ATV0000CE2

Light Touch Switches/EVQPL/3PL/5PL/PT
4.9 mm Square SMD Light Touch Switches
Type:
EVQPL/EVQ3PL
EVQ5PL/EVQPT
■ Features
■ Recommended Applications
● External dimensions : 4.9 mm҂4.9 mm,
● Car electronics equipment
Height: 0.8 mm(Without push plate), 1.5 mm(With push plate)
■ Explanation of Part Numbers
1
2
3
4
5
E
V
Q
P
L
Product Code
6
7
8
9
A
Type
Height
■ Product Chart
Height
H=0.8 mm
H=1.5 mm
(With Push Plate)
Embossed
Embossed
EVQPLB
EVQPLD, EVQPT5
Packaging
Operating Force
1.0 N
1.6 N
EVQPLF
EVQPLH, EVQPT9
2.6 N
EVQPLK
EVQPLM
3.5 N
EVQ5PL
EVQ3PL
■ Specifications
Type
Snap action/Push-on type SPST
Rating
10 µA 2 Vdc to 20 mA 15 Vdc (Resistive load)
Contact Resistance
Electrical
Insulation Resistance
Dielectric Withstanding Voltage
50 m액 max.
50 M액 min. (at 100 Vdc)
250 Vac for 1 minute
3 ms max. (ON)
8 ms max. (OFF)
Bouncing
Operating Force
Mechanical
Travel
Endurance
Operating Life
Operating Temperature
Storage Temperature
Minimum Quantity/Packing Unit
Quantity/Carton
1.0 N±0.5 N
1.6 N±0.5 N
2.6 N±0.6 N
3.5 N±1.0 N
0.25 mm
+0.10
–0.20
mm
500000 cycles min.
200000 cycles min.
–20 °C to +70 °C
–40 °C to +85 °C (Bulk)
–20 °C to +60 °C (Taping)
5000 pcs. Embossed Taping (Reel Pack)
25000 pcs.
Note: Non washable
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Oct. 2012
Light Touch Switches/EVQPL/3PL/5PL/PT
■ Dimensions in mm (not to scale)
0.45
0.05
A
0.3
B
2
φ3.
0.2
4.9
4.6
EVQPLB
EVQPLF
EVQPLK
EVQ5PL
Be careful not to
scratch the film
(Embossed Taping)
Surface mount
For reflow soldering
Without push plate
A'
B'
Operating part
1.2
3.7
4.6
4.9
2.5
5.0±0.5
No. 1
0.4
0.8
(5.5)
(4.6)
4.3
3.1
(1)
A
B
3.4
5.4
GND
A’
PWB land pattern for reference
Height
0.8 mm
0.8 mm
0.8 mm
0.8 mm
4
B φ2.
Operating part
Operating Life
500000 cycles
500000 cycles
200000 cycles
200000 cycles
0.45
0.05
(Embossed Taping)
A’
B’
φ4
.4
0.4
0.8
1.2
1.5 +– 0.2
0.1
(5.5)
(4.6)
4.3
3.1
A
(1)
GND
1.2
3.7
4.6
4.9
B
3.4
5.4
Surface mount
For reflow soldering
With push plate
2.5
5±0.5
0.2
(3.4)
(3.8)
0.3
A
φ2.2
φ4
EVQPLD/PT5
EVQPLH/PT9
EVQPLM
EVQ3PL
Operating Force
1.0 N
1.6 N
2.6 N
3.5 N
4.9
4.6
Part Numbers
EVQPLBA08
EVQPLFA08
EVQPLKA08
EVQ5PLA08
No. 2
B’
Circuit diagram
A’
PWB land pattern for reference
Part Numbers
EVQPLDA15/PT5A15
EVQPLHA15/PT9A15
EVQPLMA15
EVQ3PLA15
Operating Force
1.0 N
1.6 N
2.6 N
3.5 N
B’
Circuit diagram
Height
1.5 mm
1.5 mm
1.5 mm
1.5 mm
Operating Life
500000/2000000 cycles
500000/2000000 cycles
200000 cycles
200000 cycles
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Oct. 2012
Light Touch Switches/EVQPL/3PL/5PL/PT
■ Recommended Reflow Soldering Conditions
● Embossed Carrier Taping
Fan or Normal Temp.
230
180
Tape width=12.0 mm
t1
150
Feeding hole
Chip pocket
P2 P0
E
φD0
F
W
A
B
Operation Top (°C)
MAX.
260
(Normal Temp.)
90±30
40±10
t2
P1
Chip component
Tape running direction
Soldering Time (s)
Unit: mm
Part No.
EVQPL
EVQ3PL
EVQ5PL
EVQPT
Height
A
B
W
0.8/1.5
5.0±0.2
5.0±0.2
12.0±0.3
F
E
P1
5.5±0.1 1.75±0.10 8.0±0.1
P2
P0
D0 Dia.
2.0±0.1
4.0±0.1
1.5 –0
t1
+0.1
t2
0.35±0.05 1.0/1.7±0.2
● Standard Reel Dimensions in mm (not to scale)
T
Item
A
B
C
Rate (mm) φ370.0±2.0 φ50.0 min. φ13.0±0.5
E
C
Item
W
E
2.0±0.5
T
t
r
—
1.0 to 3.0
1.0±0.5
B
Rate (mm) 14.0±1.5
D
φ21.0±1.0
D
r
A
W
■ Recommended Shape of Test Pole
for Reflow
soldering
type
t
■ Recommended Operating Conditions
0.3 mm max.
Test pole
φ1.0
Leaning angle range
90 °±4 °
(vertical direction)
Switch
R0.2±0.05
Mounting surface
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Oct. 2012
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