: Positions of the status Leds on F3L020E07-F-P_EVAL 4.4 Output stage The output stage of the F3L020E07-F-P_EVAL is prepared to be connected to the complementary TM MA3L080E07_EVAL evaluation module adapter directly plugged to the 3-level EconoPACK 4 module as shown in Figure 7 on page 10. The MA3L080E07_EVAL evaluation board consists of an active booster stage to provide the necessary switching power, demanded by the IGBT module. Figure 11: Schematic details of the output stage for a single IGBT driver 4 5 Under Voltage Lockout Low side of 1ED020I12-F Under Voltage Lockout High side of 1ED020I12-F 12 Application Note AN 2011-03 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules V1.0 June 2011 5 Paralleling The F3L020E07-F-P_EVAL was designed to work with the evaluation adapter board MA3L080E07_EVAL as single unit like depicted in Figure 7 on side 10 or to allow the parallel connection of up to three modules, each equipped with one MA3L080E07_EVAL adapter board as represented in Figure 12. In case of paralleling, the driver board doesn’t need to be plugged into the complementary adapter board. The connection from the driver to the adapter boards is done utilizing the connectors on the top side of the driver board as shown in Figure 13. Figure 12: Principle of parallel connection of three EconoPACK TM 4 IGBT modules Figure 13 displays a parallel connection of three 3-Level IGBT modules. In this case it is necessary to assure the same length of the gate cables between the driver and adapter boards to obtain the same run time of the gate signals for the three IGBTs. Star connection of the IGBTs reduces the cross flow in the Emitter lines after the switching sequence. The F3L020E07-F-P_EVAL driver board allows to switch up to three IGBTs in parallel. TM Figure 13: Three parallel connected EconoPACK 4 IGBT modules equipped with MA080E07_EVAL adapter boards driven by F3L020E07-F-P_EVAL driver board. 13 Application Note AN 2011-03 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules V1.0 June 2011 6 Temperature measurement TM Based on the NTC built into the EconoPACK 4, the driver board offers IGBT base plate temperature measurement in the range of -40 °C…150 °C. The circuit of the temperature measurement on the evaluation driver boards works with a Sigma/Delta converter. Thus a digital signal is provided featuring the advantage that digital signal processing can be used without particular hardware efforts and that the subsequent error is low. However an analog signal can be produced with the circuit shown in Figure 14. Figure 14: Schematic to convert the Σ/Δ data stream to analog voltage Table 8: Bill of Material Σ/Δ to analog converter Type Qty Capacitor 1 Capacitor Value / Package Part Name 100n/50V/X7R C0603 C1 1 1n/50V/C0G C0603 C2 Capacitor 1 10n/50V/X7R C0603 C3 Capacitor 1 100p/50V/C0G C0603 C4 Amplifier 1 AD8542ARZ SOIC08 IC1 Resistor 2 39k R0603 R1, R5 Resistor 2 100k R0603 R2, R6 Resistor 2 22k R0603 R3, R4 Resistor 1 10R R0603 R7 Device Recommended Manufacturer Analog Devices All electronic parts used in the design are lead-free and qualified for a 260 °C soldering profile. The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to ±5 % and for capacitors of the type X7R less or equal to ±10 %. 14 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules Application Note AN 2011-03 V1.0 June 2011 Using the base plate temperature and a thermal model, the junction temperature can be estimated. The complexity of the thermal model needed for this purpose depends on application and heat sink conditions as well as on requirements regarding accuracy and dynamic response. In case of a broken wire the output shuts down to 0 V. The relation between output voltage and base plate temperature is shown in Figure 15. Figure 15: Characteristics of the temperature measurement Note: This temperature measurement is not suitable for short circuit detection or short term overload, but may be used to protect the module from long term overload conditions or malfunction of the cooling system. 15 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules Application Note AN 2011-03 V1.0 June 2011 7 Schematics and Layouts To meet the individual customer requirements and make the evaluation driver board for the EconoPACK™ 4 module simple for development or modification, all necessary technical data like schematic, layout and components are included in this chapter. 