Data Sheet

PBSS5160DS
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
Rev. 03 — 9 October 2008
Product data sheet
1. Product profile
1.1 General description
PNP/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor pair in a small
SOT457 (SC-74) Surface-Mounted Device (SMD) plastic package.
NPN complement: PBSS4160DS.
1.2 Features
n
n
n
n
n
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High collector current gain (hFE) at high IC
High efficiency due to less heat generation
Smaller required Printed-Circuit Board (PCB) area than for conventional transistors
1.3 Applications
n Dual low power switches (e.g. motors, fans)
n Automotive applications
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
VCEO
collector-emitter voltage
open base
[1]
IC
collector current
ICM
peak collector current
single pulse;
tp ≤ 1 ms
RCEsat
collector-emitter saturation
resistance
IC = −1 A;
IB = −100 mA
[1]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
[2]
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
[2]
Min
Typ
Max
Unit
-
-
−60
V
-
-
−1
A
-
-
−2
A
-
250
330
mΩ
PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
2. Pinning information
Table 2.
Pinning
Pin
Description
Simplified outline
1
emitter TR1
2
base TR1
3
collector TR2
4
emitter TR2
5
base TR2
6
collector TR1
6
5
4
1
2
3
Graphic symbol
6
5
4
TR2
TR1
1
2
3
sym018
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
PBSS5160DS SC-74
Description
Version
plastic surface-mounted package (TSOP6); 6 leads
SOT457
4. Marking
Table 4.
Marking codes
Type number
Marking code
PBSS5160DS
A5
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor
VCBO
collector-base voltage
open emitter
-
−80
V
VCEO
collector-emitter
voltage
open base
-
−60
V
VEBO
emitter-base voltage
open collector
V
IC
-
−5
[1]
-
−0.77
A
[2]
-
−0.9
A
[3]
-
−1
A
single pulse; tp ≤ 1 ms
-
−2
A
-
−300
mA
single pulse; tp ≤ 1 ms
-
−1
A
collector current
ICM
peak collector current
IB
base current
IBM
peak base current
PBSS5160DS_3
Product data sheet
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Rev. 03 — 9 October 2008
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PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
Table 5.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Ptot
Parameter
Conditions
total power dissipation
Tamb ≤ 25 °C
Min
Max
Unit
[1]
-
290
mW
[2]
-
370
mW
[3]
-
450
mW
[1]
-
420
mW
[2]
-
560
mW
[3]
Per device
total power dissipation
Ptot
Tamb ≤ 25 °C
-
700
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
006aaa493
800
(1)
Ptot
(mW)
600
(2)
(3)
400
200
0
0
40
80
120
160
Tamb (°C)
(1) Ceramic PCB, Al2O3, standard footprint
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig 1.
Power derating curves
PBSS5160DS_3
Product data sheet
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Rev. 03 — 9 October 2008
3 of 14
PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
-
-
431
K/W
[2]
-
-
338
K/W
[3]
-
-
278
K/W
-
-
105
K/W
[1]
-
-
298
K/W
[2]
-
-
223
K/W
[3]
-
-
179
K/W
Per transistor
thermal resistance from
junction to ambient
Rth(j-a)
in free air
thermal resistance from
junction to solder point
Rth(j-sp)
Per device
thermal resistance from
junction to ambient
Rth(j-a)
in free air
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
006aaa494
103
Zth(j-a)
(K/W)
δ=1
0.75
0.50
0.33
102
0.20
0.10
0.05
10
0.02
0.01
0
1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 2.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PBSS5160DS_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 9 October 2008
