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xPico
Embedded Device Server
Integration Guide
Part Number 900-619
Revision I December 2014
Intellectual Property
© 2014 Lantronix, Inc. All rights reserved. No part of the contents of this book may be
transmitted or reproduced in any form or by any means without the written permission of
Lantronix.
Lantronix, xPico and DSTni are registered trademarks of Lantronix, Inc. in the United
States and other countries. DeviceInstaller is a trademark of Lantronix, Inc. U.S. Patents
7,309,260; 8,024,446; 8,219,661; 7,698,405. Additional patents pending.
Wi-Fi is a registered trademark of Wi-Fi Alliance Corporation. Ethertronics is a trademark
of Ethertronics, Inc. Wanshih is a trademark of Wanshih Electronic Co., Ltd. Exar is a
trademark of Exar Corporation. SEMTECH is a trademark of Semtech Corporation. All
other trademarks and trade names are the property of their respective holders.
Contacts
Lantronix, Inc.
167 Technology Drive
Irvine, CA 92618, USA
Toll Free: 800-526-8766
Phone: 949-453-3990
Fax:
949-453-3995
Technical Support
Online: www.lantronix.com/support
Sales Offices
For a current list of our domestic and international sales offices, go to the Lantronix web
site at www.lantronix.com/about/contact
Disclaimer
All information contained herein is provided “AS IS.” Lantronix undertakes no obligation
to update the information in this publication. Lantronix does not make, and specifically
disclaims, all warranties of any kind (express, implied or otherwise) regarding title, noninfringement, fitness, quality, accuracy, completeness, usefulness, suitability or
performance of the information provided herein. Lantronix shall have no liability
whatsoever to any user for any damages, losses and causes of action (whether in
contract or in tort or otherwise) in connection with the user’s access or usage of any of
the information or content contained herein. The information and specifications
contained in this document are subject to change without notice.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one of the following measures:
1. Reorient or relocate the receiving antenna.
2. Increase the separation between the equipment and receiver.
xPico® Embedded Device Server Integration Guide
2
3. Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
4. Consult the dealer or an experienced radio/TV technician for help.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
This device is intended only for OEM Integrators. The OEM integrator should be aware of
the following important issues.
Labeling of the End Product (xPico Wi-Fi units only)
The label on the end product incorporating the xPico Wi-Fi module must clearly state that
it contains an FCC-approved RF module. Canada and Japan also require a similar
statement.
For example, “This product contains RF transmitter ID # (put FCC, IC, and/or Japan
module grant numbers here).” The label must include the ID numbers for the regions
where the end product is installed. The grant numbers are below.

xPico Wi-Fi FCC ID number: R68XPICOW

xPico Wi-Fi IC ID number: 3867A-XPICOW

xPico Wi-Fi Japan ID numbers: 201-135275
RSS-GEN Sections 7.1.4 and 7.1.5 Statement for Devices with Detachable Antennas (xPico
Wi-Fi units only)
This device has been designed to operate with the antennas listed in the Certificate, and
having a maximum gain of 2.88 dBi. Antennas not included in this list or having a gain
greater than 2.88 dBi are strictly prohibited for use with this device, unless system level
FCC approval is gained. The required antenna impedance is 50 ohms.
To reduce potential radio interference to other users, the antenna type and its gain
should be so chosen that the equivalent isotropically radiated power (EIRP) is not more
than that required for successful communication.
Integration Notes (xPico Wi-Fi embedded device server):





This module is authorized under limited module approval specified to mobile host
equipment. So, the antenna must be installed such that 20cm is maintained between
the antenna and users.
The transmitter module may not be co-located with any other transmitter or antenna.
As long as the two conditions above are met, further transmitter testing will not be
required. However, the OEM integrator is still responsible for testing their end product
for any additional compliance requirements required with this module installed (for
example, digital device emission, PC peripheral requirements, etc.)
In the event that these conditions cannot be met (for example certain laptop
configurations, general purpose PCMCIA or similar cards, or co-location with another
transmitter) and obtaining a separate FCC authorization will be required, then the
FCC authorization is no longer considered valid and the FCC ID cannot be used on
the final product (including the transmitter).
Changes or modifications to this device not explicitly approved by Lantronix will void
the user's authority to operate this device.
Note: With the purchase of any xPico family product, the OEM agrees to an OEM
firmware license agreement that grants the OEM a non-exclusive, royalty-free
xPico® Embedded Device Server Integration Guide
3
firmware license to use and distribute the binary firmware image provided, only to the
extent necessary to use the xPico hardware. For further details, please see the xPico
OEM firmware license agreement.
Warranty
For details on the Lantronix warranty policy, please go to our Web site at
www.lantronix.com/support/warranty.
Revision History
Date
Rev.
Comments
April 2012
A
Initial release.
September 2012
B
Updated the reference schematic, mounting instructions and
compliance information.
January 2013
C
Updated xPico pin-out diagram.
July 2013
D
Updated to include xPico Wi-Fi part information.
August 2013
E
Updated to include Japanese certification number.
January 2014
F
Updated reference schematic information.
February 2014
G
Updated for firmware version 1.1.0.2R10.
June 2014
H
Updated Lantronix part number information.
December 2014
I
Updated for firmware version 1.3.0.1.
For the latest revision of this product document, please check our online documentation
at www.lantronix.com/support/documentation.
xPico® Embedded Device Server Integration Guide
4
Table of Contents
Intellectual Property __________________________________________________
Contacts ___________________________________________________________
Disclaimer __________________________________________________________
Warranty ___________________________________________________________
Revision History _____________________________________________________
List of Figures _______________________________________________________
List of Tables ________________________________________________________
1. Introduction
2
2
2
4
4
6
6
8
About the Integration Guide ____________________________________________ 8
Additional Documentation ______________________________________________ 8
2. Functional Description
xPico Features _____________________________________________________
xPico Wi-Fi Features _________________________________________________
xPico Block Diagram _________________________________________________
xPico Wi-Fi Block Diagram ____________________________________________
PCB Interface ______________________________________________________
Mating Connector ___________________________________________________
Antenna Interface (xPico Wi-Fi Units Only) _______________________________
Antenna Placement (xPico Wi-Fi Units Only) ______________________________
Ethernet Interface (xPico Wired Units Only) _______________________________
Serial Interface _____________________________________________________
USB Device Port (xPico Wi-Fi Units Only) ________________________________
LEDs _____________________________________________________________
General Purpose I/O Pins _____________________________________________
Reset Pins _________________________________________________________
Evaluation Board Schematics __________________________________________
3. Mounting Instructions and PCB Footprint
10
11
11
13
14
15
19
19
21
21
23
25
26
26
27
28
33
To Access CAD Files ________________________________________________ 33
To Install the xPico or xPico Wi-Fi Module ________________________________ 33
Product Information Label _____________________________________________ 37
4. Specifications
39
Electrical Specifications ______________________________________________ 39
Technical Specifications ______________________________________________ 41
A: Compliance (xPico Embedded Device Server)
44
B: Compliance (xPico Wi-Fi Embedded Device Server)
45
xPico® Embedded Device Server Integration Guide
5
List of Figures
Figure 2-1 xPico and xPico Wi-Fi Dimensions and Views ____________________ 12
Figure 2-2 xPico Block Diagram _______________________________________ 13
Figure 2-3 xPico Wi-Fi Block Diagram ___________________________________ 14
Figure 2-4 Reverse-SMA to U.FL(long) (Lantronix Part Number 500-180-R) _____ 20
Figure 2-5 U.FL to U.FL Cable (Lantronix Part Number 500-181-R) ____________ 20
Figure 2-6 Reverse-SMA to U.FL(short) (Lantronix Part Number 500-182-R) ____ 21
Figure 2-7 Ethernet Connection Example (xPico wired unit only) ______________ 23
Figure 2-8 Serial Port Example ________________________________________ 24
Figure 2-9 USB Device Interface Example (xPico Wi-Fi unit only) _____________ 25
Figure 2-10 Evaluation Board Schematic, Part 1 of 5 _______________________ 28
Figure 2-11 Evaluation Board Schematic, Part 2 of 5 _______________________ 29
Figure 2-12 Evaluation Board Schematic, Part 3 of 5 _______________________ 30
Figure 2-13 Evaluation Board Schematic, Part 4 of 5 _______________________ 31
Figure 2-14 Evaluation Board Schematic, Part 5 of 5 _______________________ 32
Figure 3-1 White Mounting Quick Clip Dimensions _________________________ 33
Figure 3-2 Aligning Mounting Clip Legs to Standoff Holes ___________________ 35
Figure 3-3 Mounting Instructions for PEM Standoff _________________________ 36
Figure 3-4 Hirose Connector Layout ____________________________________ 36
Figure 3-5 xPico Product Label ________________________________________ 37
Figure 3-6 xPico Wi-Fi Product Label ____________________________________ 38
List of Tables
Table 1-1 xPico and xPico Wi-Fi Features _________________________________ 8
Table 2-1 xPico Part Numbers _________________________________________ 10
Table 2-2 xPico and xPico Wi-Fi Pin Connections _________________________ 15
Table 2-3 xPico (wired) PCB Interface Signals ____________________________ 16
Table 2-4 xPico Wi-Fi PCB Interface Signals _____________________________ 17
Table 2-5 xPico Wi-Fi External Antenna Options __________________________ 19
Table 2-6 Ethernet Interface Signals ____________________________________ 21
Table 2-7 Recommended Magnetic Modules
and Combo RJ45/Magnetic Module Connectors ___________________________ 22
Table 2-8 xPico and xPico Wi-Fi Serial Port Signals ________________________ 23
Table 2-9 RS232 Connections (Serial Transceiver Required) ________________ 24
Table 2-10 RS422/485 Connections (Serial Transceiver Required) ____________ 24
Table 2-11 USB Host Port Signals______________________________________ 25
Table 2-12 xPico Wi-Fi Status LED Output Signals _________________________ 26
Table 2-13 xPico Status LED Output Signals _____________________________ 26
Table 2-14 Ethernet Interface xPico Serial Port Signals _____________________ 26
Table 2-15 xPico Reset Signals ________________________________________ 27
Table 4-1 Absolute Maximum Ratings ___________________________________ 39
xPico® Embedded Device Server Integration Guide
6
Table 4-2
Table 4-3
Table 4-4
Table 4-5
Table A-1
Table A-2
Table B-1
Table B-2
Table B-3
Table B-4
Table B-5
xPico Wired Recommended Operating Conditions _________________ 39
xPico Wi-Fi Recommended Operating Conditions _________________ 40
xPico Wired Technical Specification ____________________________ 41
xPico Wi-Fi Technical Specification _____________________________ 41
Electromagnetic Emissions ___________________________________ 44
Electromagnetic Immunity ____________________________________ 44
Country Certifications _______________________________________ 45
Country Transmitter IDs _____________________________________ 46
Safety ___________________________________________________ 46
Europe – EU Declaration of Conformity _________________________ 46
Approved Antenna(s) List ____________________________________ 51
xPico® Embedded Device Server Integration Guide
7
1. Introduction
About the Integration Guide
This user guide provides the information needed to integrate the Lantronix® xPico®
embedded device servers into customer-printed circuit boards. This manual is intended
for engineers responsible for integrating the xPico embedded device server into their
product.
