EQCO875SC.3/EQCO850SC.3 EQCO875SC.3/EQCO850SC.3 Single-Coax Transceiver for Fast Ethernet Features Applications • Combined Transmitter and Receiver with an Integrated Equalizer to Form a Full-Duplex Bidirectional Connection over a Single 75Ω Coax Cable (EQCO875SC.3) or 50Ω Coax Cable (EQCO850SC.3) • Compatible with FX Version of Fast Ethernet • Low-Power: 205 mW from Single 3.3V Supply • Integrated Termination Resistors for Low External Discrete Count • Fully Supports PoE-Based Power and Data Signal Distribution Over Coax • 16-Pin, 0.65 mm Pin Pitch, 4 mm QFN Package • Pb-Free and RoHS Compliant This solution is useful and economical for many markets and applications, including the following: TABLE 1: • Camera Networks - Home Security, Surveillance, Industrial/ Inspection, Medical Cameras • Home Networking over Coax Infrastructure - When Cat5 or Cat6 cabling is not available and existing 75Ω coax is not used for analog TV signals • TV, STB, PVR Connections Including Inter-Room Links TYPICAL DEVICE PERFORMANCE FOR EQCO875SC.3 EQCO875SC.3 Range Using Version EQCO875SC.3 TABLE 2: RG11 RG6 (Ø 5 mm) 225m 150m TYPICAL DEVICE PERFORMANCE FOR EQCO850SC.3 Version EQCO850SC.3 2009-2016 Microchip Technology Inc. EQCO850SC.3 Range Using RG174 RTK RG58 40m 70m 70m DS60001314A-page 1 EQCO875SC.3/EQCO850SC.3 Table of Contents 1.0 2.0 3.0 4.0 Device Overview .......................................................................................................................................................................... 3 Application Information ................................................................................................................................................................. 7 Electrical Characteristics .............................................................................................................................................................. 9 Packaging................................................................................................................................................................................... 11 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected] We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS60001314A-page 2 2009-2016 Microchip Technology Inc. EQCO875SC.3/EQCO850SC.3 1.0 DEVICE OVERVIEW The EQCO875SC.3 single-coax transceiver is designed to simultaneously transmit and receive signals on a single 75Ω coax cable for Fast Ethernet. A sister product, the EQCO850SC.3, can achieve similar performance when used in 50Ω coaxial systems. The EQCO875SC.3 is ideally suited for Fast Ethernet connections over a 75Ω coax cable at a 125 Mbps data rate. The EQCO875SC.3 connects seamlessly to any FXcompliant physical layer controller (PHY). For correct operation, the signals are expected to be 4B/5B encoded, DC balanced and to have a bit rate of 125 Mbps. This EQCO875SC.3 is useful and economical for connecting remote PoE-enabled Fast Ethernet IP cameras and other Ethernet over Coax applications. Figure 1-1 illustrates a typical Ethernet Coaxial connection: FIGURE 1-1: COAXIAL ETHERNET PMD CONNECTION Up to 225 meters IEEE 802.3 FX Compliant PHY EQCO875SC 2009-2016 Microchip Technology Inc. 75Ω Coax (including inline connectors as required) EQCO875SC IEEE 802.3 FX Compliant PHY DS60001314A-page 3 EQCO875SC.3/EQCO850SC.3 EQCO875SC.3 PIN DIAGRAM (VIEWED FROM TOP)(1) FIGURE 1-2: CCUT DVCC OPT0 DGND 16 15 14 13 AVCC 1 12 SDOp SDIO 2 11 SDOn REF 3 10 SDIp AGND 4 9 SDIn EQCO875SC.3 GND TAB 5 6 7 8 OPT1 CLK DAT NC Note 1: Devices named EQCO850SC.2 can be used for all applications contained in this data sheet. They are the same in all aspects. TABLE 1-1: EQCO875SC.3 PIN DESCRIPTIONS Pin Number (TAB) Pin Name Signal Type GND Power Description Connect to ground of power supply. 