Datenblatt

5081
SMT Board-to-Board Verbinder RM 0,80mm
SMT Board-to-Board Connectors, 0.80mm Pitch
Technische Daten / Technical Data
Isolierkörper
Thermoplastischer Kunststoff, nach UL94 V-0
Insulator
Thermoplastic, rated UL94 V-0
Farbe
Weiss
Colour
White
Kontaktmaterial
Kupferlegierung
Contact Material
Copper alloy
Kontaktoberfläche
Lt. Oberflächenoptionen, über Ni
Contact Surface
Acc. to options (see below), over Ni
Lötbarkeit
IEC 60512-12A
Solderability
IEC 60512-12A
Durchgangswiderstand
< 20mΩ
Contact Resistance
< 20mΩ
Isolationswiderstand
> 1000MΩ
Insulation Resistance
> 1000MΩ
Spannungsfestigkeit
300VAC/DC
Test Voltage
300VAC/DC
Nennstrom
500 mA
Current Rating
500 mA
Temperaturbereich
-40°C ... +105°C
Temperature Range
-40°C ... +105°C
Verarbeitung
Reflow-Lötverfahren
Processing
Reflow soldering
Series
5081
Stiftleiste
Plug
wppro.com/serie-XXX
wppro.com/series-XXX
Type *
01
01 L=2.80 L1=1.80 L2=1.35mm
02 L=3.30 L1=1.80 L2=1.35mm
03 L=3.80 L1=1.80 L2=1.35mm
04 L=4.30 L1=2.30 L2=1.35mm
05 L=4.80 L1=2.30 L2=1.35mm
06 L=5.30 L1=2.30 L2=1.35mm
07 L=5.30 L1=2.30 L2=1.25mm
Contacts *
40
08-50
© W+P PRODUCTS
Plating *
00
00 Vergoldet
Gold plated
Packaging *
ST
ST
TR (Option)
TEL +49 5223 98507-0
E-MAIL [email protected]
5081
SMT Board-to-Board Verbinder RM 0,80mm
SMT Board-to-Board Connectors, 0.80mm Pitch
Mating
Heights:
Series
5081
Buchsenleiste
Female Headers
* Dies ist ein Bestellbeispiel bitte durch Ihre Spezifikationen ersetzen.
* This is an order example please replace by your specifications.
wppro.com/serie-XXX
wppro.com/series-XXX
Type *
08
08 L=2.90 L1=1.65mm
09 L=3.40 L1=1.65mm
10 L=3.90 L1=1.65mm
11 L=3.90 L1=1.25mm
Contacts *
40
08-50
Female
Male
Type 08
Type 09
Type 10
Type 11
Type 01
4.00mm
-
-
-
Type 02
4.50mm
-
-
-
Type 03
5.00mm
-
-
-
Type 04
-
5.50mm
-
-
Type 05
-
6.00mm
-
-
Type 06
-
6.50mm
7.00mm
-
Type 07
-
-
-
7.00mm
Plating
00
00 Vergoldet
Gold plated
Packing *
ST
ST
TR (Option)
Lieferformen / Packaging Options:
ST In Stangen ohne Pick&Place-Pads / In tubes w/o Pick&Place-Pads
TR (Option) Tape & Reel / Tape & Reel
TEL +49 5223 98507-0
E-MAIL [email protected]
Informationen zum Reflow-Lötverfahren
Reflow Soldering Information
Reflow-Lötempfehlung
Reflow Soldering Recommendation
Die Bauteile sollten gemäß folgendem TemperaturProfil in Anlehnung an die IPC/JEDEC J-STD-020C für
bleifreies Löten im Reflow-Verfahren verarbeitet werden
(Maximalwerte).
Items should be soldered according to IPC/JEDEC JSTD-020C temperature profile for leadfree reflow soldering
(maximum values).
wppro.com/serie-XXX
wppro.com/series-XXX
Profileigenschaft
Kennwert
Temperatur Minimum TSmin
150°C
Temperatur Maximum TSmax
200°C
Dauer TSmin - TSmax
60-180s
Temperatur Lötbereich TL
217°C
Verweildauer oberhalb TL
60-180s
Ramp-Up Rate TSmax - TP
max. 3°C / s
Höchsttemperatur TP
260°C ±5
Dauer Höchsttemperatur
20-40s
Ramp-Down Rate TPmax - TSmin
6°C / s
Dauer 25°C - Höchsttemperatur TP
Max. 8 min
Profile Feature
Key Values
Minimum Temperature TSmin
150°C
Maximum Temperatur TSmax
200°C
Duration TSmin - TSmax
60-180s
Soldering Range Temperature TL
217°C
Duration above TL
60-180s
Ramp-Up Rate TSmax - TP
max. 3°C / s
Peak Temperature TP
260°C ±5
Duration Peak Temperature
20-40s
Ramp-Down Rate TPmax - TSmin
6°C / s
Duration 25°C - Peak Temp. TP
Max. 8min
TEL +49 5223 98507-0
E-MAIL [email protected]
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