▲ Built-in board

Built-in board
Set product trend
• Higher performance of
CPU/FPGA
 High-speed drive
• Larger capacity of DDR
memory
• Medical/Machine tool/FA
equipment
Capacitor
required
specifications
Power circuit trend
Features of
recommended products
SP-Cap
• Increased load current
Low ESR
(1) CPU/FPGA core power source
(2) DDR power source
(3) System power source
(4) Removal of power input noise
• Ultra-low ESR (3 mΩ - )
• Low profile (1-2 mm)
Small
Low profile
POSCAP
• Low ESR (6 mΩ - )
• Downsizing (3216, 3528)
High withstand
voltage
Input
Output 1V
(-100A)
SP-Cap
POSCAP
CPU
2V470uF
3-6 mΩ/Dsize
2.5V270uF
6 mΩ/Bsize
DDR3
2V470uF
3-6 mΩ/Dsize
2.5V330uF
9 mΩ/Bsize
1.5V
System
(2V max.)
2V470uF
3-6 mΩ/Dsize
2.5V330uF
15 mΩ/Bsize
3.3V
I/O
USB
6.3V220uF
15 mΩ/Dsize
6.3V220uF
25 mΩ/Bsize
USB
(5V)
16V68uF
40 mΩ/Dsize
16V100uF
50 mΩ/Dsize
Vcore
Vtt
Vsa
12VDDR3
I/O
USB
1.05V
0.8V
5V
CPU
FPGA
LSI