Reliability Report

AOS Semiconductor
Product Reliability Report
AOK60N30,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AOK60N30.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AOK60N30
passes AOS quality and reliability requirements.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOK60N30 is fabricated using an advanced high voltage MOSFET process that is
designed to deliver high levels of performance and robustness in popular AC-DC applications.
By providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability this part
can be adopted quickly into new and existing offline power supply designs.
-RoHS Compliant
-Halogen-Free
Detailed information refers to datasheet.
II. Die / Package Information:
AOK60N30
Standard sub-micron
300V N channel MOSFET
Package Type
TO247
Lead Frame
Bare Cu
Die Attach
Soft Solder
Bonding
Al wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Process
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AOK60N30
Test Item
Test Condition
Time
Point
Lot
Attribution
Total
Sample
size
Number
of
Failures
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
reflow@260°c
HTGB
-
15 lots
3234pcs
0
JESD22A113
Temp = 150 c,
Vgs=100% of
Vgsmax
168hrs
500 hrs
1000 hrs
462pcs
0
3 lots
3 lots
JESD22A108
Temp = 150 c,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
77pcs / lot
462pcs
0
3 lots
3 lots
JESD22A108
HAST
130 c, 85%RH,
33.3 psi, Vgs =
100% of Vgs max
96 hrs
12 lots
77pcs / lot
924pcs
0
JESD22A110
Pressure Pot
121c, 29.7psi,
RH=100%
96 hrs
(Note A*)
15 lots
77 pcs / lot
1155pcs
0
JESD22A102
Temperature
Cycle
-65c to 150c,
air to air
250 / 500
cycles
(Note A*)
15 lots
77 pcs / lot
1155pcs
0
JESD22A104
(Note A*)
77 pcs / lot
HTRB
Standard
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 5.09
MTTF = 22440 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AOK60N30). Failure Rate Determination is
based on JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
9
= 1.83 x 10 / [2x (6x77x500 +6x77x1000) x259] = 5.09
9
8
MTTF = 10 / FIT = 1.97 x 10 hrs = 22440 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
259
88
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
-5
K = Boltzmann’s constant, 8.617164 X 10 eV / K
130 deg C
150 deg C
2.59
1