１／３ Reliability Engineering Report Summary Sheet 0.35um Process Technology Flash-MCU （Fujitsu Semiconductor Technology） Package Type: LQFP 0629 FML Quality Assurance Division Fujitsu Microelectronics Limited Confidential ２／３ Reliability Test Device Type Package Type : MB91F376G : Plastic LQFP-120 Package Test Item Test Condition Tested Number Tested Failed Time Number High Temperature Operation Life 高温連続動作試験 125 ℃ 6.0V CLK FREQ.= 500Hz 231 (a) 1000h (77×3Lot) 0 Temperature Humidity Bias 高湿連続動作試験 85 ℃ / 85% RH 6.0V CLK FREQ.= 500Hz 138 (a) 1000h (46×3Lot) 0 150 ℃ 231 (a) 1000h (77×3Lot) 0 Temperature Cycling 温度サイクル –65℃～150℃ 231 (a) 200cyc (77×3Lot) 0 Pressure Cooker Test 121℃, 100%RH: 2.03E5 Pa 231 (a) (77×3Lot) 168h 0 (a) 130℃, 85%RH: 2.33E5 Pa 99 6.0V (33×3Lot) 96h 0 High Temperature Storage 高温保存試験 Pressure Cooker Test with Bias (a) Pre-condition: Baking (125℃, 24h) +Moisture Absorption (30℃/80%RH, 72h) +IR 240℃ Max. 0629 FML Quality Assurance Division Fujitsu Microelectronics Limited Confidential ３／３ Data Retention Test Device Type : MB91F376G Test Item Data Retention Bake (WLB) （ウェーハレベル） Test Condition Number Tested Tested Time Number Failed 250 ℃ (Data pattern all’0’) 231 168h 0 Endurance Test Device Type Package Type Test Item Endurance Test 書き換え試験 : MB91F376G : LQFP-120 Test Condition Number Tested Tested Time Number Failed 125 ℃, 5.5 V 231 10,000 times 0 0629 FML Quality Assurance Division Fujitsu Microelectronics Limited Confidential