AOT16N50/AOTF16N50 500V, 16A N-Channel MOSFET General Description Product Summary The AOT16N50 & AOTF16N50 have been fabricated using an advanced high voltage MOSFET process that is designed to deliver high levels of performance and robustness in popular AC-DC applications. By providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability these parts can be adopted quickly into new and existing offline power supply designs. VDS ID (at VGS=10V) 600V@150℃ 16A RDS(ON) (at VGS=10V) < 0.37Ω 100% UIS Tested 100% Rg Tested For Halogen Free add "L" suffix to part number: AOT16N50L & AOTF16N50L TO-220 G D Top View D G S TO-220F G D S AOT16N50 S AOTF16N50 Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol AOT16N50 Drain-Source Voltage VDS 500 Gate-Source Voltage ±30 Continuous Drain Current VGS TC=25°C TC=100°C AOTF16N50 V 16 ID Units V 16* 11 11* A Pulsed Drain Current C IDM Avalanche Current C IAR 6 A Repetitive avalanche energy C EAR 540 mJ Single plused avalanche energy G Peak diode recovery dv/dt TC=25°C Power Dissipation B Derate above 25oC Junction and Storage Temperature Range Maximum lead temperature for soldering purpose, 1/8" from case for 5 seconds Thermal Characteristics Parameter Maximum Junction-to-Ambient A,D EAS dv/dt 1080 5 mJ V/ns W 64 PD 50.0 0.4 TJ, TSTG -55 to 150 W/ oC °C 300 °C TL Symbol RθJA RθCS AOT16N50 65 AOTF16N50 65 Units °C/W 0.5 0.45 -2.5 °C/W °C/W Maximum Case-to-sink A Maximum Junction-to-Case RθJC * Drain current limited by maximum junction temperature. Rev3: Jul 2011 278 2.2 www.aosmd.com Page 1 of 6 AOT16N50/AOTF16N50 Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter Conditions Min ID=250µA, VGS=0V, TJ=25°C 500 Typ Max Units STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage BVDSS /∆TJ Breakdown Voltage Temperature Coefficient IDSS Zero Gate Voltage Drain Current ID=250µA, VGS=0V, TJ=150°C 600 V ID=250µA, VGS=0V 0.5 V/ oC VDS=500V, VGS=0V 1 VDS=400V, TJ=125°C 10 IGSS Gate-Body leakage current VDS=0V, VGS=±30V VGS(th) Gate Threshold Voltage VDS=5V, ID=250µA ±100 3.3 µA 4 4.5 nΑ V 0.37 Ω 1 V RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=8A 0.29 gFS Forward Transconductance VDS=40V, ID=8A 20 VSD Diode Forward Voltage IS=1A,VGS=0V IS Maximum Body-Diode Continuous Current 16 A ISM Maximum Body-Diode Pulsed Current 64 A DYNAMIC PARAMETERS Input Capacitance Ciss Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate resistance 1531 1914 2297 pF 153 191 229 pF 11 16 20 pF VGS=0V, VDS=0V, f=1MHz 1.75 3.5 5.3 Ω 34 42.8 51 nC VGS=10V, VDS=400V, ID=16A 7.5 9.3 11 nC 16 20.3 24 nC VGS=0V, VDS=25V, f=1MHz SWITCHING PARAMETERS Qg Total Gate Charge Qgs Gate Source Charge Qgd Gate Drain Charge S 0.71 tD(on) Turn-On DelayTime tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf trr Turn-Off Fall Time Body Diode Reverse Recovery Time IF=16A,dI/dt=100A/µs,VDS=100V 265 334 400 Qrr Body Diode Reverse Recovery Charge IF=16A,dI/dt=100A/µs,VDS=100V 4.5 6 7.5 VGS=10V, VDS=250V, ID=16A, RG=25Ω 44 ns 84 ns 92 ns 50 ns ns µC A. The value of R θJA is measured with the device in a still air environment with T A =25°C. B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ =25°C. D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of T J(MAX)=150°C. The