SO T2 3 NXP3875Y; NXP3875G 50 V, 150 mA NPN general-purpose transistors Rev. 1 — 12 December 2012 Product data sheet 1. Product profile 1.1 General description NPN general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits General-purpose transistors Small SMD plastic packages Two different current gain selections AEC-Q101 qualified 1.3 Applications General-purpose switching and amplification 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - 50 V IC collector current - - 150 mA hFE DC current gain NXP3875Y 120 - 240 NXP3875G 200 - 400 VCE = 6 V; IC = 2 mA 2. Pinning information Table 2. Pinning Pin Description 1 base 2 emitter 3 collector Simplified outline Graphic symbol 3 3 1 1 2 2 sym021 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors 3. Ordering information Table 3. Ordering information Type number NXP3875Y Package Name Description Version TO-236AB plastic surface-mounted package; 3 leads SOT23 NXP3875G 4. Marking Table 4. Marking codes Type number Marking code[1] NXP3875Y *JE NXP3875G *JF [1] * = placeholder for manufacturing site code. 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 60 V VCEO collector-emitter voltage open base - 50 V VEBO emitter-base voltage open collector - 5 V IC collector current - 150 mA ICM peak collector current - 200 mA IB base current 30 mA IBM peak base current single pulse; tp 1 ms - 100 mA Ptot total power dissipation Tamb 25 C - 200 mW Tj junction temperature - 150 C Tamb ambient temperature 65 +150 C Tstg storage temperature 65 +150 C [1] NXP3875Y_NXP3875G Product data sheet single pulse; tp 1 ms [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 2 of 14 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors 006aad235 250 Ptot (mW) 200 150 100 50 0 -75 -25 25 75 125 175 Tamb (°C) FR4 PCB, standard footprint Fig 1. Power derating curve 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air [1] [1] Min Typ Max Unit - - 625 K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 006aad236 103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 10 0.02 0 0.01 1 10-1 10-5 10-4 10-3 10-2 10-1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values NXP3875Y_NXP3875G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 3 of 14 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors 7. Characteristics Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit collector-base cut-off current VCB = 60 V; IE = 0 A - - 100 nA VCB = 60 V; IE = 0 A; Tj = 150 C - - 5 A IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A - - 100 nA hFE DC current gain VCE = 6 V; IC = 2 mA NXP3875Y 120 - 240 NXP3875G 200 - 400 ICBO NXP3875Y_NXP3875G Product data sheet VCEsat collector-emitter saturation voltage IC = 100 mA; IB = 10 mA - - 250 mV VBEsat base-emitter saturation voltage IC = 100 mA; IB = 10 mA - - 1 V fT transition frequency VCE = 10 V; IC = 1 mA; f = 100 MHz 80 - - MHz Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz - - 3.5 pF NF noise figure - - 10 dB IC = 0.1 mA; VCE = 6 V; RS = 10 k; f = 1 kHz; All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 4 of 14 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors 006aad237 103 hFE 006aad238 103 hFE (1) (1) (2) (2) (3) 102 10 10-1 (3) 102 1 102 10 10 10-1 103 1 10 102 IC (mA) VCE = 1 V VCE = 6 V (1) Tamb = 100 C (1) Tamb = 100 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 55 C (3) Tamb = 55 C Fig 3. NXP3875Y: DC current gain as a function of collector current; typical values Fig 4. 006aad239 200 IB = 7 mA 6.3 5.6 103 IC (mA) NXP3875Y: DC current gain as a function of collector current; typical values 006aad240 1.2 4.9 IC (mA) VBE (V) 4.2 3.5 150 (1) 2.8 100 0.8 2.1 (2) 1.4 (3) 0.7 0.4 50 0 0 2 4 0 10-1 6 1 VCE (V) 10 102 103 IC (mA) Tamb = 25 C VCE = 6 V (1) Tamb = 55 C (2) Tamb = 25 C (3) Tamb = 100 C Fig 5. NXP3875Y: Collector current as a function of collector-emmiter voltage; typical values NXP3875Y_NXP3875G Product data sheet Fig 6. NXP3875Y: Base-emmiter voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 5 of 14 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors 006aad241 1.2 VBEsat (V) VCEsat (V) (1) 0.8 006aad242 1 (2) (3) 10-1 (1) 0.4 (2) 0 10-1 1 10 102 103 10-2 10-1 (3) 1 10 102 IC (mA) IC/IB = 10 IC/IB = 10 (1) Tamb = 55 C (1) Tamb = 100 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 100 C (3) Tamb = 55 C Fig 7. NXP3875Y: Base-emitter saturation voltage as a function of collector currant; typical values 