Note: This document includes support for xPico embedded device server
versions XPC100100B-01, XPC100100S-01, XPC100100K-02, XPC10010MB-01
and XPC10010MS-01, and xPico Wi-Fi embedded device server versions
XPW100100B-01, XPW100100S-01 and XPW100100K-02. For integration
information for the Lantronix xPico Wi-Fi SMT embedded device server modules,
XPCW1002 and [email protected], please reference document 900-714 xPico Wi-Fi
SMT Embedded Device Server Integration Guide.
The sections in chapter 2 provide board schematic and layout recommendations for both
xPico (wired) and xPico Wi-Fi® products. Some of the sections apply to xPico (wired)
only or xPico Wi-Fi units only. Signals that are unused for a particular product can be left
floating. If the application has the potential to use both components as a stuff option it is
recommended to follow the design guide for all of the sections. The table below lists
which sections are applicable to the xPico (wired) and xPico Wi-Fi products.
Note: “xPico” (wired) refers to the Ethernet-only versions of xPico embedded
device server.
Table 1-1 xPico and xPico Wi-Fi Features
Chapter 2 Section
xPico (wired)
PCB Interface
Mating Connector
Antenna Interface
Antenna Placement
Ethernet Inteface
Serial Inteface
USB Device Port
LEDs
General Purpose IO Pins
Reset Pins
Reference Schematic
X
X
X
X
X
X
X
X
xPico Wi-Fi
X
X
X
X
X
X
X
X
X
X
Additional Documentation
Visit the Lantronix web site at www.lantronix.com/support/documentation for the latest
documentation and the following additional documentation.
Document
Description
xPico Wi-Fi SMT
Embedded Device Server
User Guide
Datasheet for the xPico Wi-Fi W1002 and W1003 SMT
modules.
xPico Embedded Device
Provides information needed to configure, use, and
xPico® Embedded Device Server Integration Guide
8
1: Introduction
Document
Server User Guide
Description
update the xPico firmware.
xPico Wi-Fi Embedded
Device Server User Guide
Provides information needed to configure, use, and
update the xPico Wi-Fi firmware.
xPico Embedded Device
Server Development Kit
Quick Start
Provides the steps for getting the xPico device server up
and running.
xPico Embedded Device
Server Development Kit
User Guide
Provides a detailed description of the xPico evaluation
kit hardware
APS: Modbus Protocol
User Guide
Provides detailed information for installing and operating
the IAP device server using our Modbus firmware.
DeviceInstaller™ User
Guide
Provides instructions for using the Windows® based
utility to configure the xPico and other Lantronix device
servers.
Com Port Redirector User
Guide
Provides information on using the Windows based utility
to create a virtual com port.
Notification Soldering
Profile and Washing
Provides guidance in developing a manufacturing
assembly process for various Lantronix embedded
products.
xPico® Embedded Device Server Integration Guide
9
2. Functional Description
Designed for quick integration with minimal engineering effort, the chip-sized xPico
embedded device server provides simplicity and flexibility making it the easiest and
fastest networking-enabling module on the market.
xPico and xPico Wi-Fi device servers are extremely compact networking solution that
enables Ethernet or Wireless connectivity on virtually any device with a serial interface.
The included industry-proven Lantronix device server application and full IP stack allow
seamless remote access to device data simplifying design integration while providing
robust connectivity.
As one of the smallest embedded device servers in the world, xPico and xPico Wi-Fi
embedded device servers can be utilized in designs typically intended for chip solutions.
A key difference with the xPico device server is that there is virtually no need to write a
single line of code, translating to a much lower development cost and faster time-tomarket.
Table 2-1 xPico Part Numbers
Part Number
Description
XPC100100B-01
xPico Device Server Module, Extended Temp, AES Encryption, Bulk, RoHS
XPC100100S-01
xPico Device Server Module, Extended Temp, AES Encryption, Sample,
RoHS
XPC100100K-02
xPico Device Server Module Development Kit w/ Module, RoHS
XPW100100B-01
xPico Wi-Fi — IEEE 802.11 b/g/n Device Server Module, Extended Temp,
Bulk, RoHS
XPW100100S-01
xPico Wi-Fi — IEEE 802.11 b/g/n Device Server Module, Extended Temp,
Sample, RoHS
XPW100100K-01
xPico Wi-Fi — IEEE 802.11 b/g/n Device Server Development Kit w/ Module,
RoHS
XPC10010MB-01
xPico IAP Device Server Module, Extended Temperature, Modbus, RoHS,
Bulk
XPC10010MS-01
xPico IAP Device Server Module, Extended Temperature, Modbus, RoHS,
Sample
xPico® Embedded Device Server Integration Guide
10
2: Functional Description
xPico Features
The xPico device server contains Lantronix’s own DSTni® EX controller, with 256 KBytes
of SRAM, 16 KBytes of boot ROM, and integrated 10/100 PHY.
The xPico embedded device server also contains the following:
 3.3-volt serial interface
 8 Configurable I/O pins
 All logic level I/O pins are 5V input tolerant
 4-Mbit flash memory
 Power supply filters
 Reset circuit
 +1.8V regulator
Note: The xPico embedded device server does not contain integrated Ethernet
magnetics. An external Ethernet magnetic module and RJ45 Jack is required to
interface to a standard 10/100Mbps Ethernet network.
The xPico unit requires +3.3-volt power and is designed to operate in an extended
temperature range (see technical data).
xPico Wi-Fi Features
The xPico Wi-Fi device server contains Cortex M3 ARM processor with 128KByte of
SRAM and 1MByte of embedded Flash memory. The unit also includes an 802.11 b/g/n
WLAN radio with a U.FL port for connection to an external antenna.
The xPico Wi-Fi embedded device server also contains the following:
 3.3-volt serial interface
 8 Configurable I/O pins
 All logic level I/O pins are 5V input tolerant
 8-Mbit flash memory (in addition to the 1MByte CPU embedded Flash)
 Power supply filters
 Reset circuit
Note: xPico Wi-Fi units do not contain an integrated antenna. An external
antenna is required for connection to a WLAN network.
The xPico Wi-Fi embedded device server requires +3.3-volt power and is designed to
operate in an extended temperature range (see technical data).
xPico® Embedded Device Server Integration Guide
11
2: Functional Description
Figure 2-1 xPico and xPico Wi-Fi Dimensions and Views
xPico® Embedded Device Server Integration Guide
12
2: Functional Description
xPico Block Diagram
The following drawing is a block diagram of the xPico embedded device server showing
the relationships of the components.
Figure 2-2 xPico Block Diagram
xPico® Embedded Device Server Integration Guide
13
2: Functional Description
xPico Wi-Fi Block Diagram
The following drawing is a block diagram of the xPico Wi-Fi embedded device server
showing the relationships of the components.