7.1 Schematics Figure 16 depicts the driver circuit of the outer high side and the outer low side IGBT. Figure 16: Driver schematic of the outer high side and the outer low side IGBT Figure 17 illustrates the driver circuit of the inner high side and the inner low side IGBT. Figure 17: Driver schematic of the inner high side and the inner low side IGBT 16 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules Application Note AN 2011-03 V1.0 June 2011 Figure 18 shows the temperature measurement schematic with the modulator. Figure 18: Temperature measurement Figure 19 depicts the pin assignment of the power connector X2 and logic connector X15. Figure 19: Power connector X2 and Logic connector X15 Figure 20 details the pin assignment of the IGBT gate connectors. Figure 20: Gate signal connectors 17 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules 7.2 Application Note AN 2011-03 V1.0 June 2011 Layouts Figure 21: Components placed on the top side of the F3L020E07-F-P_EVAL Figure 22: Components placed on the bottom side of the F3L020E07-F-P_EVAL 18 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules Figure 23: F3L020E07-F-P_EVAL Top Layer Figure 24: F3L020E07-F-P_EVAL Bottom Layer 19 Application Note AN 2011-03 V1.0 June 2011 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules Figure 25: F3L020E07-F-P_EVAL Layer 2 Figure 26: F3L020E07-F-P_EVAL Layer 3 20 Application Note AN 2011-03 V1.0 June 2011 Application Note AN 2011-03 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules V1.0 June 2011 8 Bill of Material of F3L020E07-F-P_EVAL The bill of material includes a part list as well as assembly notes. The tolerances for resistors should be less or equal to ±1 %, for capacitors of the type C0G less or equal to ±5 % and for capacitors of the type X7R less or equal to ±10 %. Type Value Package QTY Name Part Resistor 0R0 R0603 9 RJ2-, RJ3+, RJ3-, RJ4+, Recommended Manufacturer R37, RJ1+, RJ1- RJ2+, - RJ4Resistor 39R R0805 2 R2, R24 Resistor 100R R0603 8 Resistor 270R R0603 1 R35 - Resistor 820R R0603 1 R32 - Resistor 1k R0805 4 R8, R15, R22, R30 - Resistor 1k2 R0603 1 R31 - Resistor 2k2 R0603 2 R33, R34 - Resistor 4k7 R0603 6 Resistor 4k7 R0805 3 Resistor 10k R0603 10 Resistor 39k R0603 1 R4, R5, R11, R12, R18, R19, R26, R27 R3, R9, R10, R16, R17, R25 R38, R39, R40 R1, R6, R7, R13, R14, R20, R21, R23, R28, R29 R36 - - C3, C4, C7, C8, C14, C15, Capacitor 4µ7/25V/X7R C1206 17 C18, C19, C25, C26, C29, C30 , C37, C38, C41, C42, Murata C54 Capacitor 1µ/25V/X7R C0805 2 C47, C48 Capacitor 100n/50V/X7R C0603 14 C23, C24, C28, C34, C36, Murata C2, C6, C12, C13, C17, Murata C40, C46, C49, C52 Capacitor 10n/50V/X7R C0603 3 C50, C51, C53 Murata Capacitor 100p/50V/C0G C0603 4 C11, C22, C33, C45 Murata Capacitor 220p/50V/C0G C0603 2 C1, C35 Murata Capacitor 470p/50V/X7R C0603 4 C10, C21, C32, C44 Murata Semiconductor BAT165 SOD323R 4 D1, D2, D10, D11 Infineon Semiconductor ES1D DO214AC 2 D3, D12 Vishay Semiconductor BC846 SOT23 4 T2, T3, T4, T6 - Semiconductor BC856 SOT23 4 T1, T5 - Semiconductor 1ED020I12-F P-DSO-16 4 U1, U3, U5, U7 Infineon 21 Application Note AN 2011-03 Evaluation Driver Board for EconoPACKTM 4 3-Level Modules V1.0 June 2011 Recommended Type Value / Type Package QTY Name Part Semiconductor ZMR500FTA SOT23 1 U9 Diodes Semiconductor AD7400YRWZ P-DSO-16 1 U10 - Semiconductor SN74LVC1G17DB SOT23-5 1 U11 - Semiconductor TLV431BIDCKT SC70-6L 1 IC1 - Semiconductor LEDCHIPLED_GREEN 0805 4 Semiconductor 0805 2 /FLT_T1, /FLT_T4 - 1 X15 TYCO / AMP LEDCHIPLED_RED TYCO / AMP Connector 1-1634688-4 RDY_T1, RDY_T2, RDY_T3, RDY_T4, Manufacturer - Connector MOLEX 22022025 4455-2 1 X1 Molex Connector MOLEX 43045-2216 MICROFIT 1 X2 Molex Connector MOLEX 22022055 4455-5 4 X6, X10, X14, X19 Molex Connector MOLEX 22232051 PITCH KK 12 X11, 12, X13, X16, X17, X3, X4, X5, X7, X8, X9, Molex X18 9 How to order the Evaluation Driver Board Every evaluation driver board has its own IFX order number and can be ordered via your Infineon sales partner. Information can also be found at the Infineon Web Page: www.infineon.com CAD-data for the board described here are available on request. The use of this data is subjected to the disclaimer given in this AN. Please contact: [email protected] IFX order number for F3L020E07-F-P_EVAL: 36294 IFX order number for MA3L080E07_EVAL: 36293 10 Literature [1] [2] [3] Zhang Xi, Uwe Jansen, Holger Rüthing: ‘IGBT power modules utilizing new 650V IGBT3 and Emitter Controlled Diode3 chips for 3-Level converter’ ISBN: 978-3-8007-3158-9 Proceedings PCIM Europe 2009 Conference Infineon Technologies, AN2009-10, ‘Using the NTC inside a power electronic module’, www.infineon.com TM Infineon Technologies, AN2011-04, ‘Evaluation Module Adapter Board for 3-Level EconoPACK 4’, www.infineon.com 22