15 DVCC Power Digital VCC. Connect to +3.3V of power supply. 13 DGND Power Digital GND. Connect to ground of power supply. 1 AVCC Power Analog VCC. Connect to +3.3V of power supply via ferrite bead (RF choke) and capacitor to cable outer screen. 4 AGND Power Analog GND. Connect to cable outer screen. 2 SDIO Bidirectional Serial Input/Output. Connect to center conductor of 75Ω coax cable. 3 REF Bidirectional Reference. Connect through 75Ω resistor (or impedance matched to cable) to cable outer screen. 8 NC Output 10, 9 SDIp/SDIn Input Positive/negative differential serial input. Connect to the Ethernet PHY FX Out pins. 12, 11 SDOp/SDOn Output Positive/negative differential serial output. Connect to the Ethernet PHY FX In pins. 14, 5 OPT0, OPT1 Input Connect Opt0 to DGND and Opt1 to DVCC to enable Fast Ethernet mode. 6, 7 CLK, DAT Input Used for production test. Connect to DGND. 16 CCUT Analog DS60001314A-page 4 Do not connect. Connect to DVCC. 2009-2016 Microchip Technology Inc. EQCO875SC.3/EQCO850SC.3 FIGURE 1-3: EQCO875SC.3 BLOCK DIAGRAM SHOWING ELECTRICAL CONNECTIONS EQCO875SC.3 SDIp SDIn Input Pre-Driver Active Signal Splitter/Combiner Transmit Wake-Up Detection Equalizer Core SDOp SDOn 1.1 SDIp/SDIn SDIp/SDIn together form a differential input pair. The serial data received on these pins will be transmitted on SDIO. The Input Pre-Driver automatically corrects for variations in signal levels and different edge slew rates at these inputs before they go into the Active Splitter/ Combiner for transmission over the coax. Both SDIp and SDIn inputs are differentially terminated by 110Ω on-chip. The center of the 110Ω is connected to DGND with a 10 kΩ resistor for DC biasing. The inputs also have protection diodes to ground for ESD purposes. These inputs should always be capacitively coupled to the FX output of the Ethernet PHY. A Transmit Wake-Up detection circuit puts both the Input Pre-Driver and the Active Signal Splitter/Combiner into a low-power mode when no signal is detected on the SDIp/SDIn signal pair. 1.2 SDIO/REF SDIO REF RX Output Driver 1.3 SDOp/SDOn SDOp/SDOn together form a differential pair outputting the reconstructed far-end transmit signal. The EQCO850SC-HS uses LVDS drivers with source matching for a 100Ω transmission line. This LVDS signal can normally be connected (subject to input common-mode requirements) directly to the RX signal pair of a standard LVDS receiver. 1.4 OPT0, OPT1 Connect Opt0 to DGND and Opt1 to DVCC to enable Fast Ethernet mode. 1.5 CLK, DAT Pins These pins are normally used to access an internal register during production test. Connect them to DGND for normal operation. They should not be left floating. The signal on the SDIO pin is the sum of the incoming signal (i.e. the signal transmitted by the EQCO875SC on the far-end side of the coax) and the outgoing signal (i.e. the signal created based on SDIp/SDIn). The far-end signal is extracted by subtraction of the near-end signal, and it is this voltage that the equalizer analyses and adaptively equalizes for level and frequency response based on the knowledge that the originating signal is 4B/ 5B encoded before transmission. The REF signal carries a precise anti-phase current to the transmit current on SDIO. REF must be connected directly to AGND at the connector (see Figure 3-2) via a resistor precisely matched to the impedance of the coaxial cable used. 2009-2016 Microchip