Data Sheet

BC848 series
30 V, 100 mA NPN general-purpose transistors
Rev. 07 — 17 November 2009
Product data sheet
1. Product profile
1.1 General description
NPN general-purpose transistors in Surface Mounted Device (SMD) plastic packages.
Table 1.
Product overview
Type number
Package
NXP
JEITA
JEDEC
PNP
complement
BC848B
SOT23
-
TO-236AB
BC858B
BC848W
SOT323
SC-70
-
BC858W
1.2 Features
„ General-purpose transistors
„ SMD plastic packages
1.3 Applications
„ General-purpose switching and amplification
1.4 Quick reference data
Table 2.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter voltage
open base
-
-
30
V
IC
collector current
-
-
100
mA
hFE
DC current gain
BC848B
200
290
450
BC848W
110
-
800
VCE = 5 V;
IC = 2 mA
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
2. Pinning information
Table 3.
Pinning
Pin
Description
1
base
2
emitter
3
collector
Simplified outline
Symbol
3
3
1
1
2
006aaa144
2
sym021
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
BC848B
-
plastic surface mounted package; 3 leads
SOT23
BC848W
SC-70
plastic surface mounted package; 3 leads
SOT323
4. Marking
Table 5.
Marking codes
Type number
Marking code[1]
BC848B
1K*
BC848W
1M*
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
BC848_SER_7
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 07 — 17 November 2009
2 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
VCEO
collector-base voltage
open emitter
-
30
V
collector-emitter voltage
open base
-
30
V
VEBO
emitter-base voltage
open collector
-
5
V
IC
collector current
-
100
mA
ICM
peak collector current
single pulse;
tp ≤ 1 ms
-
200
mA
IBM
peak base current
single pulse;
tp ≤ 1 ms
-
200
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT23
-
250
mW
SOT323
-
200
mW
[1]
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1]
Min
Typ
Max
Unit
SOT23
-
-
500
K/W
SOT323
-
-
625
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
BC848_SER_7
Product data sheet
[1]
© NXP B.V. 2009. All rights reserved.
Rev. 07 — 17 November 2009
3 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Min
Typ
Max
Unit
collector-base cut-off VCB = 30 V; IE = 0 A
current
VCB = 30 V; IE = 0 A;
Tj = 150 °C
-
-
15
nA
-
-
5
μA
IEBO
emitter-base cut-off
current
VEB = 5 V; IE = 0 A
-
-
100
nA
hFE
DC current gain
VCE = 5 V; IC = 10 μA
-
150
-
BC848B
200
290
450
BC848W
110
-
800
-
90
250
mV
ICBO
Conditions
VCE = 5 V; IC = 2 mA
VCEsat
VBEsat
VBE
collector-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA
IC = 100 mA; IB = 5 mA
[1]
-
200
600
mV
base-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA
[2]
-
700
-
mV
IC = 100 mA; IB = 5 mA
[2]
-
900
-
mV
base-emitter voltage
IC = 2 mA; VCE = 5 V
[3]
580
660
700
mV
IC = 10 mA; VCE = 5 V
[3]
-
-
770
mV
100
-
-
MHz
-
2.5
3
pF
-
2
10
dB
fT
transition frequency
VCE = 5 V; IC = 10 mA;
f = 100 MHz
Cc
collector capacitance VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
NF
noise figure
VCE = 5 V; IC = 200 μA;
RS = 2 kΩ; f = 1 kHz;
B = 200 Hz
[1]
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
[2]
VBEsat decreases by approximately 1.7 mV/K with increasing temperature.
[3]
VBE decreases by approximately 2 mV/K with increasing temperature.
BC848_SER_7
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 07 — 17 November 2009
4 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
mgt727
600
VBE
(mV)
1000
hFE
(1)
500
mgt728
1200
(1)
400
800
(2)
(2)
300
600
200
400
(3)
(3)
100
200
0
10−1
1
10
102
0
10−2
103
10−1
1
10
I C (mA)
VCE = 5 V
VCE = 5 V
(1) Tamb = 150 °C
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig 1.
102
103
I C (mA)
(3) Tamb = 150 °C
BC848B: DC current gain as a function of
collector current; typical values
mgt729
104
VCEsat
(mV)
Fig 2.
