Data Sheet

DISCRETE SEMICONDUCTORS
DATA SHEET
M3D883
BOTTOM VIEW
2PC4617M series
NPN general purpose transistors
Product data sheet
2003 Jul 15
NXP Semiconductors
Product data sheet
NPN general purpose transistors
2PC4617M series
FEATURES
QUICK REFERENCE DATA
• Leadless ultra small plastic package
(1 mm × 0.6 mm × 0.5 mm)
SYMBOL
• Board space 1.3 × 0.9 mm
• Power dissipation comparable to SOT23.
APPLICATIONS
PARAMETER
MAX.
UNIT
VCEO
collector-emitter voltage
50
V
IC
collector current (DC)
100
mA
ICM
peak collector current
200
mA
PINNING
• General purpose small signal DC applications
PIN
• Low and medium frequency AC applications
• Mobile communications, digital (still) cameras, PDAs,
PCMCIA cards.
DESCRIPTION
1
base
2
emitter
3
collector
DESCRIPTION
NPN general purpose transistor in a SOT883 leadless ultra
small plastic package.
PNP complement: 2PA1776M series.
3
handbook, halfpage
2
1
3
1
MARKING
2
TYPE NUMBER
Bottom view
MARKING CODE
2PC4617QM
D7
2PC4617RM
D8
2PC4617SM
D9
MAM475
Fig.1 Simplified outline (SOT883) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCBO
collector-base voltage
open emitter
−
50
V
VCEO
collector-emitter voltage
open base
−
50
V
VEBO
emitter-base voltage
open collector
−
5
V
IC
collector current (DC)
−
100
mA
ICM
peak collector current
−
200
mA
IBM
peak base current
−
200
mA
Ptot
total power dissipation
note 1
−
250
mW
note 2
Tamb ≤ 25 °C
−
430
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Tamb
operating ambient temperature
−65
+150
°C
Notes
1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
2. Device mounted on a FR4 printed-circuit board, single-sided copper, mounting pad for collector 1 cm2.
2003 Jul 15
2
NXP Semiconductors
Product data sheet
NPN general purpose transistors
2PC4617M series
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
VALUE
UNIT
note 1
500
K/W
note 2
290
K/W
in free air
Notes
1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 μm copper strip line.
2. Device mounted on a FR4 printed-circuit board, single-sided copper, mounting pad for collector 1 cm2.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VCB = 30 V; IE = 0
−
100
nA
VCB = 30 V; IE = 0; Tj = 150 °C
−
5
μA
−
100
nA
2PC4617QM
120
270
2PC4617RM
180
390
2PC4617SM
270
560
collector-base cut-off current
IEBO
emitter-base cut-off current
VEB = 4 V; IC = 0
hFE
DC current gain
VCE = 6 V; IC = 1 mA
VCEsat
collector-emitter saturation voltage
IC = 50 mA; IB = 5 mA; note 1
−
200
mV
Cc
collector capacitance
IE = ie = 0; VCB = 12 V; f = 1 MHz
−
1.5
pF
fT
transition frequency
VCE = 12 V; IC = 2 mA;
f = 100 MHz
100
−
MHz
Note
1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
2003 Jul 15
3
NXP Semiconductors
Product data sheet
NPN general purpose transistors
2PC4617M series
PACKAGE OUTLINE
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
L
SOT883
L1
2
b
3
e
b1
1
e1
A
A1
E
D
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A (1)
A1
max.
b
b1
D
E
e
e1
L
L1
mm
0.50
0.46
0.03
0.20
0.12
0.55
0.47
0.62
0.55
1.02
0.95
0.35
0.65
0.30
0.22
0.30
0.22
Note
1. Including plating thickness
OUTLINE
VERSION
SOT883
2003 Jul 15
REFERENCES
IEC
JEDEC
JEITA
SC-101
4
EUROPEAN
PROJECTION
ISSUE DATE
03-02-05
03-04-03
NXP Semiconductors
Product data sheet
NPN general purpose transistors
2PC4617M series
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General ⎯ Information in this document is believed to be
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does not give any representations or warranties,
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Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2003 Jul 15
5
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were
made to the content, except for the legal definitions and disclaimers.
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© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/01/pp6
Date of release: 2003 Jul 15
Document order number: 9397 750 11484
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