lhy2643-t5-a-pf.pdf

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SUPER BRIGHT ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LHY2643/T5/A-PF
DATA SHEET
DOC. NO :
QW0905-LHY2643/T5/A-PF
REV.
:
A
DATE
: 22 - Jan. - 2016
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHY2643/T5/A-PF
Page 1/7
Package Dimensions
2.9
3.3
3.1
4.3
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHY2643/T5/A-PF
Page 2/7
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
HY
Forward Current
IF
25
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
60
mA
Power Dissipation
PD
65
mW
Ir
10
μA
Electrostatic Discharge( * )
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Reverse Current @5V
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
MATERIAL
COLOR
Emitted
LHY2643/T5/A-PF
AlGaInP
Lens
Yellow Water Clear
Luminous Viewing
Dominant Spectral Forward
voltage
intensity
angle
wave halfwidth
@20mA(V)
@5mA(mcd)
2
θ 1/2
length
△λ nm
(deg)
λDnm
Min. Max. Min. Typ.
595
15
1.7
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
2.6
50
90
40
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/7
PART NO.LHY2643/T5/A-PF
Brightness Code For Standard LED Lamps
HY CHIP
Group
Luminous Intensity(mcd) at 5 mA
Min.
Max.
A10
50
65
A11
65
90
A12
90
120
A13
120
160
A14
160
220
A15
220
300
Color Code
HY CHIP
Group
Wave length(nm) at 5 mA
Min.
Max.
15
585
587
16
587
589
17
589
592
18
592
595
19
595
598
20
598
600
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page4/7
PART NO. LHY2643/T5/A-PF
Typical Electro-Optical Characteristics Curve
HY CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
1.5
2.5
3.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
100
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
100
650
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHY2643/T5/A-PF
Page 5/7
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHY2643/T5/A-PF
Page 6/7
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
Page 7/7
PACKING SPECIFICATION
1. 1000PCS / BAG
2. 8 BAG / INNER BOX
SIZE : L X W X H 33cm X 19cm X 8cm
L
W
H
3. 12 INNER BOXES / CARTON
SIZE : L X W X H 58cm X 34cm X 34cm
L
W
C/NO:
MADE IN CHINA
.
NO
M
IT E Y :
Q'T ,:
W :
N,
,
W
G,
S
PC
s
kg
s
kg
H