Datasheet

UNISONIC TECHNOLOGIES CO., LTD
UTM6006
Power MOSFET
6.3A, 60V N-CHANNEL FAST
SWITCHING MOSFET

DESCRIPTION
The UTC UTM6006 is an N-Channel MOSFET, it uses UTC’s
advanced technology to provide customers with a minimum on-state
resistance, high switching speed and low gate charge.
The UTC UTM6006 is suitable for application in networking
DC-DC power system and LCD/LED back light, etc.

SOP-8
1
FEATURES
* RDS(ON)< 18 mΩ @ VGS=10V, ID=6A
RDS(ON) < 20 mΩ @ VGS=4.5V, ID=4A
* Low gate charge
* Excellent CdV/dt effect decline
* High switching speed

SYMBOL

ORDERING INFORMATION
Ordering Number
Note:

UTM6006G-S08-R
UTM6006G-K08-5060-R
Pin Assignment: G: Gate
DFN-8(5x6)
Package
SOP-8
DFN-8(5×6)
D: Drain
S: Source
1
S
S
2
S
S
Pin Assignment
3
4
5
6
S G D D
S G D D
7
D
D
8
D
D
Packing
Tape Reel
Tape Reel
MARKING
SOP-8
www.unisonic.com.tw
Copyright © 2015 Unisonic Technologies Co., Ltd
DFN-8(5×6)
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UTM6006
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Power MOSFET
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous
VGS @ 10V (Note 1)
Drain Current
RATINGS
UNIT
60
V
±20
V
TA=25°C
6.3
A
ID
5.0
A
TA=70°C
32
A
Pulsed (Note 2)
IDM
Avalanche Current
IAS
28
A
Single Pulse Avalanche Energy (Note 3)
EAS
67
mJ
SOP-8
1.5
Power Dissipation (TA=25°C) (Note 4)
PD
W
DFN-8(5×6)
1.92
Junction Temperature
TJ
-55~+150
°C
Storage Temperature Range
TSTG
-55~+150
°C
Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.

SYMBOL
VDSS
VGSS
THERMAL CHARACTERISTICS (Note 1)
PARAMETER
SYMBOL
RATINGS
SOP-8
85
Junction to Ambient
θJA
DFN-8(5×6)
65
SOP-8
24
Junction to Case
θJC
DFN-8(5×6)
12
Notes: 1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width ≤ 300µs, duty cycle ≤ 2%.
3. The EAS data shows Max. rating. The test condition is VDD=25V, VGS=10V, L=0.1mH, IAS=30A.
4. The power dissipation is limited by 150°C junction temperature.
UNISONIC TECHNOLOGIES CO., LTD
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UNIT
°C/W
°C/W
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Power MOSFET
ELECTRICAL CHARACTERISTICS (TJ=25°C, unless otherwise noted)
PARAMETER
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BVDSS Temperature Coefficient
Drain-Source Leakage Current
Gate-Source Leakage Current
SYMBOL
TEST CONDITIONS
BVDSS
ID=250µA, VGS=0V
△BVDSS/△TJ Reference to 25°C , ID=1mA
VDS=48V, VGS=0V, TJ=25°C
IDSS
VDS=48V, VGS=0V, TJ=55°C
Forward
VGS=+20V, VDS=0V
IGSS
Reverse
VGS=-20V, VDS=0V
ON CHARACTERISTICS
Gate Threshold Voltage
VGS(TH) Temperature Coefficient
Static Drain-Source On-State Resistance
(Note 2)
VGS(TH)
△VGS(TH)
RDS(ON)
MIN
TYP
60
0.057
1.2
VDS=VGS, ID=250µA
VGS=10V, ID=6A
VGS=4.5V, ID=4A
VDS=5V, ID=6A
MAX UNIT
V
V/°C
1
µA
5
µA
+100 nA
-100
nA
2.5
-5.68
14
16
40
18
20
Forward Transconductance
gFS
DYNAMIC PARAMETERS
Input Capacitance
CISS
1070 1200
VGS=0V, VDS=25V, f=1.0MHz
Output Capacitance
COSS
200 220
190 210
Reverse Transfer Capacitance
CRSS
SWITCHING PARAMETERS (Note 2)
Total Gate Charge (4.5V)
QG
290 310
=10V,
V
=48V,
I
=1A
V
Gate to Source Charge
QGS
10.7
15
GS
DS
D
30
45
Gate to Drain Charge
QGD
Turn-ON Delay Time
tD(ON)
55
70
Rise Time
tR
100 120
VGS=10V, VDD=30V,
RG=3.3Ω, ID=2A
Turn-OFF Delay Time
tD(OFF)
580 620
Fall-Time
tF
190 210
GUARANTEED AVALANCHE CHARACTERISTICS
Single Pulse Avalanche Energy (Note 5)
EAS
VDD=25V, L=0.1mH, IAS=15A
19
DIODE CHARACTERISTICS
Continuous Source Current (Note 1, 6)
IS
6.3
VG=VD=0V , Force Current
32
Pulsed Source Current (Note 2, 6)
ISM
Diode Forward Voltage (Note 2)
VSD
VGS=0V , IS=6.3A , TJ=25°C
1
Reverse Recovery Time
trr
15
IF=6A, dI/dt=100A/μs, TJ=25°C
Reverse Recovery Charge
Qrr
10.4
Notes: 1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2. The data tested by pulsed, pulse width≤300µs, duty cycle≤2%.
3. The EAS data shows Max. rating. The test condition is VDD=25V, VGS=10V, L=0.1mH, IAS=30A.
4. The power dissipation is limited by 150°C junction temperature.
5. The Min. value is 100% EAS tested guarantee.
6. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power
dissipation.
UNISONIC TECHNOLOGIES CO., LTD
www.unisonic.com.tw
V
mV/°
C
mΩ
mΩ
S
pF
pF
pF
nC
nC
nC
ns
ns
ns
ns
mJ
A
A
V
nS
nC
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Power MOSFET
TEST CIRCUITS AND WAVEFORMS
Peak Diode Recovery dv/dt Test Circuit
VGS
(Driver)
Period
D=
P.W.
P. W.
Period
VGS= 10V
IFM, Body Diode Forward Current
ISD
(D.U.T.)
di/dt
IRM
Body Diode Reverse Current
Body Diode Recovery dv/dt
VDS
(D.U.T.)
VDD
Body Diode
Forward Voltage Drop
Peak Diode Recovery dv/dt Waveforms
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Power MOSFET
TEST CIRCUITS AND WAVEFORMS (Cont.)
Switching Test Circuit
Switching Waveforms
Gate Charge Test Circuit
Gate Charge Waveform
Unclamped Inductive Switching Test Circuit
Unclamped Inductive Switching Waveforms
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Drain Current, ID (A)
TYPICAL CHARACTERISTICS
Drain Current,ID (A)

Power MOSFET
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UTM6006
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Power MOSFET
TYPICAL CHARACTERISTICS (Cont.)
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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