TrueSecureTM GH Series Hybrid Fingerprint Sensor Revision: V1.00 Date: February 02, 2016 GH Series Hybrid Fingerprint Sensor Table of Contents 1 Features.................................................................................................................... 3 2 Applications............................................................................................................. 3 4 Block Diagram.......................................................................................................... 4 5 General Description................................................................................................. 4 6 Pin Description........................................................................................................ 5 7 Electrical Specification........................................................................................... 6 8 Interface Description............................................................................................... 6 Timing Characteristics............................................................................................................ 7 9 Mechanical Specifications...................................................................................... 8 GH-8111-01, GH-8111-01P..................................................................................................... 8 Rev. 1.00 2 of 9 February 02, 2016 Table of Contents 3 Selection Table......................................................................................................... 3 GH Series Hybrid Fingerprint Sensor 1 Features ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ ▆▆ 2 Applications ▆▆ ▆▆ ▆▆ ▆▆ 3 Mobile Phones Tablets Personal Computers Low Profile Biometric Identification Products Selection Table Part No. GH-8111-01 GH-8111-01P Rev. 1.00 Features ▆▆ Ultra small fingerprint sensor permits integration into low profile areas Physical dimensions: 14mm × 15.1mm × 1.23mm High speed SPI interface Advanced Imaging Technology Superior imaging quality: 256 grayscale values per pixel Resolution up to 1000 DPI allows examination of the tiniest fingerprint details Active sensing area: 320 pixels × 320 pixels Robust Packaging Strong surface scratch protection with 6H Coating and 9H Glass ESD tolerance: +/- 15KV Air Discharge and +/- 15KV Contact High abrasion resistance and capable of withstanding over 1 million touches Low Power Consumption Active mode supply current: 30 mA Standby mode supply current: 5 μA Operating temperature: -20°C ~ +60°C Storage temperature: -20°C ~ +80°C Humidity: 10% ~ 80% RH under 60°C Effective Resolution Area (mm2) (DPI) 8.1×8.1 1000 Image Pixels Package 320×320 28PLCC 3 of 9 Inter- Surface Metal Algo- Dimension (mm3) face Color Frame rithm (W×D×H) SPI Black — — √ 13.9×13.9×1.23 February 02, 2016 GH Series Hybrid Fingerprint Sensor 4 Block Diagram Block Diagram Sensor Array 320 × 320 PGA 5 ADC LED SPI General Description Fingerprint recognition technology is proving to be an increasingly popular means of secure and accurate means of biometric identification. By eliminating the need to remember multiple passwords this biometric recognition technology will continue to see more prevalent use in everyday products where security features are required. This range of hybrid fingerprint sensors with their advanced optical and capacitive technology and their ultra thin profile, will open up new application areas in products where space is at a premium. Additional features include a durable structure, high ESD immunity, 360 degree rotation and other features. The fingerprint data can be rapidly captured and then the image data quickly transmitted to external hardware for further image processing using its internal high speed SPI interface . These patented architecture combined optical and capacitive fingerprint sensors form a range of unique high performance fingerprint sensors which are suitable for use in applications such as mobile