Figure 2-3 xPico Wi-Fi Block Diagram
40 Pin Connector
Interface
Cortex M3
Processor
DC Power
3.3V
3.3V
802.11 b/g/n
Chipset
U.FL to
external
antenna
Serial 1
To external
processor/
logic
GPIO/SPI
RESET/DEFAULTS
WAKE
8 Mb Serial
Flash
To external
LED
SYSTEM LED
To external
USB Device
USB
xPico® Embedded Device Server Integration Guide
14
2: Functional Description
PCB Interface
The xPico embedded device servers has a serial interface compatible with data rates up
to 921,600 bps (in high-performance mode). The serial signals (RX, TX, RTS, CTS, and all
CPs) are 3.3V CMOS logic level and 5V tolerant. The serial interface pins include +3.3V,
ground, and reset. The serial signals usually connect to an internal device, such as a
UART. For applications requiring an external cable running with RS-232 or RS422/485
voltage levels, the xPico device must interface to a serial transceiver chip. All
configurable I/O pins are 3.3V CMOS logic level and 5V input tolerant. The xPico unit
requires a mating connector. Customers should layout their PCB for Hirose part number
DF40C(2.0)-40DS-0.4V(51).
An external Ethernet magnetic module and RJ45 is required to interface the xPico
embedded device server to a standard 10/100Mbps Ethernet network.
An external antenna attached to the xPico Wi-Fi U.FL connector is required to connect to
an 802.11b/g/n wireless network.
Shown below is the xPico pin connection diagram highlighting the differences between
the xPico and xPico Wi-Fi embedded device server.
Table 2-2 xPico and xPico Wi-Fi Pin Connections
Pin#
xPico Wired
xPico Wi-Fi
1
GND
GND
3
CP8
5
Pin#
xPico Wired
xPico Wi-Fi
2
GND
GND
CP8/SPI_CS
4
LED1/LINK
LED1/WLAN_LED
RTS1
RTS1
6
LED0/SPEED
NC
7
RXD1
RXD1
8
LED2/ACTIVITY
NC
9
GND
GND
10
TXD1
TXD1
11
ETX-
NC
12
ETCT
NC
13
ETX+
NC
14
LED3/DUPLEX(OUT)
WKUP (IN)
15
GND
GND
16
CTS1
CTS1
17
ERX-
NC
18
ERCT
NC
19
ERX+
NC
20
SYS_LED
SYS_LED
21
GND
GND
22
Reserved
DDP
23
RXD2
RXD2
24
Reserved
DDM
25
TXD2
TXD2
26
CP2/INT
CP2/SPI_INT
27
CP7
CP7/SPI_SCK
28
CP3
CP3/MISO
29
+3.3V
+3.3V
30
CP4
CP4/MOSI
31
+3.3V
+3.3V
32
CP5
CP5
33
+3.3V
+3.3V
34
CP6
CP6
35
CP1
CP1
36
DEFAULT#(IN)
DEFAULT#(IN)
37
GND
GND
38
EXT_RESET#(IN)
EXT_RESET#(IN)
39
GND
GND
40
GND
GND
xPico® Embedded Device Server Integration Guide
15
2: Functional Description
Table 2-3 xPico (wired) PCB Interface Signals
Signal Name
xPico
Pin #
Primary Function
Reset
State
Internal
Pull-up
Driver
Strength
Active 56K
to 122K
4mA
GND
1
Signal Ground
GND
2
Signal Ground
CP8
3
Configurable I/O
Input
LED1/LINK
4
Ethernet Link LED, active low
Output
8mA
RTS1
5
Serial ready to send/ serial
transmit enable
Output
2mA
LED0/SPEED
6
Ethernet speed LED, active
low
Output
8mA
RXD1
7
Serial receive data input 1
Input
LED2/ACTIVITY
8
Ethernet Activity LED, active
low
Output
8mA
GND
9
Signal Ground
TXD1
10
Serial transmit data output 1
Output
2mA
TX-
11
Ethernet transmit differential
(neg)
Output
TCT
12
Ethernet transmit center tap
TX+
13
Ethernet transmit differential
(pos)
Output
LED3/DUPLEX
14
Ethernet Duplex LED, active
low
Output
GND
15
Signal Ground
CTS1
16
Serial Clear to Send
Input
RX-
17
Ethernet receive differential
(neg)
Input
RCT
18
Ethernet receive center tap
RX+
19
Ethernet receive differential
(pos)
Input
SYSTEM_LED
20
System status LED, active
high
Input
Active 56K
to 122K
GND
21
Signal Ground
Reserved
22
Reserved for future use. Do
not connect.
RXD2
23
Serial receive data input 2
Input
Active 56K
to 122K
Reserved
24
Reserved for future use. Do
not connect.
TXD2
25
Serial transmit data output 2
Output
CP2/INT
26
Configurable I/O-External
interrupt input
Input
xPico® Embedded Device Server Integration Guide
Active 56K
to 122K
8mA
Active 56K
to 122K
4mA
2mA
Active 56K
to 122K
4mA
16
2: Functional Description
Signal Name
xPico
Pin #
Primary Function
Reset
State
Internal
Pull-up
Driver
Strength
CP7
27
Configurable I/O
Input
Active 56K
to 122K
4mA
CP3
28
Configurable I/O
Input
Active 56K
to 122K
4mA
3V3
29
3.3V Input Power
CP4
30
Configurable I/O
Input
Active 56K
to 122K
4mA
3V3
31
3.3V Input Power
CP5
32
Configurable I/O
Input
10K
4mA
3V3
33
3.3V Input Power
CP6
34
Configurable I/O
Input
10K
4mA
CP1
35
Configurable I/O
Input
Active 56K
to 122K
4mA
DEFAULT#
36
Unit reset to default, active
low.
Drive low to reset unit to
default settings.
Input
Active 56K
to 122K
GND
37
Signal Ground
EXT_RESET#
38
Unit hardware reset, active
low. Drive low to reboot unit.
Input
10K
GND
39
Signal Ground
GND
40
Signal Ground
Table 2-4 xPico Wi-Fi PCB Interface Signals
Signal Name
GND
xPico
Pin #
Primary Function
Reset
State
Internal
Pull-up
/Pulldown
Driver
Strength
1
Signal Ground
2
Signal Ground
CP8/SPI_CS
3
Configurable I/O/ SPI Chip
Select
Input,
floating
30K to 50K
8mA
LED1/WLAN_LED
4
WLAN Link, active low
Input,
floating
30K to 50K
8mA
5
Serial ready to send/ serial
transmit enable
Input,
floating
30K to 50K
8mA
NC
6
No Connect
RXD1
7
Serial receive data input 1
Input,
floating
30K to 50K
NC
8
No Connect
GND
9
Signal Ground
TXD1
10
Serial transmit data output 1
Input,
30K to 50K
GND
1
RTS1
7
xPico® Embedded Device Server Integration Guide
8mA
17
2: Functional Description
Signal Name
xPico
Pin #
Primary Function
Reset
State
Internal
Pull-up
/Pulldown
Driver
Strength
floating
NC
11
No Connect
NC
12
No Connect
13
No Connect
14
System Wake Up on Rising
Edge
15
Signal Ground
16
Serial Clear to Send
NC
17
No Connect
NC
18
No Connect
NC
19
No Connect
SYSTEM_LED
20
System status LED, active
high
GND
NC
WKUP
4
GND
CTS1
7
Input,
floating
30K to 50K
Input,
floating
30K to 50K
Input,
floating
30K to 50K
Input,
floating
30K to 50K
8mA
21
Signal Ground
2
DDP
22
USB (positive)
RXD2
23
Serial receive data input 2
DDM
2
24
USB Negative
TXD2
25
Serial transmit data output 2
Input,
floating
30K to 50K
8mA
26
Configurable I/O-External
interrupt input
Input,
floating
30K to 50K
8mA
27
Configurable I/O/ SPI Clock
Input,
floating
30K to 50K
8mA
28
Configurable I/O/SPI Master
In-Slave Out
Input,
floating
30K to 50K
8mA
29
3.3V Input Power
30
Configurable I/O/ SPI Master
Out-Slave In
Input,
floating
30K to 50K
8mA
3V3
31
3.3V Input Power
CP5
32
Configurable I/O
Input,
floating
30K to 50K
8mA
3V3
33
3.3V Input Power
CP6
34
Configurable I/O
Input,
floating
30K to 50K
8mA
CP1
35
Configurable I/O
Input,
floating
30K to 50K
8mA
DEFAULT#
36
Unit reset to default, active
low.
Drive low to reset unit to
Input,
floating
30K to 50K
1
CP2/INT
1
CP7/SPI_SCK
1
CP3/MISO
3V3
CP4/MOSI
1
xPico® Embedded Device Server Integration Guide
18
2: Functional Description
Signal Name
xPico
Pin #
Primary Function
Reset
State
Internal
Pull-up
/Pulldown
Input
30K to 50K
Driver
Strength
default settings.
GND
37
Signal Ground
EXT_RESET#
38
Unit hardware reset, active
low. Drive low to reboot unit.
GND
39
Signal Ground
GND
40
Signal Ground
Note 1: The xPico Wi-Fi SPI interface supports master only. Slave mode operation will be supported in a future firmware release.
Note 2: The xPico Wi-Fi USB interface is USB 2.0 full speed device. The device interface connector and power interface must be designed into the
mating board.
Note 3: xPico and xPico Wi-Fi embedded device servers may be designed into the same socket. Signals listed as no connect on xPico Wi-Fi
embedded device server may be connected on an xPico base design board. For example, xPico Wi-Fi pins 11, 12, 13, 17, 18, and 19 may connect
to an Ethernet magnetic module as designed for xPico (wired), however, Ethernet will not be available on those pins for xPico Wi-Fi.
