TM CROSSLINKTM Programmable ASSP (pASSPTM) Interface Bridges Lattice has combined the flexibility and fast time to market advantage of an FPGA with the power and efficiency of an ASSP to create a new product class called programmable ASSP (pASSP). This gives designers the best of both worlds by delivering the most flexible, highest bandwidth, lowest power and smallest footprint solutions for several high-growth market segments. The CrossLink solution is the industry’s first programmable bridging device that resolves interface mismatches between mobile application processors, image sensors, and displays. This makes it the optimal solution for VR headsets, drones, smartphones, tablets, cameras, wearable devices, human machine interfaces (HMIs), and more. Key Features ■■ World’s fastest MIPI® D-PHY bridging device that delivers up to 4K UHD resolution at 12 Gbps bandwidth ■■ Supports popular mobile, camera, display and legacy interfaces such as MIPI D-PHY, MIPI CSI-2, MIPI DSI, MIPI DPI, CMOS, and SubLVDS, LVDS, and more ■■ Industry’s smallest package size with a 6 mm2 option Device LUTs ■■ Lowest power programmable bridging solution in active mode. Built-in sleep mode. ■■ Takes the strongest features from ASSPs and FPGAs to deliver the best solution of both worlds LIF-MD6000-36 LIF-MD6000-64 LIF-MD6000-81 LIF-MD6000-80 5936 5936 5936 5936 Embedded Memory kbits 180 180 180 180 Distrib. RAM kbits 47 47 47 47 GPLL 1 1 1 1 D-PHY PLL 1 2 2 2 Embedded I C Blocks 2 Embedded RX/TX MIPI D-PHY 48MHz Oscillator 10kHz Oscillator 2 2 2 2 1 (4 Data + 1 Clock) 2 (8 Data + 2 Clock) 2 (8 Data + 2 Clock) 2 (8 Data + 2 Clock) 1 1 1 1 1 1 1 1 NVCM Yes Yes Yes Yes Dual Boot Yes Yes Yes Yes Power Management Unit Yes Yes Yes Yes Low Power Sleep Mode Typical Operational Power Footprint Package Pitch Yes Yes Yes Yes 5mW – 135mW 5mW – 135mW 5mW – 135mW 5mW – 135mW 2.5 mm x 2.5 mm 3.5 mm x 3.5 mm 4.5 mm x 4.5 mm 6.5 mm x 6.5 mm 0.4 mm 0.4 mm 0.5 mm 0.65 mm GPIO 7 8 9 8 I/O 17 29 37 36 LATTICESEMI.COM TM Key Applications Image Sensor Applications Lattice’s CrossLink device can multiplex, merge and arbitrate between multiple image sensors to a single input. The device can also interface between high-end industrial and popular A/V image sensors with mobile application processors. This is ideal for 360, action, surveillance and DSLR cameras along with drones and augmented reality products. Display Applications With the CrossLink bridge it’s possible to receive video data from one MIPI DSI interface and send it out over two MIPI DSI interfaces at half the bandwidth. The same video stream can be split to two multiple interfaces that’s ideal for virtual reality headsets and mobile set top boxes. Customers can also integrate consumer and industrial panels with RGB or LVDS interfaces with mobile applications processors. The CrossLink solution can convert from MIPI DSI to multiple lanes of CMOS or LVDS interfaces such as MIPI DPI, OpenLDI and proprietary interface formats for HMIs, smart displays and smart homes. Applications Support www.latticesemi.com/support Copyright © 2016 Lattice Semiconductor Corporation, Lattice Semiconductor (& design), CrossLink, pASSP, and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. May 2016 I0254 Rev. 1 LATTICESEMI.COM