CD11-A398_CU80F_UL_QRA.pdf

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Quality and Reliability Assurance
Reliability Engineering Report Summary Sheet
Type of Device
0.18um Process Technology Flash MCU (CU80F_UL)
Product tested
MB95F564K( SOP20 Package)
Purpose of test
Mass-Production Engineering Approval Test
CD2011-A398
Quality Assurance Division
Fujitsu Semiconductor Limited Confidential
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Reliability Test 1
Device Number
Package Type
: MB95F564K
: Plastic SOP20 Package
Test Item
Tested
Time
Number
Failed
*1
1000h
0
46
*1
1000h
0
150ºC
77
*1
1000h
0
Temperature Cycling
–65ºC ~150ºC
77
*1
200cyc
0
Pressure Cooker Test
121ºC , 100%RH: 2.03E5 Pa
77
*1
336h
0
Pressure Cooker Test
with Bias
130ºC , 85%RH: 2.33E5 Pa
VDD=Max.
33
*1
144h
0
High Temperature
Operation Life
Temperature Humidity Bias
High Temperature Storage
Test Method
Number
Tested
125ºC
VDD=Max.
77
85ºC / 85% RH
VDD=Max.
*1: Pre-Treatment: Baking (125ºC , 24h)+Moisture Absorption (30ºC /70%RH, 192h)+ IR 260ºC
Max.
+Moisture Absorption (30ºC /70%RH, 168h)+ IR 260ºC
Max.
CD2011-A398
Quality Assurance Division
Fujitsu Semiconductor Limited Confidential
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