Note 4: Pin 14 is the Ethernet duplex LED output on xPico (wired) and the system wakeup input on xPico Wi-Fi. For board designs supporting both
xPico (wired) and xPico Wi-Fi, a zero ohm resistor or removable jumper stuff option should be used to disconnect any on-board logic driving pin 14
when xPico (wired) unit is installed.
Note 5: The CP pins can be configured as pull-up or pull-down. The WKUP pin is not configurable and is always pull-down.
Note 6: The IO pins on xPico Wi-Fi embedded device server are configured as floating-input on reset until configured by firmware. For applications
requiring a high signal on power up, an external pull-up may be required or removeable jumper.
Note 7: It is highly recommended to connect RTS and CTS for serial port 1.
Note: For integration information for Lantronix xPico Wi-Fi SMT embedded
device server modules, XPC W1002 and XPC W1003 please reference the 900714 xPico Wi-Fi SMT Integration Guide.
Mating Connector
The mating connector for the xPico and xPico Wi-Fi module is Hirose part number
DF40C (2.0)-40DS-0.4V (51). Special care must be taken when mating and unmating
the module to the mating connector. Refer to the Hirose DF40 data sheet below for
proper connector mating and unmating, along with the proper connector footprint.
Mating connector data sheet: http://www.hirose.co.jp/cataloge_hp/e68440018.pdf
Antenna Interface (xPico Wi-Fi Units Only)
The xPico Wi-Fi module has been certified using the external antennas listed below. Per
FCC guidelines, the xPico Wi-Fi certification remains valid if using an antenna of similar
type to the antennas below. If using an antenna of similar type to one of the antennas
below, but from a different manufacturer part number the antenna gain must be equal to
or less than specified in the table. Consult with your certification lab for more details.
Table 2-5 xPico Wi-Fi External Antenna Options
Antenna Type
Peak Gain
Typical
Lantronix Part
Number
Vendor
PCB Strip Antenna
with 50mm cable to
U.FL connector
With tape backing
1.5 to 2.5dBi, 2.39
Ghz to 2.49 Ghz
XPW100A003-01-B
(50 piece bulk pack)
Ethertronics®
xPico® Embedded Device Server Integration Guide
Vendor
Part
Number
1001077
19
2: Functional Description
Antenna Type
Peak Gain
Typical
PCB Strip Antenna
with 50mm cable to
U.FL connector
Without tape backing
Swivel type antenna,
with RP-SMA(M)
connector
1.5 to 2.5dBi, 2.39
Ghz to 2.49 Ghz
2 dBi, 2.4 Ghz to
2.5 Ghz, 2 dBi,
5.15 Ghz to 5.85
Ghz
Lantronix Part
Number
Vendor
Ethertronics
930-033-R-ACC
(50 piece bulk pack)
Wanshih
Vendor
Part
Number
1000668
WSS002
Note: The PCB strip antenna is available from Ethertronics, Inc. with or without
adhesive tape backing for mounting to a plastic case. For the component without
tape backing a non-conductive double sided adhesive tape can be used to fix the
antenna in place. The Ethertronics part numbers listed above come with a 50mm
U.FL cable attached to the PCB strip antenna. The 50mm cable length is the
minimum allowed cable length for use with the xPico Wi-Fi embedded device
server. For similar PCB strip antennas with longer cables consult with
Ethertronics, Inc. (www.ethertronics.com).
Lantronix provides a U.FL to Reverse SMA antenna cable in with the evaluation board
and sample kits for development work. These cables can be purchased from Lantronix
for production or supplied by an RF cable manufacturer. External antennas can be
purchased from the antenna vendor. Components for cable design should be selected
for low loss over the entire 2.4Ghz to 5.9Ghz signal range. The cable target impedence
should be 50 ohms.
Figure 2-4 Reverse-SMA to U.FL(long) (Lantronix Part Number 500-180-R)
Figure 2-5 U.FL to U.FL Cable (Lantronix Part Number 500-181-R)
xPico® Embedded Device Server Integration Guide
20
2: Functional Description
Figure 2-6 Reverse-SMA to U.FL(short) (Lantronix Part Number 500-182-R)
Antenna Placement (xPico Wi-Fi Units Only)
When designing the xPico Wi-Fi module to a mating board, it is important to consider the
final installation of the unit and its location with respect to connecting access points. The
antenna should be placed so that it has as clear as possible path to the connecting
access point for maximum range. Avoid placing the antenna such that it is blocked by
metal walls or ground planes of adjacent circuit boards.
Ethernet Interface (xPico Wired Units Only)
The xPico embedded device server integrates an internal 10/100Mbps Ethernet MAC and
PHY. An external magnetic module and RJ45 is required in order to connect to a
standard 10/100Mbps Ethernet network.
Table 2-6 Ethernet Interface Signals
Signal
Name
DIR
Contact
Primary Function
Signal Requirement
TX+
Out
13
Differential Ethernet
transmit data +
100 ohm differential with
TX-
TX-
Out
11
Differential Ethernet
transmit data -
100 ohm differential with
TX+
RX+
In
19
Differential Ethernet
receive data +
100 ohm differential with
RX-
RX-
In
17
Differential Ethernet
receive data -
100 ohm differential with
RX+
TCT
12
Ethernet transmit center
tap connection
Route > 20 mil width
RCT
18
Ethernet receive center tap
connection
Route > 20 mil width
The xPico embedded device server provides a 10/100 Mbps Ethernet interface for
connection to an external network through external magnetics and an external RJ45.
The table below lists several magnetic modules and combination RJ45/magnetic jacks
that can be used with the xPico unit.
xPico® Embedded Device Server Integration Guide
21
2: Functional Description
Table 2-7 Recommended Magnetic Modules
and Combo RJ45/Magnetic Module Connectors
Type
Manufacturer
Part Number
Magnetic only (requires RJ45)
BI-Tech
HS91-011-80LFTR
Magnetic only (requires RJ45)
Mingtek
HN0013SG
Combination RJ45/Magnetic
Belfuse
08B0-1D1T-06-F
Combination RJ45/Magnetic
Midcom
MIC2411D-0117T-LF3
Magnetic for POE
PULSE
HX2019
The Ethernet differential pair signals, ERX-/ERX+ and ETX-/ETX+ should be routed as
100-ohm differential pairs on a layer next to the signal ground plane. The use of vias on
these signals should be minimized. The center tap signal connections between the
magnetic and xPico (wired) module are required. Center tap signals RCT and TCT
should be routed with at least 20 mil trace thickness. The area between the magnetic
module and RJ45 jack, including the area under both, should be voided of all signals and
planes, except for the signals connecting to both. The signals connecting between the
RJ45 and magnetic are required to be isolated by 1500Vrms from all other signals and
planes, including chassis and signal ground. The connector shield should be connected
to chassis. It is recommended that 1206 resistor pads from chassis ground to signal
ground be placed next to each of the shield tabs. The resistor pads allow for 0 ohm
jumper, ferrite beads, or decoupling caps to be installed as needed for EMI/EMC
improvement.
The Ethernet LED signals should be routed to discrete LEDs or to the LED pins on the
RJ45 through 220 ohm or larger resistors. The LED signals are active low. The Ethernet
LED signals should be isolated from the signals that connect between the RJ45 and
magnetic module.
Also shown in the reference schematic is a recommended TVS array that can be used to
improve ESD and EFT in harsh environments. The device shown is Semtec
RCIamp0502A. This device features route through pin assignments allowing for the
Ethernet differential signal pairs to be routed without altering the trace impedance or
adding vias. Due to this routing, the device could be installed or depopulated as needed.
See the Lantronix app note, How to Connect a Lantronix Embedded Module to a
Wired Ethernet Port for more details on Ethernet connection and routing,
http://www.lantronix.com/pdf/appnotes/Connect-LTRX-Embed-Module-to-WiredEthernet_AN.pdf.
The xPico module can also be powered from POE using a POE magnetic and POE
powered device controller. Lantronix uses the Silabs, Si3402 POE controller to power
the xPico development board via POE. If using POE the Ethernet magnetic module
should be changed to a POE compatible module such as Pulse HX2019.
Refer to the evaluation board schematic in the xPico-DevKit_UG for an example circuit.
http://www.lantronix.com/pdf/xPico-DevKit_UG.pdf.
Refer to the SiLabs data sheet for Si3402 for more information on using the SiLabs POE
controller.
xPico® Embedded Device Server Integration Guide
22
2: Functional Description
Figure 2-7 Ethernet Connection Example (xPico wired unit only)
Serial Interface
The xPico and xPico Wi-Fi embedded device servers have two external serial interfaces.
The signal levels on the serial interface are 3.3V logic level with 5V tolerant inputs. The
serial interfaces require an external transceiver in order to connect to external RS232,
RS485, or RS422 networks. The signals of Serial Port 1 may be connected as shown in
the reference schematic, Figure 2-8 serial port example, below. The transceiver shown
in the reference schematic is of type Exar, part number SP336. This transceiver is a
multiprotocol RS232, RS485, RS422 transceiver. Single protocol transceivers may be
used as required. The xPico interface may also be directly connected to the UART
interface of an external CPU. Serial Port 2 is a three wire interface only. It operates like
Serial Port 1, except it does not support hardware Flow Control (i.e. no RTS/CTS) and
modem control (i.e. no DTR/DCD). It is highly recommended to connect RTS and CTS
for serial port 1.
