LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only OVAL TYPE LED LAMPS Pb Lead-Free Parts LWK22842Z/S16-A01/TBS-2 DATA SHEET DOC. NO : QW0905- LWK22842Z/S16-A01/TBS-2 REV. : A DATE : 11 -Oct. - 2011 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/7 PART NO. LWK22842Z/S16-A01/TBS-2 Package Dimensions P2 ΔH H2 W2 H1 L W0 W1 D P1 W3 - + F P T LWK22842Z/S16-A01/TBS-2 4.0 3.8 6.3 9.6±0.5 1.5MAX 25.0MIN □0.5 TYP Zener - + 2.54TYP 1.0MIN Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. WK LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK22842Z/S16-A01/TBS-2 Page 2/7 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT WK Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 120 mW Reverse Current @5V Ir 50 μA Electrostatic Discharge ESD 8000 V Operating Temperature Topr -20~ +80 ℃ Storage Temperature Tstg -30~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LWK22842Z/S16-A01/TBS-2 InGaN/GaN White Lens Water Clear Chromaticity Coordinates X 0.31 Y 0.31 Forward Luminous Viewing voltage intensity angle @20mA(V) @20mA(mcd) 2θ 1/2 (deg) Typ. Max. Min. Typ. 3.1 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 3.4 1800 2200 Horizontal Axis 76 ° Vertical Axis 100 ° LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK22842Z/S16-A01/TBS-2 Page 3/7 . Chromaticity Coordinates Specifications for Bin Grading BIN B5 C1 C2 X Y 0.30 0.325 0.30 0.285 0.31 0.300 0.31 0.340 0.31 0.340 0.31 0.300 0.32 0.315 0.32 0.355 0.32 0.355 0.32 0.315 0.33 0.330 0.33 0.370 . CIE Chromaticity Diagram Group Min Max A24 1800 2200 A25 2200 2700 A26 2700 3400 A27 3400 4000 A28 4000 5000 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK22842Z/S16-A01/TBS-2 Page 4/7 SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.3 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 TBS-2 H1 0.85 22.5 0.89 Feed Hole To Overall Component Height ------- H2 ------- 36 1.42 Lead Length After Component Height ------- L 11 0.43 Feed Hole Pitch ------- P 12.4 0.49 13 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 Feed Hole To Bottom Of Component 21.5 ------- W0 REMARK:TBS=Tape And Box Straight Leads • Dimensions Symbol Information • Package Dimensions Specification Description Overall Width Symbol minimum maxmum mm inch mm inch L 330 13.0 340 13.4 W 265 10.4 275 10.8 H 50 1.97 60 2.4 Part No. Quantity/Box LWK22842Z/S16-A01/TBS-2 2500PCS W L H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK22842Z/S16-A01/TBS-2 Page 5/7 Typical Electro-Optical Characteristics Curve WK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 400 320 3 240 IV(mcd) Forward Voltage(V) 4 2 160 1 80 0 0 20 0 40 60 80 0 100 20 Forward Current(mA) Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 100 80 Current(mA) Fig.3 Forward Voltage vs. Temperature -40 60 40 80 100 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.6 Directivity Radiation Fig.5 Relative Intensity vs.Wavelength(Ta=25 ℃) 4000 3500 Vertical Axis 100° 3000 -30° 2500 Intensity Horizontal Axis 76 ° 0° 30° 2000 1500 -60° 60° 1000 500 0 100% 75% 50% 420 430 440 450 460 470 480 490 500 510 520 540 Wavelength (nm) 25% 0 25% 50% 75% 100% Radiation Angle(0.5):H 76Degree/V 100 Degree 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK22842Z/S16-A01/TBS-2 Page 6/7 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 60seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LWK22842Z/S16-A01/TBS-2 Page7/7 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11