4 of 14
PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
006aaa495
103
Zth(j-a)
(K/W)
δ=1
0.75
0.50
102
0.20
0.33
0.10
0.05
10
0.02
0.01
0
1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, mounting pad for collector 1 cm2
Fig 3.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aaa496
103
Zth(j-a)
(K/W)
δ=1
0.75
102
0.50
0.20
0.33
0.10
0.05
10
0.02
0.01
0
1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
Ceramic PCB, Al2O3, standard footprint
Fig 4.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PBSS5160DS_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 9 October 2008
5 of 14
PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Per transistor
ICBO
collector-base cut-off
current
VCB = −60 V; IE = 0 A
-
-
−100
nA
VCB = −60 V; IE = 0 A;
Tj = 150 °C
-
-
−50
µA
-
-
−100
nA
-
-
−100
nA
ICES
collector-emitter cut-off VCE = −60 V; VBE = 0 V
current
IEBO
emitter-base cut-off
current
VEB = −5 V; IC = 0 A
hFE
DC current gain
VCE = −5 V; IC = −1 mA
VCEsat
collector-emitter
saturation voltage
200
350
-
VCE = −5 V; IC = −500 mA
[1]
150
250
-
VCE = −5 V; IC = −1 A
[1]
100
160
-
-
−110
−165
mV
IC = −100 mA; IB = −1 mA
IC = −500 mA; IB = −50 mA
IC = −1 A; IB = −100 mA
−120
−175
mV
-
−250
−330
mV
[1]
-
−0.95 −1.1
V
mΩ
VBEsat
base-emitter saturation IC = −1 A; IB = −50 mA
voltage
RCEsat
collector-emitter
saturation resistance
IC = −1 A; IB = −100 mA
[1]
-
250
VBEon
base-emitter turn-on
voltage
IC = −1 A; VCE = −5 V
[1]
-
−0.82 −0.9
V
td
delay time
-
11
ns
tr
rise time
IC = −0.5 A; IBon = −25 mA;
IBoff = 25 mA
-
30
-
ns
ton
turn-on time
-
41
-
ns
ts
storage time
-
205
-
ns
tf
fall time
-
55
-
ns
toff
turn-off time
-
260
-
ns
fT
transition frequency
VCE = −10 V; IC = −50 mA;
f = 100 MHz
150
185
-
MHz
Cc
collector capacitance
VCB = −10 V; IE = ie = 0 A;
f = 1 MHz
-
9
15
pF
[1]
330
-
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PBSS5160DS_3
Product data sheet
[1]
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 9 October 2008
6 of 14
PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
006aaa474
600
006aaa478
−2.0
IB (mA) = −35.0
−31.5
−28.0
−24.5
−21.0
IC
(A)
(1)
hFE
−1.6
400
(2)
−17.5
−14.0
−10.5
−1.2
−7.0
−0.8
−3.5
(3)
200
−0.4
0
−10−1
−1
−10
−102
0.0
−103
−104
IC (mA)
0
VCE = −5 V
−1
−2
−3
−4
−5
VCE (V)
Tamb = 25 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig 5.
DC current gain as a function of collector
current; typical values
006aaa476
−1.0
Fig 6.
Collector current as a function of
collector-emitter voltage; typical values
006aaa477
−1.1
VBEsat
(V)
VBE
(V)
−0.9
−0.8
(1)
(1)
−0.7
(2)
(2)
−0.6
−0.5
(3)
(3)
−0.4
−0.3
−0.2
−10−1
−1
−10
−102
−103
−104
IC (mA)
−0.1
−10−1
VCE = −5 V
−1
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
(3) Tamb = 100 °C
Base-emitter voltage as a function of collector
current; typical values
Fig 8.
−103
−104
IC (mA)
Base-emitter saturation voltage as a function
of collector current; typical values
PBSS5160DS_3
Product data sheet
−102
IC/IB = 20
(1) Tamb = −55 °C
Fig 7.
−10
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 9 October 2008
7 of 14
PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
006aaa489
−1
006aaa490
−1
VCEsat
(V)
VCEsat
(V)
−10−1
−10−1
(1)
(2)
(1)
(2)
(3)
(3)
−10−2
−10−1
−1
−10
−102
−103
−104
IC (mA)
−10−2
−10−1
−1
−102
−103
−104
IC (mA)
Tamb = 25 °C
IC/IB = 20
(1) Tamb = 100 °C
(1) IC/IB = 100
(2) Tamb = 25 °C
(2) IC/IB = 50
(3) Tamb = −55 °C
(3) IC/IB = 10
Fig 9.
