Page of 1/2 Quality and Reliability Assurance Reliability Engineering Report Summary Sheet Type of Device 0.18um Process Technology Flash MCU (CU80F_UL) Product tested MB95F564K( SOP20 Package) Purpose of test Mass-Production Engineering Approval Test CD2011-A398 Quality Assurance Division Fujitsu Semiconductor Limited Confidential Page of 2/2 Reliability Test 1 Device Number Package Type : MB95F564K : Plastic SOP20 Package Test Item Tested Time Number Failed *1 1000h 0 46 *1 1000h 0 150ºC 77 *1 1000h 0 Temperature Cycling –65ºC ~150ºC 77 *1 200cyc 0 Pressure Cooker Test 121ºC , 100%RH: 2.03E5 Pa 77 *1 336h 0 Pressure Cooker Test with Bias 130ºC , 85%RH: 2.33E5 Pa VDD=Max. 33 *1 144h 0 High Temperature Operation Life Temperature Humidity Bias High Temperature Storage Test Method Number Tested 125ºC VDD=Max. 77 85ºC / 85% RH VDD=Max. *1: Pre-Treatment: Baking (125ºC , 24h)+Moisture Absorption (30ºC /70%RH, 192h)+ IR 260ºC Max. +Moisture Absorption (30ºC /70%RH, 168h)+ IR 260ºC Max. CD2011-A398 Quality Assurance Division Fujitsu Semiconductor Limited Confidential