CrossLink Product Brochure

TM
CROSSLINKTM
Programmable ASSP (pASSPTM) Interface Bridges
Lattice has combined the flexibility and fast time to market advantage of an FPGA with the power and efficiency of
an ASSP to create a new product class called programmable ASSP (pASSP). This gives designers the best of both
worlds by delivering the most flexible, highest bandwidth, lowest power and smallest footprint solutions for several
high-growth market segments.
The CrossLink solution is the industry’s first programmable bridging device that resolves interface mismatches
between mobile application processors, image sensors, and displays. This makes it the optimal solution for VR
headsets, drones, smartphones, tablets, cameras, wearable devices, human machine interfaces (HMIs), and more.
Key Features
■■ World’s fastest MIPI® D-PHY bridging device that
delivers up to 4K UHD resolution at 12 Gbps
bandwidth
■■ Supports popular mobile, camera, display and
legacy interfaces such as MIPI D-PHY, MIPI CSI-2,
MIPI DSI, MIPI DPI, CMOS, and SubLVDS, LVDS,
and more
■■ Industry’s smallest package size with a 6 mm2
option
Device
LUTs
■■ Lowest power programmable bridging solution in
active mode. Built-in sleep mode.
■■ Takes the strongest features from ASSPs and
FPGAs to deliver the best solution of both worlds
LIF-MD6000-36
LIF-MD6000-64
LIF-MD6000-81
LIF-MD6000-80
5936
5936
5936
5936
Embedded Memory
kbits
180
180
180
180
Distrib. RAM
kbits
47
47
47
47
GPLL
1
1
1
1
D-PHY PLL
1
2
2
2
Embedded I C Blocks
2
Embedded RX/TX MIPI D-PHY
48MHz Oscillator
10kHz Oscillator
2
2
2
2
1 (4 Data + 1 Clock)
2 (8 Data + 2 Clock)
2 (8 Data + 2 Clock)
2 (8 Data + 2 Clock)
1
1
1
1
1
1
1
1
NVCM
Yes
Yes
Yes
Yes
Dual Boot
Yes
Yes
Yes
Yes
Power Management Unit
Yes
Yes
Yes
Yes
Low Power Sleep Mode
Typical Operational Power
Footprint
Package Pitch
Yes
Yes
Yes
Yes
5mW – 135mW
5mW – 135mW
5mW – 135mW
5mW – 135mW
2.5 mm x 2.5 mm
3.5 mm x 3.5 mm
4.5 mm x 4.5 mm
6.5 mm x 6.5 mm
0.4 mm
0.4 mm
0.5 mm
0.65 mm
GPIO
7
8
9
8
I/O
17
29
37
36
LATTICESEMI.COM
TM
Key Applications
Image Sensor Applications
Lattice’s CrossLink device can multiplex,
merge and arbitrate between multiple image
sensors to a single input. The device can
also interface between high-end industrial
and popular A/V image sensors with mobile
application processors. This is ideal for 360,
action, surveillance and DSLR cameras along
with drones and augmented reality products.
Display Applications
With the CrossLink bridge it’s possible to
receive video data from one MIPI DSI interface
and send it out over two MIPI DSI interfaces
at half the bandwidth. The same video stream
can be split to two multiple interfaces that’s
ideal for virtual reality headsets and mobile set
top boxes.
Customers can also integrate consumer and
industrial panels with RGB or LVDS interfaces
with mobile applications processors. The
CrossLink solution can convert from MIPI DSI
to multiple lanes of CMOS or LVDS interfaces
such as MIPI DPI, OpenLDI and proprietary
interface formats for HMIs, smart displays and
smart homes.
Applications Support
www.latticesemi.com/support
Copyright © 2016 Lattice Semiconductor Corporation, Lattice Semiconductor (& design), CrossLink, pASSP, and specific product designations are either registered trademarks or trademarks of Lattice
Semiconductor Corporation or its subsidiaries in the United States and/or other countries. Other product names used in this publication are for identification purposes only and may be trademarks of their
respective companies.
May 2016
I0254 Rev. 1
LATTICESEMI.COM
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