−10
Collector-emitter saturation voltage as a
function of collector current; typical values
006aaa491
103
Fig 10. Collector-emitter saturation voltage as a
function of collector current; typical values
006aaa492
103
RCEsat
(Ω)
RCEsat
(Ω)
102
102
10
10
(1)
(1)
(2)
(3)
1
10−1
−10−1
−1
−10
−102
(2)
1
(3)
−103
−104
IC (mA)
10−1
−10−1
−1
−102
−103
−104
IC (mA)
Tamb = 25 °C
IC/IB = 20
(1) Tamb = 100 °C
(1) IC/IB = 100
(2) Tamb = 25 °C
(2) IC/IB = 50
(3) Tamb = −55 °C
(3) IC/IB = 10
Fig 11. Collector-emitter saturation resistance as a
function of collector current; typical values
Fig 12. Collector-emitter saturation resistance as a
function of collector current; typical values
PBSS5160DS_3
Product data sheet
−10
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 9 October 2008
8 of 14
PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
8. Test information
− IB
input pulse
(idealized waveform)
90 %
− I Bon (100 %)
10 %
− I Boff
output pulse
(idealized waveform)
− IC
90 %
− I C (100 %)
10 %
t
td
ts
tr
t on
tf
t off
006aaa266
Fig 13. BISS transistor switching time definition
VBB
RB
VCC
RC
Vo
(probe)
oscilloscope
450 Ω
(probe)
450 Ω
oscilloscope
R2
VI
DUT
R1
mgd624
IC = −0.5 A; IBon = −25 mA; IBoff = 25 mA; R1 = open; R2 = 100 Ω; RB = 300 Ω; RC = 20 Ω
Fig 14. Test circuit for switching times
PBSS5160DS_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 9 October 2008
9 of 14
PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
9. Package outline
3.1
2.7
6
3.0
2.5
1.7
1.3
1.1
0.9
5
4
2
3
0.6
0.2
pin 1 index
1
0.40
0.25
0.95
0.26
0.10
1.9
Dimensions in mm
04-11-08
Fig 15. Package outline SOT457 (SC-74)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package Description
PBSS5160DS SOT457
3000
10000
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-165
[1]
For further information and the availability of packing methods, see Section 14.
[2]
T1: normal taping
[3]
T2: reverse taping
PBSS5160DS_3
Product data sheet
Packing quantity
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 9 October 2008
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PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
11. Soldering
3.45
1.95
0.45 0.55
(6×) (6×)
0.95
solder lands
solder resist
3.3 2.825
0.95
solder paste
occupied area
0.7
(6×)
Dimensions in mm
0.8
(6×)
2.4
sot457_fr
Fig 16. Reflow soldering footprint SOT457 (SC-74)
5.3
1.5
(4×)
solder lands
1.475
0.45
(2×)
5.05
solder resist
occupied area
1.475
Dimensions in mm
preferred transport
direction during soldering
1.45
(6×)
2.85
sot457_fw
Fig 17. Wave soldering footprint SOT457 (SC-74)
PBSS5160DS_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 9 October 2008
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PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PBSS5160DS_3
20081009
Product data sheet
-
PBSS5160DS_2
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Figure 9: amended
Section 13 “Legal information”: updated
PBSS5160DS_2
20050628
Product data sheet
-
PBSS5160DS_1
PBSS5160DS_1
20040716
Objective data sheet
-
-
PBSS5160DS_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 9 October 2008
12 of 14
PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PBSS5160DS_3
Product data sheet
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Rev. 03 — 9 October 2008
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PBSS5160DS
NXP Semiconductors
60 V, 1 A PNP/PNP low VCEsat (BISS) transistor
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Packing information. . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 9 October 2008
Document identifier: PBSS5160DS_3
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