phones, tablets and notebook PCs. Rev. 1.00 4 of 9 February 02, 2016 GH Series Hybrid Fingerprint Sensor 6 Pin Description Pin No I/O Pin Name Function GND Analog Ground Analog Ground VDD Analog Power Analog IO PAD Power Supply (2.8~3.3V) 3 PIX bias AI Connect 100nF capacitor to VDD Connect 100nF capacitor to VDD 4 COL bias AI 5 GND Analog Ground Analog Ground 6 BIN DI Mode selection – Digital Input(1.8~3.3V), High – BIN mode , Low – HD mode 7 FS DI Parallel mode: Frame Select, SPI mode: Chip select ,Digital Input (1.8~3.3V), active Low 8 CS DI Chip Select Digital Input (1.8~3.3V), active Low 9 LED_Power LED Power Internal LED Power Input, Current limiting resistor must be connected 10 VDDPAD Digital Power Digital IO PAD Power Supply (1.8~3.3V) 11 SPO DO SPI Data Output (1.8~3.3V) 12 MCLK DI Master clock Digital Input (1.8~3.3V) 13 GNDPAD Digital Ground Digital Ground 14 LEDon DI LED on control Digital Input (1.8~3.3V), active High Analog IO PAD Power Supply (2.8~3.3V) 15 VDD Analog Power 16 GND Analog Ground Analog Ground 17 G1 DI Application gain setting pin 18 G0 DI Application gain setting pin 19 ADCbias AI Connect 100nF capacitor to VDD 20 ESD-GND Ground ESD Ground 21 ESD-GND Ground ESD Ground AO VDD_int is the VDD output that automatically turns off following a CS high state. 22 VDD_int 23 HREF AI Connect 100nF capacitor to GND 24 LREF AI Connect 100nF capacitor to GND 25 ADCin AI Use resistor (0R) connected between ADCin and AMPO 26 AMPO AO Use resistor (0R) connected between ADCin and AMPO 27 AMPref AI Connect 100nF capacitor to GND 28 FOLbias AI Connect 100nF capacitor to GND 29 M-GND Ground Mechanical Ground 30 M-GND Ground Mechanical Ground 31 M-GND Ground Mechanical Ground 32 M-GND Ground Mechanical Ground Rev. 1.00 5 of 9 February 02, 2016 Pin Description 1 2 GH Series Hybrid Fingerprint Sensor 7 Electrical Specification Symbol Test Conditions Min. Typ. Max. Units VDD Analog IO PAD power supply VPAD Digital IO PAD power suppy — 2.8 — 3.3 V — 1.62 — 3.3 V VIH Low level input voltage — — TBD — V VIL Low level intput voltage — — TBD — V VOH High level output voltage — — TBD — V VOL Low level output voltage — — TBD — V IOP Operating current VDD = 3.3V, VPAD = 3.3V SPI CLK = 36MHz Exposure < 10ms — — 30 mA IPD Power-down current VDD = 3.3V, VPAD = 3.3V — — 5 μA Interface Description The sensor transmits its captured image data to external hardware using an internal high speed SPI interface. Assert “BIN” to allow the sensor to enter either the HD mode or BIN mode and then output the different size image. The sensor exposure time controlled using “FS”. Further details can be found in the GH-8111 application note. tH1 PWFS FS TH=8TMS TMS PWMCLK MCLK SPO 12760TMS D9 D8 D7 D6 D5 D4 D3 D2 D9 D8 D7 D6 D5 D4 D3 D2 Timing Overview MCLK SPO DATA VALID DATA VALID DATA VALID SPO hold time SPO Delay SPO Delay Rev. 1.00 6 of 9 February 02, 2016 Electrical Specification 8 Parameter GH Series Hybrid Fingerprint Sensor Timing Characteristics Parameter TMS MCLK Cycle Time Min. Typ. Max. 25ns — 167ns PWMCLK MCLK high pulse width 10ns — — PWFS FS high pulse width 200μs — — tH1 FS falling edge to the first MCLK falling edge 5ns — — SPO hold time VDDPAD=3.3V SPO hold time vs. MCLK falling 4ns — — SPO hold time VDDPAD=1.8V SPO hold time vs. MCLK falling 8ns — — SPO delay VDDPAD=3.3V SPO delay vs. MCLK falling — — 7ns SPO delay VDDPAD=1.8V SPO delay vs. MCLK falling — — 15ns 7 of 9 February 02, 2016 Interface Description Rev. 1.00 Name GH Series Hybrid Fingerprint Sensor 9 Mechanical Specifications GH-8111-01, GH-8111-01P Mechanical Specifications Rev. 1.00 8 of 9 February 02, 2016 GH Series Hybrid Fingerprint Sensor Mechanical Specifications Copyright© 2016 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek's products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www. holtek.com.tw. Note that Holtek’s fingerprint recognition products have been designed in conjunction with Gingy Technology. Rev. 1.00 9 of 9 February 02, 2016