SOA curve provides a single pulse rating. G. L=60mH, IAS=6A, VDD=150V, RG=25Ω, Starting TJ=25°C THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev3: Jul 2011 www.aosmd.com Page 2 of 6 AOT16N50/AOTF16N50 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 32 100 10V 28 -55°C VDS=40V 6.5V 24 10 6V ID(A) ID (A) 20 16 12 VGS=5.5V 125°C 1 8 25°C 4 0 0.1 5 10 15 20 25 VDS (Volts) Fig 1: On-Region Characteristics 30 2 0.7 3 0.6 2.5 Normalized On-Resistance RDS(ON) (Ω ) 0 0.5 VGS=10V 0.4 0.3 0.2 4 6 8 VGS(Volts) Figure 2: Transfer Characteristics 10 VGS=10V ID=8A 2 1.5 1 0.5 0 0 4 8 12 16 20 24 28 32 -100 ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage -50 0 50 100 150 200 Temperature (°C) Figure 4: On-Resistance vs. Junction Temperature 1.2 1.0E+02 1.0E+00 40 125°C IS (A) BVDSS (Normalized) 1.0E+01 1.1 1 1.0E-01 25°C 1.0E-02 1.0E-03 0.9 1.0E-04 1.0E-05 0.8 -100 -50 0 50 100 150 200 TJ (°C) Figure 5:Break Down vs. Junction Temperature Rev3: Jul 2011 www.aosmd.com 0.0 0.2 0.4 0.6 0.8 1.0 VSD (Volts) Figure 6: Body-Diode Characteristics (Note E) Page 3 of 6 AOT16N50/AOTF16N50 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 15 10000 VDS=400V ID=16A 12 Ciss Capacitance (pF) VGS (Volts) 1000 9 6 Coss 100 Crss 10 3 0 1 0 10 20 30 40 50 Qg (nC) Figure 7: Gate-Charge Characteristics 60 0.1 1 10 VDS (Volts) Figure 8: Capacitance Characteristics 100 100 10µs 10µs 100µs 1ms 1 10ms 0.1s DC 0.1 RDS(ON) limited 10 100µs ID (Amps) RDS(ON) limited 10 ID (Amps) 100 1 DC TJ(Max)=150°C TC=25°C 0.1 TJ(Max)=150°C TC=25°C 1ms 10ms 0.1s 1s 10s 0.01 0.01 1 10 100 1000 1 VDS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area for AOT16N50 (Note F) 10 100 1000 VDS (Volts) Figure 10: Maximum Forward Biased Safe Operating Area for AOTF16N50 (Note F) 18 Current rating ID(A) 15 12 9 6 3 0 0 25 50 75 100 125 150 TCASE (°C) Figure 11: Current De-rating (Note B) Rev3: Jul 2011 www.aosmd.com Page 4 of 6 AOT16N50/AOTF16N50 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS Zθ JC Normalized Transient Thermal Resistance 10 1 D=Ton/T TJ,PK=TC+PDM.ZθJC.RθJC RθJC=0.45°C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0.1 PD Ton 0.01 T Single Pulse 0.001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 Pulse Width (s) Figure 12: Normalized Maximum Transient Thermal Impedance for AOT16N50 (Note F) Zθ JC Normalized Transient Thermal Resistance 10 1 D=Ton/T TJ,PK=TC+PDM.ZθJC.RθJC RθJC=2.5°C/W In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 0.1 PD 0.01 Ton T Single Pulse 0.001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 Pulse Width (s) Figure 13: Normalized Maximum Transient Thermal Impedance for AOTF16N50 (Note F) Rev3: Jul 2011 www.aosmd.com Page 5 of 6 AOT16N50/AOTF16N50 Gate Charge Test Circuit & Waveform Vgs Qg 10V + + VDC - VDC DUT Qgs Vds Qgd - Vgs Ig Charge Res istive Switching Test Circuit & Waveforms RL Vds Vds DUT Vgs + VDC 90% Vdd - Rg 10% Vgs Vgs t d(on) tr t d(off) t on tf t off Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L EAR= 1/2 LI Vds 2 AR BVDSS Vds Id + Vgs Vgs VDC - Rg Vdd I AR Id DUT Vgs Vgs Diode Recovery Tes t Circuit & Waveforms Qrr = - Idt Vds + DUT Vgs Vds - Isd Vgs Ig Rev3: Jul 2011 L Isd + Vdd trr dI/dt IRM Vdd VDC - IF Vds www.aosmd.com Page 6 of 6