HT8972 Voice Echo Features · Operating voltage: 4.5V~5.5V · Low distortion rate - Echo mode: 1% - Surround mode: 0.2% · ADM algorithm · Low noise - Echo mode: -85dB - Surround mode: -90dB · Built-in 40Kb SRAM · Automatic reset function · 16-pin DIP/SOP package Applications · Television · Video disc player · Karaoke systems · Sound equipments General Description The HT8972 is an echo/surround effect processor. It is designed for various audio systems including karaoke, television, sound equipments, etc. The chip consists of a built-in pre-amplifier, VCO or Voltage Control OSC, 40Kb SRAM, A/D and D/A converters as well as delay time control logic. Its built-in 40Kb SRAM can generate delay time effect and can control the delay time value through the external VCO resistor. The VCO circuit can reduce external components and make it easy to adjust the delay time. Block Diagram L P F 1 _ IN L P F 1 _ O U T L P F 2 _ O U T L P F 2 _ IN O P 2 _ O U T 4 .7 k W C O M P O P 2 _ IN O P 1 _ IN 4 .7 k W O P 1 _ O U T C C 0 C C 1 M O D D E M L P F 2 L P F 1 1 /2 V C C A U T O R E S E T V C C Rev. 1.00 R E F D O 0 D I M O A G N D M I 4 0 K B its R A M D G N D D O 1 C L O C K V C O O S C _ O v c o 1 December 23, 2008 HT8972 Pin Assignment V C C 1 1 6 L P F 1 _ IN R E F 2 1 5 L P F 1 _ O U T A G N D 3 1 4 L P F 2 _ O U T D G N D 4 1 3 L P F 2 _ IN O S C _ O 5 1 2 O P 2 _ O U T V C O 6 1 1 O P 2 _ IN C C 1 7 1 0 O P 1 _ IN C C 0 8 9 O P 1 _ O U T H T 8 9 7 2 1 6 D IP -A /S O P -A Pad Assignment D G N D A G N D R E F V C C L P F 1 _ IN L P F 1 _ O U T L P F 2 _ O U T L P F 2 _ IN 1 1 6 1 5 1 4 1 3 1 2 1 1 1 0 (0 ,0 ) 7 8 9 O P 2 _ O U T O P 2 _ IN O P 1 _ IN V C O 6 O P 1 _ O U T O S C _ O 5 4 C C 0 3 C C 1 2 Chip size: 2475´2065 (mm)2 * The IC substrate should be connected to VSS in the PCB layout artwork. Rev. 1.00 2 December 23, 2008 HT8972 Pad Coordinates Pad No. Unit: mm X Y Pad No. X Y -892.700 890.431 1 -883.875 861.250 9 1027.425 2 -865.105 -891.900 10 907.375 3 -564.105 -892.700 11 715.175 890.429 4 -892.700 12 467.375 890.431 5 -44.775 147.425 -892.700 13 275.175 890.429 6 395.225 -892.700 14 60.790 879.700 7 587.425 -892.700 15 -203.150 868.440 8 835.225 -892.700 16 -783.875 861.250 Pad Description Pad No. Pad Name I/O Internal Connection Description 1 DGND I ¾ Digital ground 2 OSC_O O ¾ System oscillator output 3 VCO I ¾ System oscillator input, system frequency adjustable pin 4 CC1 ¾ ¾ Current control 1 5 CC0 ¾ ¾ Current control 0 6 OP1_OUT O ¾ OP1 output 7 OP1_IN I ¾ OP1 input 8 OP2_IN I ¾ OP2 input 9 OP2_OUT O ¾ OP2 output 10 LPF2_IN I ¾ Low pass filter 2 input 11 LPF2_OUT O ¾ Low pass filter 2 output 12 LPF1_OUT O ¾ Low pass filter 1 output 13 LPF1_IN I ¾ Low pass filter 1 input 14 VCC I ¾ Analog and positive power supply 15 REF I ¾ Analog reference voltage 16 AGND I ¾ Analog ground Absolute Maximum Ratings Supply Voltage ...........................VSS-0.3V to VSS+6.0V Storage Temperature ............................