Data Sheet

DISCRETE SEMICONDUCTORS
DATA SHEET
M3D088
PBSS4230T
30 V, 2 A
NPN low VCEsat (BISS) transistor
Product data sheet
2003 Sep 29
NXP Semiconductors
Product data sheet
30 V, 2 A
NPN low VCEsat (BISS) transistor
PBSS4230T
FEATURES
QUICK REFERENCE DATA
• Low collector-emitter saturation voltage VCEsat
SYMBOL
• High collector current capability IC and ICM
VCEO
collector-emitter voltage
30
V
IC
collector current (DC)
2
A
• Reduced printed-circuit board requirements
ICM
peak collector current
3
A
• Cost effective alternative to MOSFETs in specific
applications.
RCEsat
equivalent on-resistance
200
mΩ
• High efficiency leading to less heat generation
PARAMETER
MAX.
UNIT
PINNING
APPLICATIONS
PIN
• Power management
– DC/DC conversion
– Supply line switching
– Battery charger
DESCRIPTION
1
base
2
emitter
3
collector
– LCD backlighting.
• Peripheral driver
– Driver in low supply voltage applications (e.g. lamps
and LEDs)
handbook, halfpage
3
– Inductive load drivers (e.g. relays, buzzers and
motors).
3
1
DESCRIPTION
NPN BISS transistor in a SOT23 plastic package providing
ultra low VCEsat and RCEsat parameters.
PNP complement: PBSS5230T.
1
Top view
2
2
MAM255
MARKING
MARKING CODE(1)
TYPE NUMBER
PBSS4230T
Fig.1 Simplified outline (SOT23) and symbol.
*3D
Note
1. * = p: made in Hong Kong.
* = t: made in Malaysia.
* = W: made in China.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
PBSS4230T
2003 Sep 29
−
DESCRIPTION
plastic surface mounted package; 3 leads
2
VERSION
SOT23
NXP Semiconductors
Product data sheet
30 V, 2 A
NPN low VCEsat (BISS) transistor
PBSS4230T
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter
−
40
V
VCEO
collector-emitter voltage
open base
−
30
V
VEBO
emitter-base voltage
open collector
−
5
V
IC
collector current (DC)
−
2
A
ICM
peak collector current
−
3
A
IBM
peak base current
−
300
mA
Ptot
total power dissipation
Tamb ≤ 25 °C; note 1
−
300
mW
Tamb ≤ 25 °C; note 2
−
480
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Tamb
operating ambient temperature
−65
+150
°C
Notes
1. Device mounted on a FR4 printed-circuit board, single-sided copper, tinplated, standard footprint.
2. Device mounted on a FR4 printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
thermal resistance from junction to ambient
CONDITIONS
VALUE
UNIT
in free air; note 1
417
K/W
in free air; note 2
260
K/W
Notes
1. Device mounted on a FR4 printed-circuit board, single-sided copper, tinplated, standard footprint.
2. Device mounted on a FR4 printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2.
2003 Sep 29
3
NXP Semiconductors
Product data sheet
30 V, 2 A
NPN low VCEsat (BISS) transistor
PBSS4230T
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
collector-base cut-off current
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VCB = 30 V; IE = 0
−
−
100
nA
VCB = 30 V; IE = 0; Tj = 150 °C
−
−
50
μA
nA
IEBO
emitter-base cut-off current
VEB = 4 V; IC = 0
−
−
100
hFE
DC current gain
VCE = 2 V; IC = 100 mA
350
470
−
VCE = 2 V; IC = 500 mA
300
450
−
VCE = 2 V; IC = 1 A
300
420
−
VCE = 2 V; IC = 2 A
150
250
−
IC = 100 mA; IB = 1 mA
−
45
70
mV
IC = 500 mA; IB = 50 mA
−
70
100
mV
IC = 750 mA; IB = 15 mA
−
120
180
mV
IC = 1 A; IB = 50 mA; note 1
−
130
180
mV
IC = 2 A; IB = 200 mA; note 1
−
240
320
mV
VCEsat
collector-emitter saturation voltage
RCEsat
equivalent on-resistance
IC = 500 mA; IB = 50 mA; note 1
−
140
200
mΩ
VBEsat
base-emitter saturation voltage
IC = 2 A; IB = 200 mA; note 1
−
−
1.1
V
VBEon
base-emitter turn-on voltage
VCE = 2 V; IC = 100 mA
−
−
0.75
V
fT
transition frequency
IC = 100 mA; VCE = 10 V;
f = 100 MHz
100
230
−
MHz
Cc
collector capacitance
VCB = 10 V; IE = Ie = 0; f = 1 MHz
−
15
20
pF
Note
1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
2003 Sep 29
4
NXP Semiconductors
Product data sheet
30 V, 2 A
NPN low VCEsat (BISS) transistor
PBSS4230T
PACKAGE OUTLINE
Plastic surface mounted package; 3 leads
SOT23
D
E
B
A
X
HE
v M A
3
Q
A
A1
1
2
e1
bp
c
w M B
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.9
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45
0.15
0.55
0.45
0.2
0.1
OUTLINE
VERSION
SOT23
2003 Sep 29
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
99-09-13
TO-236AB
5
NXP Semiconductors
Product data sheet
30 V, 2 A
NPN low VCEsat (BISS) transistor
PBSS4230T
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
DISCLAIMERS
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2003 Sep 29
6
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were
made to the content, except for the legal definitions and disclaimers.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: [email protected]
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/01/pp7
Date of release: 2003 Sep 29
Document order number: 9397 750 11898