Technology Inc. DS60001314A-page 5 EQCO875SC.3/EQCO850SC.3 2.0 CIRCUIT OPERATION 2.3 2.1 Pre-Driver The EQCO875SC-HS has an embedded high-speed equalizer in the receive path with unique characteristics: The pre-driver removes any dependency on Ethernet PHY for the amplitude and rise time of the outgoing signal on SDIO. 2.2 Active Signal Splitter/Combiner The Active Splitter/Combiner controls the amplitude and rise time of the outgoing coax signal and transmits it via a precise 75Ω output termination resistor. The output resistor, when balanced with the coax characteristic impedance, also forms part of a hybrid splitter circuit which subtracts the TX output from the signal on the SDIO output to give yield the far-end TX signal. The return-loss of the coax termination is a key factor in the performance of the line hybrid. FIGURE 2-1: DS60001314A-page 6 Equalizer Core • Auto-adaptive The equalizer controls a multiple-pole analog filter which compensates for attenuation of the cable, as illustrated in Figure 2-1. The filter frequency response needed to restore the signal is automatically determined by the device using a time-continuous feedback loop that measures the frequency components in the signal. Upon the detection of a valid signal, the control loop converges within a few microseconds. • Variable gain EQCO875SCs are used in pairs, with one at each end of the coax cable. The EQCO875SC can be used with any Fast Ethernet compliant fiber optic PHY; any differences in transmit amplitude are removed by the input pre-driver. The receiver equalizer has variable gain to compensate for attenuation through the coax cable. PRINCIPLE OF EQUALIZER OPERATION 2009-2016 Microchip Technology Inc. EQCO875SC.3/EQCO850SC.3 3.0 APPLICATION INFORMATION Figure 3-1 illustrates a typical schematic implementation for the EQCO875SC.3 in Ethernet mode. FIGURE 3-1: EQCO875SC.3 TYPICAL APPLICATION CIRCUIT GND VCC 48V_DC 13 DGND 14 OPT 0 15 16 SDOn REF SDIp 5 GND SDIn VCC C3 100n 11 C4 100n 10 C1 100n 9 C2 100n SDOp SDOn SDIp SDIn NC AGND 12 8 4 SDIO DA T 3 U1 EQCO850SC.3/EQCO875SC.3 SDOp 7 50R/75R 2 AVCC CL K R1 C5 10n 100V C6 10n 100V 1 6 C9 10n DV CC L1 CCUT TAB 100V GND FB1 17 B L M15HD182SN1D C10 1u C7 100n OPT 1 J1 1812PS-103K L B C8 10u GND To improve isolation from noise on the board power plane and improve EMC immunity and emissions, it is recommended to power the transmit side of the equalizer (AVCC) through a ferrite bead (FB1). C9 is used to reference AVCC to the ground directly at the connector J1, while AGND is also connected directly to the connector. A 100 nF decoupling capacitor (C7) should be placed as close as possible between the DVCC pin and the DGND pin. The REF and SDIO signals are AC-coupled with identical capacitors, C5 and C6. Termination resistor R1 should match the characteristic impedance of the system, 50Ω for EQCO850SC.3 and 75Ω for EQCO875SC.3. A CoilCraft 1812PS-103KLB inductor (L1) is recommended for best performance when using power over coax. L1 and C10 can be removed if power over coax is not required. 2009-2016 Microchip Technology Inc. DS60001314A-page 7 EQCO875SC.3/EQCO850SC.3 3.1 Guidelines for PCB Layout Because signals are strongly attenuated by long cables, special attention must be paid on the PCB layout between the coaxial connector and the EQCO875SC.3. The EQCO875SC.3 should be placed as close as is practical to the coaxial connector. The trace between the coaxial connector and the SDIO pin of the EQCO875SC.3 must be a 75Ω (50Ω for EQCO850SC.3) trace referenced to GND. To avoid noise pickup, other traces carrying digital signals