Table 2-8 xPico and xPico Wi-Fi Serial Port Signals
Signal
TXD1
RTS1
Pin
Description
Reset State
10
Serial Transmit Data output
Output
5
Serial Ready-to-Send / Serial Transmit enable
Output
RXD1
7
Serial Receive Data input
Input
CTS1
16
Serial Clear-to-Send
Input
TXD2
25
Serial Transmit Data output 2
Output
RXD2
23
Serial Receive Data input 2
Input
xPico® Embedded Device Server Integration Guide
23
2: Functional Description
Figure 2-8 Serial Port Example
Table 2-9 RS232 Connections (Serial Transceiver Required)
xPico Signal
Signal
(Logic)
RXDx
TXDx
RTSx
CTSx
CPx
CPy
Description
Data In
Data Out
H/W Flow Control Output
H/W Flow Control Input
Modem Control Input
Modem Control Output
DCE Connector
DB9
DB25
Signal
DTE Connector
DB9
DB25
Signal
2
3
7
8
1
4
3
2
4
5
8
20
RXDx
TXDx
RTSx
CTSx
DCDx
DTRx
3
2
8
7
4
1
2
3
5
4
20
8
TXDx
RXDx
CTSx
RTSx
DTRx
DCDx
Table 2-10 RS422/485 Connections (Serial Transceiver Required)
xPico
Signal
(logic)
TXDx
TXDx
RXDx
RXDx
RTSx
CPx
CPy
Description
RS485
Signal
DB25 4
Wire
DB25 2
Wire
DB9 4
wire
DB9 2
wire
Data Out
Data Out
Data In
Data In
TX Enable
RS485 Select
RS485 2-wire
TX+485
TX-485
RX+485
RX-485
14
15
21
22
14
15
14
15
7
3
2
8
7
3
7
3
Note: The IO pins for xPico Wi-Fi embedded device server are set to floating
input on power up until configured by unit firmware. An external 100K ohm pullup may be required on the serial transmit signal to prevent downstream UART
devices from detecting false characters on initial power up.
xPico® Embedded Device Server Integration Guide
24
2: Functional Description
USB Device Port (xPico Wi-Fi Units Only)
The xPico Wi-Fi embedded device server has one USB2.0 Full Speed Device port
interfaces for connection to an upstream USB device. The port consists of a differential
pair, signals DDP and DDM. These signals should be routed as a 90 ohm differential pair
on a signal layer next to the signal ground plane. The use of vias should be minimized
on these signals. The USB signals can be connected to a USB Mini Type B USB port (as
shown in Table 2-12) directly to an IC with a USB host port. If connecting to an external
port that is user accessible it is recommended to add a TVS diode array to the signal nets
for ESD protection. The ESD array shown in the figure is of type Semtech
RCIamp0502A. This device features through pin routing to minimize trace impedance
changes and simplify routing. The footprint for the TVS array can be added to the PCB
and the part can be depopulated if it is not needed. It is recommended that the power
drawn off the USB Mini Type B connector be limited to less than 500mA per USB
requirements. If the USB device port is unused the DDP and DDM pins may be left
unconnected.
Table 2-11 USB Host Port Signals
Pin Name
Description
Connector
Pins
Signal
Requirement
Mini Type B
USB Device
connector pin
DDP
USB Device Port
Positive pin
22
Route as 90 ohm
differential pair with
DDM signal
3
DDM
USB Device Port
Negative pin
24
Route as 90 ohm
differential pair with
DDP signal
2
5V
5V power from USB
cable
Current limit to 500
mA per port
1
Ground
Signal Ground
Ground plane
5
Ground
Figure 2-9 USB Device Interface Example (xPico Wi-Fi unit only)
xPico® Embedded Device Server Integration Guide
25
2: Functional Description
LEDs
The xPico embedded device server contains several external signals that are intended to
drive external status LEDs. The LEDs are listed below. The signals may be connected
as shown in the reference schematic figure below.
Note: The System LED usually remains on. When the Default button is pressed
for 5-6 seconds, the System LED starts blinking every second to indicate the
default button can be released to complete resetting the unit to factory default.
The unit reboots after release of the Default button. A lit WLAN LED indicates
the STA interface is associated with an access point.
Table 2-12 xPico Wi-Fi Status LED Output Signals
Signal
Pin
Description
LED1/WI-FI LED
4
WI-FI Status LED, active low
SYSTEM_LED
20
System status LED, active high
Table 2-13 xPico Status LED Output Signals
Signal
Pin
Description
LED0/SPEED
6
Ethernet speed LED, active low
LED1/LINK
4
Ethernet Link LED, active low
LED2/ACTIVITY
8
Ethernet Activity LED, active low
LED3/DUPLEX
14
Ethernet Duplex LED, active low
SYSTEM_LED
20
System status LED, active high
General Purpose I/O Pins
xPico and xPico Wi-Fi unit contains eight pins which may be used as configurable inputs
or outputs. Listed below are the configurable I/O pins. These pins are 3.3V CMOS logic
level and 5V input tolerant.
Table 2-14 Ethernet Interface xPico Serial Port Signals
Signal
Pin
Description for xPico Wired
Description xPico Wi-Fi
Reset
State
CP1
35
Configurable I/O
Configurable I/O
Input
CP2/INT
26
Configurable I/O-External interrupt
input
Configurable I/O-SPI interrupt
input
Input
CP3
28
Configurable I/O
Configurable I/O-SPI MISO
Input
CP4
30
Configurable I/O
Configurable I/O-SPI MOSI
Input
CP5
32
Configurable I/O
Configurable I/O
Input
CP6
34
Configurable I/O
Configurable I/O
Input
CP7
27
Configurable I/O
Configurable I/O-SPI Clock
Input
CP8
3
Configurable I/O
Configurable I/O-SPI Chip Select
Input
Note 1. For xPico Wi-Fi 5V tolerant pins, in order to sustain a voltage higher than Vcc+0.3, the internal pull-up/ pull-down resistors must be disabled.
xPico® Embedded Device Server Integration Guide
26
2: Functional Description
Reset Pins
The xPico and xPico Wi-Fi embedded device servers have two signals for use as reset
signals. Signal EXT_RESET# is a hardware controlled input signal that will reboot the
xPico processor when asserted low. Signal DEFAULT# is polled by the xPico software.
When DEFAULT# is asserted low for six seconds, the unit will reset the system to the
default manufacturing settings and reboot the unit. xPico Wi-Fi embedded device server
has an additional signal on pin 14 that can be used to wake up the unit processor when
the unit is in a sleep or power down state.
Table 2-15 xPico Reset Signals
Signal
Pin
Description
Reset
State
Internal pull-up
EXT_RESET#
38
Unit hardware reset, active low. Assert
low for a minimum of 50 milliseconds,
then release to reboot unit. Signal may
be left floating.
Input
10K (xPico unit)
40K (xPico Wi-Fi
unit)
DEFAULT#
36
Unit reset to default, active low.
• For wired xPico units
Drive low and reboot the device to
reset unit to factory defaults.
• For xPico Wi-Fi units
While device is running, drive low for
greater than 6 seconds, then release
to reset unit to factory defaults. While
device is held in reset, drive low,
release reset to boot device with Line 1
CLI default settings (original
configuration is preserved), then
release after CLI session is
established.
Input
Active 56K to
122K (xPico unit)
40K (xPico Wi-Fi
unit)
WAKE (xPico
Wi-Fi unit only)
14
Toggle signal from low to high can wake
device from Sleep or Standby mode.
Hold low to allow device to enter Sleep
or Standby mode. Subject to
configuration settings.
Input
40K
xPico® Embedded Device Server Integration Guide
27
2: Functional Description
Evaluation Board Schematics
Figure 2-10 Evaluation Board Schematic, Part 1 of 5
xPico® Embedded Device Server Integration Guide
28
2: Functional Description
Figure 2-11 Evaluation Board Schematic, Part 2 of 5
xPico® Embedded Device Server Integration Guide
29
2: Functional Description
Figure 2-12 Evaluation Board Schematic, Part 3 of 5
xPico® Embedded Device Server Integration Guide
30
2: Functional Description
Figure 2-13 Evaluation Board Schematic, Part 4 of 5
xPico® Embedded Device Server Integration Guide
31
2: Functional Description
Figure 2-14 Evaluation Board Schematic, Part 5 of 5
xPico® Embedded Device Server Integration Guide
32
3: Mounting Instructions and PCB Footprint
3. Mounting Instructions and PCB Footprint
The xPico embedded device server dimensions and mounting instructions are shown in
the following drawings below. You may also directly access the CAD files through the
Lantronix website.
Note: The mounting instructions in this section are applicable to both the xPico
and the xPico Wi-Fi embedded device servers though the xPico pictures below
are used to demonstrate installation.
For temperature environments up to +85° Celsius, it is recommended that the
mating PCB have its outer layers flooded with signal ground and a heat pad be
placed between the module and mating PCB. The recommended heat pad is
Lantronix part number XPC100A002-01-B. The ground flooding and heat pad
are only required for xPico Wi-Fi units in environments above +70°C. For
environments below +70°C the heat pad and ground flooding are not required.
