0629_CU60F_FSET_LPC

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Reliability Engineering Report Summary Sheet
0.35um Process Technology
Flash-MCU
(Fujitsu Semiconductor Technology)
Package Type: LQFP
0629
FML Quality Assurance Division
Fujitsu Microelectronics Limited Confidential
2/3
Reliability Test
Device Type
Package Type
: MB91F376G
: Plastic LQFP-120 Package
Test Item
Test Condition
Tested
Number
Tested Failed
Time Number
High Temperature
Operation Life
高温連続動作試験
125 ℃
6.0V
CLK FREQ.= 500Hz
231
(a) 1000h
(77×3Lot)
0
Temperature Humidity Bias
高湿連続動作試験
85 ℃ / 85% RH
6.0V
CLK FREQ.= 500Hz
138
(a) 1000h
(46×3Lot)
0
150 ℃
231
(a) 1000h
(77×3Lot)
0
Temperature Cycling
温度サイクル
–65℃~150℃
231
(a) 200cyc
(77×3Lot)
0
Pressure Cooker Test
121℃, 100%RH: 2.03E5 Pa
231
(a)
(77×3Lot)
168h
0
(a)
130℃, 85%RH: 2.33E5 Pa
99
6.0V
(33×3Lot)
96h
0
High Temperature Storage
高温保存試験
Pressure Cooker Test
with Bias
(a) Pre-condition: Baking (125℃, 24h) +Moisture Absorption (30℃/80%RH, 72h) +IR 240℃ Max.
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FML Quality Assurance Division
Fujitsu Microelectronics Limited Confidential
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Data Retention Test
Device Type
: MB91F376G
Test Item
Data Retention Bake (WLB)
(ウェーハレベル)
Test Condition
Number
Tested
Tested
Time
Number
Failed
250 ℃
(Data pattern all’0’)
231
168h
0
Endurance Test
Device Type
Package Type
Test Item
Endurance Test
書き換え試験
: MB91F376G
: LQFP-120
Test Condition
Number
Tested
Tested
Time
Number
Failed
125 ℃, 5.5 V
231
10,000 times
0
0629
FML Quality Assurance Division
Fujitsu Microelectronics Limited Confidential
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