1/4 信頼性試験成績書 Plastic DIP, SDIP, SOP, TSSOP Package （南通組立品） 0630 FML Quality Assurance Division Fujitsu Microelectronics Limited Confidential 2/4 Reliability Test 1 Device Type Package Type : MB95F274H : SOP-8 Test Item Test Condition Number Tested 150 ℃ 78 Temperature Cycling 温度サイクル –65 ℃～150 ℃ Pressure Cooker Test 121℃,100%RH:2.03E5Pa High Temperature Storage 高温保存試験 Tested Time Number Failed (a) 1000h 0 78 (a) 200cyc 0 78 (a) 168h 0 (a) Pre-condition: Baking (125℃, 24h) +Moisture Absorption (30℃/80%RH, 192h) + IR 260℃ Max. +Moisture Absorption (30℃/80%RH, 168h) + IR 260℃ Max. Reliability Test 2 Device Type Package Type : MB95F284H : SOP-16 Test Item Test Condition Number Tested 150 ℃ 78 Temperature Cycling 温度サイクル –65 ℃～150 ℃ Pressure Cooker Test 121℃,100%RH:2.03E5Pa High Temperature Storage 高温保存試験 Tested Time Number Failed (b) 1000h 0 78 (b) 200cyc 0 78 (b) 168h 0 (b) Pre-condition: Baking (125℃, 24h) +Moisture Absorption (30℃/80%RH, 192h) + IR 260℃ Max. +Moisture Absorption (30℃/80%RH, 168h) + IR 260℃ Max. 0630 FML Quality Assurance Division Fujitsu Microelectronics Limited Confidential 3/4 Reliability Test 3 Device Type Package Type : MB95F264H : SOP-20 Test Item Test Condition Number Tested 150 ℃ 78 Temperature Cycling 温度サイクル –65 ℃～150 ℃ Pressure Cooker Test 121℃,100%RH:2.03E5Pa High Temperature Storage 高温保存試験 Tested Time Number Failed (c) 1000h 0 78 (c) 200cyc 0 78 (c) 168h 0 (c) Pre-condition: Baking (125℃, 24h) +Moisture Absorption (30℃/80%RH, 192h) + IR 260℃ Max. +Moisture Absorption (30℃/80%RH, 168h) + IR 260℃ Max. Reliability Test 4 Device Type Package Type : MB95F264H : TSSOP-20 Test Item Test Condition Number Tested 150 ℃ 78 Temperature Cycling 温度サイクル –65 ℃～150 ℃ Pressure Cooker Test 121℃,100%RH:2.03E5Pa High Temperature Storage 高温保存試験 Tested Time Number Failed (d) 1000h 0 78 (d) 200cyc 0 78 (d) 168h 0 (d) Pre-condition: Baking (125℃, 24h) +Moisture Absorption (30℃/80%RH, 192h) + IR 260℃ Max. +Moisture Absorption (30℃/80%RH, 168h) + IR 260℃ Max. 0630 FML Quality Assurance Division Fujitsu Microelectronics Limited Confidential 4/4 Reliability Test 5 Device Type Package Type : MB95F264H : SDIP-24 Test Item Test Condition Number Tested Tested Time Number Failed 150 ℃ 78 1000h 0 Temperature Cycling 温度サイクル –65 ℃～150 ℃ 78 200cyc 0 Pressure Cooker Test 121℃,100%RH:2.03E5Pa 78 168h 0 Test Condition Number Tested Tested Time Number Failed 150 ℃ 78 1000h 0 Temperature Cycling 温度サイクル –65 ℃～150 ℃ 78 200cyc 0 Pressure Cooker Test 121℃,100%RH:2.03E5Pa 78 168h 0 High Temperature Storage 高温保存試験 Reliability Test 6 Device Type Package Type : MB95F284H : DIP-16 Test Item High Temperature Storage 高温保存試験 0630 FML Quality Assurance Division Fujitsu Microelectronics Limited Confidential