To Access CAD Files
1. Go to http://www.lantronix.com/products/cad-visio.html.
2. Click Download CAD files here to access the Registration Form.
Figure 3-1 White Mounting Quick Clip Dimensions
xPico® Embedded Device Server Integration Guide
33
3: Mounting Instructions and PCB Footprint
To Install the xPico or xPico Wi-Fi Module
In the xPico embedded device server development kit (part number XPC100100K-02)
and xPico Wi-Fi development kit (XPW100100K-01), the xPico module comes installed to
the xPico Evaluation Board via the connector J1 (Hirose component). If ordered
separately, you may need to install it by following the directions below. The included
white Mounting Quick Clip is used to align and fasten the module to the evaluation board.
Note: Refer to the Notification: Soldering Profile and Washing document
located at http://www.lantronix.com/support/downloads/. This document is
located under the xPico Wi-Fi product line.
1. Place the module into the white mounting clip, lining up the clip legs and the four
module grooves so that the module is seated inside the white clip. For xPico Wi-Fi
unit connect the RF cable to the module U.FL connector prior to installing the Quick
Clip.
White
Mounting Clip
xPico/xPico Wi-Fi
Module
2. Push the legs of the white clip inward to secure the module to the clip.
Module/Mounting
Clip Combination
3. Flip over the module/mounting clip combination so that the product label displays on
top and the white mounting clip legs are pointed downward.
4. For xPico Wi-Fi embedded device server high temperature operation, above +70C, it
is recommended to place a heat pad between the module and the adjacent PCB. The
recommended heat pad is Lantronix part number XPC100A002-01-B (available in a 50
piece bulk pack).
5. Place the module/mounting clip combination so that the four mounting clip legs align
with the four standoff holes on the board surrounding the J1 connector
(see Figure 3-2). Make sure to properly orientate the module/mounting clip
combination on the board, so that the J1 connector/Hirose component is properly
aligned.
xPico® Embedded Device Server Integration Guide
34
3: Mounting Instructions and PCB Footprint
Figure 3-2 Aligning Mounting Clip Legs to Standoff Holes
6. Insert the white clip legs furthest from the J1 connector first and gently push down on
the xPico module above the J1 connector. Keep the module as level as possible
during installation.
Note: When removing the xPico embedded device server from the evaluation
board, gently tug the module. Do not use excessive force or attempt to remove
the xPico module by grasping and pulling the module from the short end opposite
the module connector as this may cause damage to the J1 evaluation board
connector.
xPico® Embedded Device Server Integration Guide
35
3: Mounting Instructions and PCB Footprint
Figure 3-3 Mounting Instructions for PEM Standoff
xPico® Embedded Device Server Integration Guide
36
3: Mounting Instructions and PCB Footprint
Figure 3-4 Hirose Connector Layout
Product Information Label
The product information label contains important information about your specific unit,
such as its part number, revision, manufacturing date code, product model, country of
origin, datamatrix barcode and MAC address.
Figure 3-5 xPico Product Label
Part Number
Revision
MAC Address
Manufacturing
Date Code
Product Model
Country of Origin
xPico® Embedded Device Server Integration Guide
Lantronix
Datamatrix
Barcode
37
3: Mounting Instructions and PCB Footprint
Figure 3-6 xPico Wi-Fi Product Label
Revision Number
Canada Radio ID
Product Model
Part Number
Japan Certification Number
FCC Radio ID
Japan Radio Equipment Mark
Lantronix Datamatrix Barcode
Japan Telecommunication Mark
Manufacturing Date Code
Serial Number
xPico® Embedded Device Server Integration Guide
Country of Origin
38
4: Specifications
4. Specifications
Electrical Specifications
Caution: Stressing the device above the rating listed in this table may cause
permanent damage to the xPico embedded device server. Exposure to Absolute
Maximum Rating conditions for extended periods may affect the xPico unit’s
reliability. For xPico Wi-Fi operation above +70° Celsuis, it is recommended that a
heat pad be placed between the module and mating PCB.
Table 4-1 Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Units
Supply Voltage
VCC
0
3.6
Vdc
Operating Temperature
-40
85
°C
Storage Temperature
-40
85
°C
Table 4-2 xPico Wired Recommended Operating Conditions
Parameter
Symbol
Min
Typical
Max
Units
Supply Voltage
VCC
3.15
3.3
3.46
Vdc
Supply Voltage Ripples
VCC_PP
2
%
100 BaseTX Active (Normal CPU Speed)
10 BaseT Active (Normal CPU Speed)
No Link (Normal CPU Speed)
100 BaseTX Active (High CPU Speed)
10 BaseT Active (High CPU Speed)
No Link (High CPU Speed)
100 BaseTX Active (Low CPU Speed)
10 BaseT Active (Low CPU Speed)
No Link (Low CPU Speed)
Supply Reset Threshold
VRST
2.7
CPx Pull-ups, except CP5, CP6
RPU
56
CP5,CP6 Pull-up
RPU
CPx, RX
Input Low Voltage
VCP_IL
CPx, RX
Input High Voltage
VCP_IH
CPx, TX Output Low Voltage
(IOL = 4 mA)
VCP_OL
CPx, TX Output High Voltage
(IOH = -4 mA)
VCP_OH
Reset Pin Low Voltage
VRES_IL
Reset Pin High Voltage
VRES_IL
xPico® Embedded Device Server Integration Guide
ICC
200
mA
ICC
220
mA
ICC
150
mA
ICC
240
mA
ICC
260
mA
ICC
190
mA
ICC
170
mA
ICC
190
mA
ICC
120
mA
Vdc
122
10
2
Kohm
0.8
Vdc
5.5
Vdc
0.4
Vdc
2.4
2.0
Kohm
Vdc
0.36
Vdc
3.46
Vdc
39
4: Specifications
Table 4-3 xPico Wi-Fi Recommended Operating Conditions
Parameter
Symbol
Min
Typical
Max
Units
Supply Voltage
VCC
3.15
3.3
3.46
Vdc
Supply Voltage Ripples
VCC_PP
TX Power @ 16.5dBm, 802.11b, 11Mbps
TX Power @ 15dBm, 802.11g, 6Mbps
TX Power @ 13dBm, 802.11g, 54Mbps
TX Power @ 14.5dBm, 802.11n, MCS0
TX Power @ 12dBm, 802.11n, MCS7
RX Power @ 802.11b, 11Mbps
RX Power @ 802.11g, 54Mbps
2
%
ICC
330
380
mA
ICC
300
345
mA
ICC
255
295
mA
ICC
290
335
mA
ICC
230
265
mA
ICC
125
150
mA
ICC
125
150
mA
RX Power @ 802.11n, MCS7
ICC
125
150
mA
Power Management State 1 @ 25°C
ICC
6
μA
Power Management State 1 @ +85°C
ICC
12
μA
Power Management State 1 @ -40°C
ICC
5
μA
Supply Reset Threshold
VRST
CPx Pull-ups/ Pull-downs
RPU
30
CPx, RX
Input Low Voltage
VCP_IL
CPx, RX
Input High Voltage
VCP_IH
CPx, TX Output Low Voltage
(IOL = 4 mA)
VCP_OL
CPx, TX Output High Voltage
(IOH = -4 mA)
VCP_OH
2.4
Reset Pin Low Voltage
VRES_IL
-0.3
0.8
Vdc
Reset Pin High Voltage
VRES_IL
2
Vcc+0.3
Vdc
(1)
Vdc
40
50
Kohm
-0.3
0.75
Vdc
2
5.5
Vdc
0.4
Vdc
Vdc
Note 1. For xPico Wi-Fi 5V tolerant pins, in order to sustain a voltage higher than Vcc+0.3, the internal pullup/pull-down resistors must be disabled.
xPico® Embedded Device Server Integration Guide
40
4: Specifications
Technical Specifications
Table 4-4 xPico Wired Technical Specification
Category
Description
CPU, Memory
Lantronix DSTni-EX 186 CPU, 256-Kbyte zero wait state SRAM, 512Kbyte flash, 16-Kbyte boot ROM
Firmware
Upgradeable via TFTP and serial port
Reset Circuit
Internal 200ms power-up reset pulse. Power-drop reset triggered at 2.6V.
External reset input causes an internal 200ms reset.
Serial Interface
CMOS (Asynchronous) 3.3V-level signals
Rate is software selectable: 300 bps to 921600 bps
Serial Line Formats
Data bits: 7 or 8 Stop bits: 1 or 2 Parity: odd, even, none
Modem Control
DTR/DCD, CTS, RTS <- Serial 1 only
Flow Control
Serial 1: XON/XOFF (software), CTS/RTS (hardware)
Serial 2: XON/XOFF (software)
Programmable I/O
8 PIO pins (software selectable), sink or source 4mA max.
Network Interface
10/100Mbps Ethernet, requires external magnetics and RJ45
Compatibility
Ethernet: Version 2.0/IEEE 802.3 (electrical), Ethernet II frame type
Protocols Supported
ARP, UDP/IP, TCP/IP, Telnet, ICMP, SNMP, DHCP, BOOTP, TFTP, Auto
IP, SMTP, and HTTP
LEDs
Link, Activity, Link Speed, Duplex, System Status logic level outputs
Management
Internal web server, SNMP (read only) Serial login, Telnet login
Security
Password protection, locking features, optional Rijndael 256-bit encryption
Internal Web Server
Serves static Web pages and Java applets
Storage capacity: 384 Kbytes
Weight
2.5 grams
Material
Metal shell
Temperature
Operating range:
-40°C to +85°C (-40°F to 185°F)
Warranty
For details on the Lantronix warranty policy, go to our web site at
www.lantronix.com/support/warranty.