or fast-switching signals should be placed as far away as possible from this trace. The ground layout on the EQCO875SC.3 is crucial to the EMC and EMI performance of the circuit. The AGND connection should be connected directly to the body of the connector as shown. Similarly, AVCC FIGURE 3-2: DS60001314A-page 8 should be decoupled directly to the connector body (see the position of C9). The termination resistor (R1 in Figure 3-1 and Figure 3-2) must have its ground connection at the connector body. The impedance of all the traces must be well controlled, including on the connector itself. To compensate for parasitic capacitances, the ground and power planes underneath L1 and part of the coax connector need to be removed, as indicated by the green areas on Figure 3-2. The SDIp/SDIn and SDOp/SDOn differential traces should be laid out as 100Ω differential traces. The following diagram shows the layout of the critical section of the PCB corresponding to the circuit of Figure 3-1 from the coax connector to the twin differential pairs: TYPICAL PCB LAYOUT 2009-2016 Microchip Technology Inc. EQCO875SC.3/EQCO850SC.3 4.0 ELECTRICAL CHARACTERISTICS 4.1 Absolute Maximum Ratings Stresses beyond those listed under this section may cause permanent damage to the device. These are stress ratings only and are not tested. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TABLE 4-1: ABSOLUTE MAXIMUM RATINGS Parameter Min. Typ. Max. Units Storage Temperature -65 — +150 °C Ambient Temperature -55 — +125 °C Supply Voltage to Ground -0.5 — +4.0 V DC Input Voltage -0.5 — +4.0 V DC Voltage to Outputs -0.5 — +4.0 V — — 90 mA Output Current into Outputs TABLE 4-2: Parameter Conditions Power Applied Outputs Low ELECTRICAL CHARACTERISTICS Min. Typ. Max. Unit Description VCC 3.2 3.3 3.4 V IS 47.5 62.5 75.5 mA Supply current, both transmitting and receiving. ISR 25 35 43 mA Supply current when not transmitting. Input amplitude VSDIp,n. Power Supply Supply voltage. SDIp/SDIn Input (LVDS-like) Vi 250 — 800 mV Vturnon 100 140 200 mV Vcmin — 0 — V Common-mode input voltage (terminated to ground with protection diodes). Rinput 85 104 115 Ω Differential input termination. Minimal Vi to turn on transmit function. SDIO Connection to Coax Zcoax 72 (48) 75 (50) 78 (52) Ω Required coax cable characteristic impedance. RSDIO 65 (46) 75 (51) 86 (55) Ω Input impedance between SDIO and AGND. Rloss 20 — — dB Coax return-loss as seen on SDIO pin. Frequency range = 10 MHz-62.5 MHz. VTX 250 300 350 mV Transmit amplitude. trise_tx 350 450 550 ps Rise/fall time 20% to 80% of VTX. Attmax — 10 — dB Cable attenuation budget @ 62.5 MHz. VRXmin — 40 — mV Minimum input for fully reconstructed output. 2009-2016 Microchip Technology Inc. DS60001314A-page 9 EQCO875SC.3/EQCO850SC.3 TABLE 4-2: ELECTRICAL CHARACTERISTICS (CONTINUED) SDOp/SDOn Outputs (LVDS-like) Vo 250 350 450 mV Vcmout 1.1 1.2 1.3 V Common-mode output voltage. Routput 85 102 115 Ω Differential termination between SDOp and SDOn. trise_o 150 240 350 ps Rise/fall time 20% to 80% of VSDOp,n. TABLE 4-3: Output amplitude VSDOp,n. JITTER PERFORMANCE Parameter Min. Typ. Max. Units Conditions Jitter peak-to-peak on SDO — 40% 50% UI 150m RG6 coax; over full VCC, VTX, and temp range; 125 Mbps; pattern PRBS7 TABLE 4-4: TEMPERATURE SPECIFICATIONS Parameter Symbol Min. Typ. Max. Unit Operating Ambient Temperature TA -10 – 70 °C Operating Junction Temperature TJ -10 – 85 °C JT – 1.2 – °C/W Typical Junction to Ambient JA – 59 – °C/W Typical Junction to Case JC – 10 – °C/W Temperature Ranges Thermal Package Resistances Typical Junction to Package DS60001314A-page 