0630_DIP_SDIP_SOP_TSSOP

1/4
信頼性試験成績書
Plastic DIP, SDIP, SOP, TSSOP Package
(南通組立品)
0630
FML Quality Assurance Division
Fujitsu Microelectronics Limited Confidential
2/4
Reliability Test 1
Device Type
Package Type
: MB95F274H
: SOP-8
Test Item
Test Condition
Number
Tested
150 ℃
78
Temperature Cycling
温度サイクル
–65 ℃~150 ℃
Pressure Cooker Test
121℃,100%RH:2.03E5Pa
High Temperature Storage
高温保存試験
Tested
Time
Number
Failed
(a)
1000h
0
78
(a)
200cyc
0
78
(a)
168h
0
(a) Pre-condition: Baking (125℃, 24h) +Moisture Absorption (30℃/80%RH, 192h) + IR 260℃ Max.
+Moisture Absorption (30℃/80%RH, 168h) + IR 260℃ Max.
Reliability Test 2
Device Type
Package Type
: MB95F284H
: SOP-16
Test Item
Test Condition
Number
Tested
150 ℃
78
Temperature Cycling
温度サイクル
–65 ℃~150 ℃
Pressure Cooker Test
121℃,100%RH:2.03E5Pa
High Temperature Storage
高温保存試験
Tested
Time
Number
Failed
(b)
1000h
0
78
(b)
200cyc
0
78
(b)
168h
0
(b) Pre-condition: Baking (125℃, 24h) +Moisture Absorption (30℃/80%RH, 192h) + IR 260℃ Max.
+Moisture Absorption (30℃/80%RH, 168h) + IR 260℃ Max.
0630
FML Quality Assurance Division
Fujitsu Microelectronics Limited Confidential
3/4
Reliability Test 3
Device Type
Package Type
: MB95F264H
: SOP-20
Test Item
Test Condition
Number
Tested
150 ℃
78
Temperature Cycling
温度サイクル
–65 ℃~150 ℃
Pressure Cooker Test
121℃,100%RH:2.03E5Pa
High Temperature Storage
高温保存試験
Tested
Time
Number
Failed
(c)
1000h
0
78
(c)
200cyc
0
78
(c)
168h
0
(c) Pre-condition: Baking (125℃, 24h) +Moisture Absorption (30℃/80%RH, 192h) + IR 260℃ Max.
+Moisture Absorption (30℃/80%RH, 168h) + IR 260℃ Max.
Reliability Test 4
Device Type
Package Type
: MB95F264H
: TSSOP-20
Test Item
Test Condition
Number
Tested
150 ℃
78
Temperature Cycling
温度サイクル
–65 ℃~150 ℃
Pressure Cooker Test
121℃,100%RH:2.03E5Pa
High Temperature Storage
高温保存試験
Tested
Time
Number
Failed
(d)
1000h
0
78
(d)
200cyc
0
78
(d)
168h
0
(d) Pre-condition: Baking (125℃, 24h) +Moisture Absorption (30℃/80%RH, 192h) + IR 260℃ Max.
+Moisture Absorption (30℃/80%RH, 168h) + IR 260℃ Max.
0630
FML Quality Assurance Division
Fujitsu Microelectronics Limited Confidential
4/4
Reliability Test 5
Device Type
Package Type
: MB95F264H
: SDIP-24
Test Item
Test Condition
Number
Tested
Tested
Time
Number
Failed
150 ℃
78
1000h
0
Temperature Cycling
温度サイクル
–65 ℃~150 ℃
78
200cyc
0
Pressure Cooker Test
121℃,100%RH:2.03E5Pa
78
168h
0
Test Condition
Number
Tested
Tested
Time
Number
Failed
150 ℃
78
1000h
0
Temperature Cycling
温度サイクル
–65 ℃~150 ℃
78
200cyc
0
Pressure Cooker Test
121℃,100%RH:2.03E5Pa
78
168h
0
High Temperature Storage
高温保存試験
Reliability Test 6
Device Type
Package Type
: MB95F284H
: DIP-16
Test Item
High Temperature Storage
高温保存試験
0630
FML Quality Assurance Division
Fujitsu Microelectronics Limited Confidential
Similar pages