Included Software
Windows 98/NT/2000/XP-based Lantronix® DeviceInstaller™
configuration software and Windows based Com Port Redirector
EMI Compliance
See A:Compliance.
Table 4-5 xPico Wi-Fi Technical Specification
Category
Description
CPU, Memory
Cortex M3 CPU, 1MB Flash, 128KB+4KB SRAM, Additional 1MB on
board Flash
Firmware
Upgradeable via TFTP and serial port
WLAN Standards
802.11 b/g/n Wireless LAN with external antenna
Antenna Connector
U.FL connector for external antenna
Frequency Band
2.400Ghz to 2.484Ghz
xPico® Embedded Device Server Integration Guide
41
4: Specifications
Category
Description
Channel Support
Channel 1 to Channel 14
Modulation
DSSS, CCK, OFDM, BPSK, QPSK, 16QAM, 64QAM
Protocols Supported
ARP, UDP/IP, TCP/IP, Telnet, ICMP, SNMP, DHCP, BOOTP, TFTP,
Auto IP, SMTP, and HTTP
Data Rates 802.11b
1, 2, 5.5, 11 Mbps
Data Rates 802.11g
6, 9, 12, 18, 24, 36, 48, 54 Mbps
Date Rates 802.11n
HT20 MCS0 (6.5Mbps) to HT20 MCS7 (65Mbps)
802.11b, CCK Mode
Average Output Power
16.5 +/- 1.5dBm Typical @ 25C
802.11g, OFDM Mode
Average Output Power
15 +/- 1.5dBm, Typical @ 25C, 6Mbps
13 +/- 1.5dBm, Typical @ 25C, 54Mbps
802.11n, OFDM Mode
Average Output Power
14.5 +/- 1.5dBm, Typical @ 25C, MCS0
12 +/- 1.5dBm, Typical @ 25C, MCS7
802.11b
Average Output EVM
IEEE Spec -10dBm
802.11g
Average Output EVM
IEEE Spec, -5dB @ 6Mbps
IEEE Spec, -25dB @ 54Mbps
802.11n
Average Output EVM
IEEE Spec, -5dB @ MCS0
IEEE Spec, -28dB @ MCS7
802.11b, PER <8%
RX Sensitivity @ 1Mbps
-93dBm Typical
-89dBm Max
802.11b, PER <8%
RX Sensitivity @ 11Mbps
-88dBm Typical
-84dBm Max
802.11g, PER <10%
RX Sensitivity @ 6Mbps
-87dBm Typical
-83dBm Max
802.11g, PER <10%
RX Sensitivity @ 54Mbps
-74dBm Typical
-70dBm Max
802.11n, PER <10%
RX Sensitivity @ MCS0
-87dBm Typical
-83dBm Max
802.11n, PER <10%
RX Sensitivity @ MCS7
-71dBm Typical
-67dBm Max
Serial Interface
CMOS (Asynchronous) 3.3V-level signals
Rate is software selectable: 300 bps to 921600 bps
Serial Line Formats
Data bits: 7 or 8 Stop bits: 1 or 2 Parity: odd, even, none
Modem Control
DTR/DCD, CTS, RTS <- Serial 1 only
Flow Control
Serial 1: XON/XOFF (software), CTS/RTS (hardware)
Serial 2: XON/XOFF (software)
Programmable I/O
8 PIO pins (software selectable), sink or source 4mA max.
LEDs
WLAN Status, System Status logic level outputs
Management
Internal web server, SNMP (read only) Serial login, Telnet login
Security
Password protection, locking features, optional Rijndael 256-bit
encryption
Internal Web Server
Serves static Web pages and Java applets
Storage capacity: TBD Kbytes
Weight
2.5 grams
Material
Metal shell
xPico® Embedded Device Server Integration Guide
42
4: Specifications
Category
Description
Temperature
Operating range:
-40°C to +85°C (-40°F to 185°F) with use of heat pad between module
and mating PCB
Warranty
For details on the Lantronix warranty policy, go to our web site at
www.lantronix.com/support/warranty.
Included Software
Windows 98/NT/2000/XP-based DeviceInstaller configuration software
and Windows based Com Port Redirector
EMI Compliance
See A:Compliance.
xPico® Embedded Device Server Integration Guide
43
A: Compliance (xPico Embedded Device Server)
(According to ISO/IEC Guide 22 and EN 45014)
Manufacturer’s Name & Address:
Lantronix, Inc. 167 Technology Drive, Irvine, CA 92618 USA
Declares that the following product:
Product Name Model: xPico® Embedded Device Server
Conforms to the following standards or other normative documents:
Electromagnetic Emissions/Immunity:
Table A-1 Electromagnetic Emissions
Test Description
Radiated Emissions
Radiated Emissions
Conducted Emissions
Conducted Emissions
Specification
EN 55022:2010 Class B
FCC 15.109(g):2012
CISPR 22:1997 Class B
EN 55022:2010 Class B
FCC 15.109(g):2012
CISPR 22:1997 Class B
Test Method
CISPR 22:2008
ANSI C63.4:2009
CISPR 22:2008
ANSI C63.4:2009
Table A-2 Electromagnetic Immunity
Test Description
Specification
Test Method
ESD
Radiated Immunity
EFT
EN 55024:2010
EN 55024:2010
EN 55024:2010
Surge
Conducted Immunity
Magnetic Field Immunity
Voltage Interruptions
Voltage Dips
EN 55024:2010
EN 55024:2010
EN 55024:2010
EN 55024:2010
EN 55024:2010
IEC 61000-4-2:2008
IEC 61000-4-3:2010
IEC 61000-4-4:2004
(Amended by A1:2010)
IEC 61000-4-5:2005
IEC 61000-4-6:2008
IEC 61000-4-8:2009
IEC 61000-4-11:2004
IEC 61000-4-11:2004
Performance
Criteria
2
1
1
1
1
1
3
1
Manufacturer’s Contact:
Lantronix, Inc.
167 Technology Drive
Irvine, CA 92618 USA
Tel: (800) 526-8766
Tel: (949) 453-3990
Fax: (949) 453-3995
xPico® Embedded Device Server Integration Guide
44
B: Compliance (xPico Wi-Fi Embedded Device
Server)
(According to ISO/IEC Guide and EN 45014)
Manufacturer's Name & Address:
Lantronix, Inc.
167 Technology Drive, Irvine, CA 92618 USA
Declares that the following product:
Product Name Model: xPico® Wi-Fi® Embedded Device Server
Conforms to the following standards or other normative documents:
Table B-1 Country Certifications
Country
Specification
USA
FCC Part 15, Subpart B, Class B
ICES-003:2012 Issue 5, Class B
ANSI C63.4-2009
USA
FCC Part 15, Subpart C (Section 15.247)
ANSI C63.10-2009
FCC Part 2 (Section 2.1091)
FCC OET Bulletin 65, Supplement C (01-01)
IEEE C95.1
Canada
Canada RSS-210 Issue 8 (2010-12)
Canada RSS-Gen Issue 3 (2010-12)
ANSI C63.10-2009
RSS-102 Issue 4 (2010-12)
EU
EN 300 328 V1.8.1 (2012-06)
EN 301 489-1 V1.9.2 (2011-09)
EN 301 489-17 V2.2.1 (2012-09)
EN 55022:2010+AC:2011, Class B
EN62311:2008
Australia, New Zealand
Japan
N11206
AS/NZS 4268: 2012
ARIB STD-T66, MIC notice 88 Appendix 43
RCR STD-33, MIC notice 88 Appendix 44
xPico® Embedded Device Server Integration Guide
45
Table B-2 Country Transmitter IDs
Country
Specification
USA FCC ID
R68XPICOW
Canada IC ID
3867A-XPICOW
Japan ID
201-135275
Table B-3 Safety
Country
Specification
World Wide
CB
EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011
In accordance with the council directive 2006/95/EC
US, Canada
UL 60950-1 (2nd Edition)
Hereby, Lantronix, declares that this xPico Wi-Fi embedded device server is in compliance with
the essential requirements and other relevant provisions of Directive 1999/5/EC.
Table B-4 Europe – EU Declaration of Conformity
Česky [Czech]
Lantronix, Inc. tímto prohlašuje, že tento xPico Wi-Fi je ve shodě se
základními požadavky a dalšími příslušnými ustanoveními směrnice
1999/5/ES.
Dansk [Danish]
Undertegnede Lantronix, Inc. erklærer herved, at følgende udstyr xPico
Wi-Fi overholder de væsentlige krav og øvrige relevante krav i direktiv
1999/5/EF.
Deutsch [German]
Hiermit erklärt Lantronix, Inc., dass sich das Gerät xPico Wi-Fi in
Übereinstimmung mit den grundlegenden Anforderungen und den übrigen
einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet.
Eesti [Estonian]
Käesolevaga Lantronix, Inc. seadme xPico Wi-Fi vastavust direktiivi
1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele
asjakohastele sätetele.