10 2009-2016 Microchip Technology Inc. EQCO875SC.3/EQCO850SC.3 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 16-Lead Plastic Quad Flat, No Lead Package – 4x4x0.9 mm Body [QFN] 16-Lead QFN (4x4x0.9 mm) PIN 1 Example PIN 1 EQCO YYWWNNN Legend: XX...X YY WW NNN *e3 Note: 875SC.3 YYWWNNN Part number Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code (optional) Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. e3 In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2009-2016 Microchip Technology Inc. DS60001314A-page 11 EQCO875SC.3/EQCO850SC.3 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.20 C 2X TOP VIEW 0.20 C 0.10 C C A1 A SEATING PLANE 16X SIDE VIEW (A3) 0.10 0.08 C C A B D2 (16X K) 0.10 C A B E2 e 2 2 1 16X L N e BOTTOM VIEW 16X b 0.10 0.05 C A B C Microchip Technology Drawing C04-259B Sheet 1 of 2 DS60001314A-page 12 2009-2016 Microchip Technology Inc. EQCO875SC.3/EQCO850SC.3 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch A Overall Height Standoff A1 A3 Terminal Thickness Overall Width E E2 Exposed Pad Width D Overall Length D2 Exposed Pad Length b Terminal Width Terminal Length L K Terminal-to-Exposed-Pad MIN 0.80 0.00 1.95 1.95 0.25 0.45 MILLIMETERS NOM 16 0.65 BSC 0.87 0.02 0.20 REF 4.00 BSC 2.05 4.00 BSC 2.05 0.30 0.55 0.425 REF MAX 0.95 0.05 2.15 2.15 0.35 0.65 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-259B Sheet 2 of 2 2009-2016 Microchip Technology Inc. DS60001314A-page 13 EQCO875SC.3/EQCO850SC.3 16-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C1 X2 16 G1 1 X1 2 C2 Y2 Y1 E SILK SCREEN RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C1 Contact Pad Spacing C2 Contact Pad Width (X16) X1 Contact Pad Length (X16) Y1 Contact Pad to Center Pad (X16) G1 MIN MILLIMETERS NOM 0.65 BSC MAX 2.15 2.15 3.625 3.625 0.30 0.725 0.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2259A DS60001314A-page 14 2009-2016 Microchip Technology Inc. EQCO875SC.3/EQCO850SC.3 APPENDIX A: REVISION HISTORY Revision A (April 2016) This is the initial release of the document in the Microchip format. This replaces EqcoLogic document version 2.0. TABLE A-1: REVISION HISTORY Version Date 2v0 1/28/14 Merged 50Ω and 75Ω systems into one data sheet. 1v2 10/25/11 Fixed lower temperature limit. 1v1 6/8/11 Fixed bitrate, temperature range, SDIP/SDIN descriptions. 0v4 2/28/11 Internal quality review. Removed Preliminary status. 0v3 10/26/09 Technical review. Revised Section 5.1 0v2 10/15/09 Internal review. 0v1 10/15/09 Modified from EQCO875SC IEEE1394 data sheet. 2009-2016 Microchip Technology Inc. Comments DS60001314A-page 15 EQCO875SC.3/EQCO850SC.3 NOTES: DS60001314A-page 16 2009-2016 Microchip Technology Inc. EQCO875SC.3/EQCO850SC.3 THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2009-2016 Microchip Technology Inc. DS60001314A-page 17 EQCO875SC.3/EQCO850SC.3 PRODUCT IDENTIFICATION SYSTEM To order parts, including industrial, or obtain information, for e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. XXXX Device Package Device: Examples: a) EQCO875SC.3 EQCO850SC.3 Package: TRAY b) EQCO875SC.3-TRAY = 75Ω Coax, Industrial temperature, 16-Lead QFN package, Tray packaging EQCO850SC.3 = 50Ω Coax, Industrial temperature, 16-Lead QFN package, Tube packaging = Tray “blank” = Tube DS60001314A-page 18 2009-2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2009-2016 Microchip Technology Inc. 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Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2009-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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