006aad243 103 103 IC (mA) fT (MHz) Fig 8. NXP3875Y: Collector-emmiter saturation voltage as a function of collector current; typical values 006aad244 103 hFE (1) (2) 102 (3) 102 10 1 10-1 1 10 102 103 10 10-1 1 IC (mA) VCE = 10 V; Tamb = 25 C 10 102 103 IC (mA) VCE = 1 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 55 C Fig 9. NXP3875Y: Transition frequency as a function of collector current; typical values NXP3875Y_NXP3875G Product data sheet Fig 10. NXP3875G: DC current gain as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 6 of 14 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors 006aad245 103 006aad246 200 IB = 7 mA 6.3 5.6 4.9 IC (mA) hFE (1) 4.2 3.5 150 (2) 2.8 2.1 (3) 1.4 102 100 0.7 50 10 10-1 1 10 102 103 0 0 2 4 IC (mA) 6 VCE (V) Tamb = 25 C VCE = 6 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 55 C Fig 11. NXP3875G: DC current gain as a function of collector current; typical values 006aad247 1.2 VBE (V) Fig 12. NXP3875G: Collector current as a function of collector-emmiter voltage; typical values 006aad248 1.2 VBEsat (V) (1) (1) 0.8 0.8 (2) (2) (3) (3) 0.4 0.4 0 10-1 1 10 102 103 0 10-1 1 IC (mA) VCE = 6 V IC/IB = 10 (1) Tamb = 55 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 100 C (3) Tamb = 100 C NXP3875Y_NXP3875G Product data sheet 102 103 IC (mA) (1) Tamb = 55 C Fig 13. NXP3875G: Base-emmiter voltage as a function of collector current; typical values 10 Fig 14. NXP3875G: Base-emitter saturation voltage as a function of collector currant; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 7 of 14 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors 006aad249 1 006aad250 103 fT (MHz) VCEsat (V) 102 10-1 (1) 10 (2) (3) 10-2 10-1 1 10 102 103 1 10-1 1 10 IC (mA) 102 103 IC (mA) VCE = 10 V; Tamb = 25 C IC/IB = 10 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 55 C Fig 15. NXP3875G: Collector-emmiter saturation voltage as a function of collector current; typical values Fig 16. NXP3875G: Transition frequency as a function of collector current; typical values 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. NXP3875Y_NXP3875G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 8 of 14 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors 9. Package outline 3.0 2.8 1.1 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 1.9 0.48 0.38 Dimensions in mm 0.15 0.09 04-11-04 Fig 17. Package outline SOT23 (TO-236AB) 10. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package NXP3875Y SOT23 Description 4 mm pitch, 8 mm tape and reel Packing quantity 1000 4000 -215 -235 NXP3875G [1] NXP3875Y_NXP3875G Product data sheet For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 9 of 14 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors 11. Soldering 3.3 2.9 1.9 solder lands solder resist 3 2 1.7 solder paste 0.6 (3×) 0.7 (3×) occupied area Dimensions in mm 0.5 (3×) 0.6 (3×) 1 sot023_fr Fig 18. Reflow soldering footprint SOT23 (TO-236AB) 2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 solder resist 2.6 occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 sot023_fw Fig 19. Wave soldering footprint SOT23 (TO-236AB) NXP3875Y_NXP3875G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 10 of 14 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors 12. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes NXP3875Y_NXP3875G v.1 20121212 Product data sheet - - NXP3875Y_NXP3875G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 11 of 14 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. NXP3875Y_NXP3875G Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 12 of 14 NXP3875Y; NXP3875G NXP Semiconductors 50 V, 150 mA NPN general-purpose transistors No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] NXP3875Y_NXP3875G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 12 December 2012 © NXP B.V. 2012. All rights reserved. 13 of 14 NXP Semiconductors NXP3875Y; NXP3875G 50 V, 150 mA NPN general-purpose transistors 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 Quality information . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Packing information . . . . . . . . . . . . . . . . . . . . . 9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 12 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Contact information. . . . . . . . . . . . . . . . . . . . . 13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 12 December 2012 Document identifier: NXP3875Y_NXP3875G