BC848B: Base-emitter voltage as a function of
collector current; typical values
mgt730
1200
VBEsat
(mV)
1000
(1)
103
800
(2)
600
(3)
102
400
(1)
200
(3) (2)
10
10−1
1
10
102
0
10−1
103
1
IC/IB = 20
IC/IB = 10
(1) Tamb = 150 °C
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig 3.
102
103
(3) Tamb = 150 °C
BC848B: Collector-emitter saturation voltage
as a function of collector current; typical
values
Fig 4.
BC848B: Base-emitter saturation voltage as a
function of collector current; typical values
BC848_SER_7
Product data sheet
10
I C (mA)
I C (mA)
© NXP B.V. 2009. All rights reserved.
Rev. 07 — 17 November 2009
5 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
8. Package outline
3.0
2.8
1.1
0.9
2.2
1.8
1.1
0.8
0.45
0.15
3
3
0.45
0.15
2.5 1.4
2.1 1.2
2.2 1.35
2.0 1.15
1
1
2
0.48
0.38
1.9
Dimensions in mm
Fig 5.
04-11-04
Package outline SOT23 (TO-236AB)
2
0.4
0.3
0.15
0.09
0.25
0.10
1.3
Dimensions in mm
Fig 6.
04-11-04
Package outline SOT323 (SC-70)
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
3000
10000
BC848B
SOT23
4 mm pitch, 8 mm tape and reel
-215
-235
BC848W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-135
[1]
For further information and the availability of packing methods, see Section 14.
BC848_SER_7
Product data sheet
Packing quantity
© NXP B.V. 2009. All rights reserved.
Rev. 07 — 17 November 2009
6 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
10. Soldering
2.90
2.50
solder lands
solder resist
2
0.85
1
2.70
1.30
3.00
0.85
3
occupied area
solder paste
0.60
(3x)
0.50 (3x)
0.60 (3x)
1.00
3.30
MSA439
Dimensions in mm
Fig 7.
Reflow soldering footprint SOT23 (TO-236AB)
3.40
1.20 (2x)
solder lands
solder resist
occupied area
2
1
4.60 4.00 1.20
3
preferred transport direction during soldering
2.80
4.50
MSA427
Dimensions in mm
Fig 8.
Wave soldering footprint SOT23 (TO-236AB)
BC848_SER_7
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 07 — 17 November 2009
7 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
2.65
0.75
1.325
1.30
solder lands
2
solder paste
0.60
2.35 0.85
(3×)
0.50
(3×) 1.90
3
solder resist
occupied area
1
Dimensions in mm
0.55
(3×)
Fig 9.
2.40
msa429
Reflow soldering footprint SOT323 (SC-70)
4.60
4.00
1.15
2
3.65
2.10
3
2.70
solder lands
1
0.90
(2×)
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
msa419
Fig 10. Wave soldering footprint SOT323 (SC-70)
BC848_SER_7
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 07 — 17 November 2009
8 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
11. Mounting
43.4
43.4
0.6
0.7
0.6
40
0.6
0.55
40
0.7
0.5
Dimensions in mm
006aaa527
PCB thickness:
FR4 PCB = 1.6 mm
Fig 11. FR4 PCB, standard footprint
SOT23 (TO-236AB)
BC848_SER_7
Product data sheet
0.5
Dimensions in mm
006aaa672
PCB thickness:
FR4 PCB = 1.6 mm
Fig 12. FR4 PCB, standard footprint
SOT323 (SC-70)
© NXP B.V. 2009. All rights reserved.
Rev. 07 — 17 November 2009
9 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
12. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BC848_SER_7
20091117
Product data sheet
-
BC848_SER_6
Modifications:
BC848_SER_6
•
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
•
•
Figure 9 “Reflow soldering footprint SOT323 (SC-70)”: updated
Figure 10 “Wave soldering footprint SOT323 (SC-70)”: updated
20060203
Product data sheet
-
BC846_BC847_
BC848_5
BC846W_BC847W_
BC848W_4
BC846_BC847_BC848_5 20040206
Product specification
-
BC846_BC847_
BC848_4
BC846W_BC847W_
BC848W_4
Product specification
-
BC846W_847W_3
20020204
BC848_SER_7
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 07 — 17 November 2009
10 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BC848_SER_7
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 07 — 17 November 2009
11 of 12
BC848 series
NXP Semiconductors
30 V, 100 mA NPN general-purpose transistors
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 17 November 2009
Document identifier: BC848_SER_7
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