English
Hereby, Lantronix, Inc., declares that this xPico Wi-Fi is in compliance
with the essential requirements and other relevant provisions of Directive
1999/5/EC.
xPico® Embedded Device Server Integration Guide
46
Español [Spanish]
Por medio de la presente Lantronix, Inc. declara que el xPico Wi-Fi cumple
con los requisitos esenciales y cualesquiera otras disposiciones aplicables
o exigibles de la Directiva 1999/5/CE.
Ελληνική [Greek]
ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ Lantronix, Inc. ΔΗΛΩΝΕΙ ΟΤΙ xPico Wi-Fi
ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ
ΣΧΕΤΙΚΕΣ ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ 1999/5/ΕΚ.
Français [French]
Par la présente Lantronix, Inc. déclare que l'appareil xPico Wi-Fi est
conforme aux exigences essentielles et aux autres dispositions pertinentes
de la directive 1999/5/CE.
Italiano [Italian]
Con la presente Lantronix, Inc. dichiara che questo xPico Wi-Fi è
conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite
dalla direttiva 1999/5/CE.
Latviski [Latvian]
Ar šo Lantronix, Inc. deklarē, ka xPico Wi-Fi atbilst Direktīvas 1999/5/EK
būtiskajām prasībām un citiem ar to saistītajiem noteikumiem.
Lietuvių [Lithuanian]
Šiuo Lantronix, Inc. deklaruoja, kad šis xPico Wi-Fi atitinka esminius
reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.
Nederlands [Dutch]
Hierbij verklaart Lantronix, Inc. dat het toestel xPico Wi-Fi in
overeenstemming is met de essentiële eisen en de andere relevante
bepalingen van richtlijn 1999/5/EG.
Malti [Maltese]
Hawnhekk, Lantronix, Inc.], jiddikjara li dan xPico Wi-Fi jikkonforma malħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fidDirrettiva 1999/5/EC.
Magyar [Hungarian]
Alulírott, Lantronix, Inc. nyilatkozom, hogy a xPico Wi-Fi megfelel a
vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb
elõírásainak.
Polski [Polish]
Niniejszym Lantronix, Inc. oświadcza, że xPico Wi-Fi jest zgodny z
zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami
Dyrektywy 1999/5/EC.
Português [Portuguese]
Lantronix, Inc. declara que este xPico Wi-Fi está conforme com os
requisitos essenciais e outras disposições da Directiva 1999/5/CE.
Slovensko [Slovenian]
Lantronix, Inc. izjavlja, da je ta xPico Wi-Fi v skladu z bistvenimi zahtevami
in ostalimi relevantnimi določili direktive 1999/5/ES.
Slovensky [Slovak]
Lantronix, Inc. týmto vyhlasuje, že xPico Wi-Fi spĺňa základné požiadavky
a všetky príslušné ustanovenia Smernice 1999/5/ES.
Suomi [Finnish]
Lantronix, Inc. vakuuttaa täten että xPico Wi-Fi tyyppinen laite on
direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin
muiden ehtojen mukainen.
Svenska [Swedish]
Härmed intygar Lantronix, Inc. att denna xPico Wi-Fi står I
överensstämmelse med de väsentliga egenskapskrav och övriga relevanta
bestämmelser som framgår av direktiv 1999/5/EG.
xPico® Embedded Device Server Integration Guide
47
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses and can radiate radio frequency energy and, if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one of the
following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.

Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.
This device is intended only for OEM integrators under the following conditions:
1. The antenna must be installed such that 20 cm is maintained between the antenna and
users, and
2. The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example
certain laptop configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID can not be used on the final
product. In these circumstances, the OEM integrator will be responsible for re-evaluating
the end product (including the transmitter) and obtaining a separate FCC authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed
such that 20 cm may be maintained between the antenna and users. The final end product must
be labeled in a visible area with the following: “Contains FCC ID: R68XPICOW”. The grantee's
FCC ID can be used only when all FCC compliance requirements are met.
xPico® Embedded Device Server Integration Guide
48
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module in the user’s manual of the end product which integrates this
module.
The end user manual shall include all required regulatory information/warning as show in this
manual.
Industry Canada Statement
This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux appareils radio
exempts de licence. Son fonctionnement est sujet aux deux conditions suivantes: (1) le dispositif
ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage
reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable.
Radiation Exposure Statement
This equipment complies with IC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.
Déclaration d'exposition aux radiations
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20
cm de distance entre la source de rayonnement et votre corps.
This device is intended only for OEM integrators under the following conditions: (For
module device use)
1. The antenna must be installed such that 20 cm is maintained between the antenna and
users, and
2. The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions
suivantes: (Pour utilisation de dispositif module)
L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne
et les utilisateurs, et
Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
xPico® Embedded Device Server Integration Guide
49
Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne
seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son
produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.
IMPORTANT NOTE: In the event that these conditions can not be met (for example
certain laptop configurations or co-location with another transmitter), then the Canada
authorization is no longer considered valid and the IC ID can not be used on the final
product. In these circumstances, the OEM integrator will be responsible for re-evaluating
the end product (including the transmitter) and obtaining a separate Canada
authorization.
NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (par
exemple pour certaines configurations d'ordinateur portable ou de certaines colocalisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré
comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris
l'émetteur) et l'obtention d'une autorisation distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed
such that 20 cm may be maintained between the antenna and users. The final end product must
be labeled in a visible area with the following:
“Contains IC: 3867A-XPICOW".
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne
peut être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et
les utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription
suivante: "Contient des IC: 3867A-XPICOW".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to
install or remove this RF module in the user’s manual of the end product which integrates this
module.
The end user manual shall include all required regulatory information/warning as show in this
manual.
Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant
à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final
qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et
avertissements comme indiqué dans ce manuel.
Antenna Requirement
This device has been designed to operate with a PIFA antenna have a maximum gain of 2.5dBi.
Antenna having a higher gain is strictly prohibited per regulations of Industry Canada. The
required antenna impedance is 50 ohms.
xPico® Embedded Device Server Integration Guide
50
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a
type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce
potential radio interference to other users, the antenna type and its gain should be so chosen that
the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful
communication.
This radio transmitter xPico Wi-Fi embedded device server has been approved by Industry
Canada to operate with the antenna type, maximum permissible gain and required antenna
impedance for each antenna type indicated. Antenna types not included in this user's manual,
having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use
with this device.
Ce dispositif a été conçu pour fonctionner avec une antenne ayant un gain maximal de PIFA
antenne avec dBi 2.5. Une antenne à gain plus élevé est strictement interdite par les règlements
d'Industrie Canada. L'impédance d'antenne requise est de 50 ohms.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peutfonctionner
avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pourl'émetteur par
Industrie Canada. Dans le but de réduire les risques de brouillage radioélectriqueà l'intention des
autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que lapuissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire àl'établissement d'une
communication satisfaisante.
Le présent émetteur radio xPico Wi-Fi a été approuvé par Industrie Canada pour fonctionner
avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et
l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste,
ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation
de l'émetteur.
Table B-5 Approved Antenna(s) List
Type
Gain
Brand
PIFA
2.5dBi
Ethertronics
Dipole
2.38
Wanshih
xPico® Embedded Device Server Integration Guide
51
Manufacturer's Contact:
Lantronix, Inc.
167 Technology Drive, Irvine, CA 92618 USA
Tel: 949-453-3990
Fax: 949-453-3995
RoHS Notice
All Lantronix products in the following families are China RoHS-compliant and free of the following hazardous
substances and elements:
 Lead (Pb)
 Cadmium (Cd)
Product Family Name
 Mercury (Hg)
 Hexavalent Chromium (Cr (VI))
 Polybrominated biphenyls (PBB)
 Polybrominated diphenyl ethers (PBDE)
Toxic or hazardous Substances and Elements
Lead
(Pb)
Mercury
(Hg)
Cadmiu
m (Cd)
Hexavalent
Chromium (Cr
(VI))
Polybrominate
d biphenyls
(PBB)
Polybrominated
diphenyl ethers
(PBDE)
DSC
0
0
0
0
0
0
EDS
0
0
0
0
0
0
IntelliBox
0
0
0
0
0
0
MatchPort
0
0
0
0
0
0
Micro
0
0
0
0
0
0
MSS100
0
0
0
0
0
0
PremierWave
0
0
0
0
0
0
SCS
0
0
0
0
0
0
SecureBox
0
0
0
0
0
0
SLB
0
0
0
0
0
0
SLC
0
0
0
0
0
0
SLP
0
0
0
0
0
0
Spider and Spider Duo
0
0
0
0
0
0
UBox
0
0
0
0
0
0
UDS1100 and 2100
0
0
0
0
0
0
WiBox
0
0
0
0
0
0
WiPort
0
0
0
0
0
0
xDirect
0
0
0
0
0
0
xPico
0
0
0
0
0
0
xPico Wi-Fi
0
0
0
0
0
0
XPort
0
0
0
0
0
0
XPort Pro
0
0
0
0
0
0
XPress DR & XPress-DR+
0
0
0
0
0
0
xPrintServer
0
0
0
0
0
0
xSenso
0
0
0
0
0
0
O: toxic or hazardous substance contained in all of the homogeneous materials for this part is below the limit
requirement in SJ/T11363-2006.
X: toxic or hazardous substance contained in at least one of the homogeneous materials used for this part is above
the limit requirement in SJ/T11363-2006.
xPico® Embedded Device Server Integration Guide
52
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