-50°C to 125°C Input Voltage..............................VSS-0.3V to VDD+0.3V Operating Temperature .............................-20°C to 70° Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Rev. 1.00 3 December 23, 2008 HT8972 Electrical Characteristics Symbol Parameter Ta=25°C Test Conditions VDD Conditions Min. Typ. Max. Unit VCC Operating Voltage ¾ ¾ 4.5 5.0 5.5 V ICC Operating Current 5V ¾ ¾ 15 30 mA GV Voltage Gain 5V RL=47kW ¾ -0.9 2.5 dB VOMAX Maximum Output Voltage 5V THD=10% 0.9 1.8 ¾ Vrms THD Total Harmonic Distortion 5V Filter= A-Weighting ¾ 0.7 1.5 % NO Output Noise Voltage 5V Filter= A-Weighting ¾ -85 -60 dBV PSRR Power Supply Rejection Ratio 5V DVCC=-20dBV (0.1Vrms) f=100Hz ¾ -40 -30 dB Rev. 1.00 4 December 23, 2008 HT8972 Functional Description · Echo mode The HT8972 is an echo/surround effect generator with built-in 40Kb SRAM. It ensures low distortion as well as low noise for processing audio signal delay. The chip provides two playing modes (echo and surround) and the playing function block diagrams are shown as follows. V V IN L P F 1 O U T A /D D e la y D /A L P F 2 · Surround mode V IN L P F 1 A /D D e la y D /A V L P F 2 O U T ROSC-fOSC-Delay_time-Distortion Cross table ROSC 56.2 44 36.3 30.6 25.9 23.1 20.7 kW fOSC 2 2.5 3 3.5 4 4.5 5 MHz Td 320 264 219 188 164 147 132 ms THD 1.3 1.05 0.815 0.625 0.58 0.525 0.43 % ROSC 18.5 16.7 15.1 14.5 13.9 11.9 10.9 kW fOSC 5.5 6 6.5 7 7.5 8 8.5 MHz Td 120 110 102 93 88 82 78 ms THD 0.4 0.335 0.315 0.3 0.275 0.26 0.25 % ROSC 10 9 8.06 7.3 6.4 5.8 5.3 kW fOSC 9 10 11 12 13 14 15 MHz Td 73.2 65.6 59.2 54.4 50 46 44 ms THD 0.23 0.218 0.205 0.19 0.17 0.1675 0.1575 % ROSC 4.8 4.4 4 3.7 3.3 3 2.8 kW fOSC 16 17 18 19 20 21 22 MHz Td 41.2 38.4 36 33.6 33 32 30 ms THD 0.16 0.145 0.14 0.14 0.13 0.125 0.12 % Rev. 1.00 5 December 23, 2008 HT8972 Application Circuits Echo Mode 1 m F 1 m F 1 k W 9 V 1 k W 3 M IC 2 8 4 .7 k W 4 .7 k W 4 4 7 k W 3 9 p F 4 .7 k W 5 6 0 W 4 .7 k W 1 V C C 2 0 .1 m F 4 7 m F 3 R E F 4 A G N D R 1 6 L P F 1 _ IN 1 5 L P F 1 _ O U T 5 O S C _ O 6 V C O 2 0 k W D e la y T im e 1 4 1 3 1 2 O P 2 _ O U T 0 .1 m F 0 .1 m F 4 .7 m F 4 .7 m F 2 .7 k W 4 .7 k W C C 1 O P 2 _ IN C C 0 O P 1 _ IN O P 1 _ O U T 1 0 0 k W 1 0 m F 1 0 m F 0 .0 3 3 m F L P F 2 _ IN 8 4 .3 k W 1 0 0 0 p F 3 .3 k W L P F 2 _ O U T 7 1 0 k W 4 .3 k W D G N D 2 0 k W O S C 6 8 0 0 p F 2 2 m F V C C 1 0 0 m F 2 0 k W M IC V O L 4 7 k W 1 0 0 m F V C C 4 .7 m F 1 4 5 5 8 E c h o M o d e F e e d B a c k O u tp u t 1 2 5 0 k W 4 .3 k W 5 6 0 p F 1 0 k W 4 .3 k W 6 8 0 0 p F 6 8 0 0 p F 1 1 9 1 0 6 8 0 0 p F H T 8 9 7 2 Note: 1. : Analog ground, : Digital ground 2. When the value of the Rosc increases, the range of the Delay time also increases. Please refer to the ROSC-fOSC-Delay_time-Distortion Cross table for the ROSC & Delay time values. Rev. 1.00 6 December 23, 2008 HT8972 Surround Mode 1 m F 1 m F 1 k W 9 V 1 k W 3 M IC 2 8 4 .7 k W 4 .7 k W 4 4 7 k W 5 6 0 W 4 .7 k W V C C 2 0 .1 m F 4 7 m F 3 R E F 4 A G N D R 5 O S C _ O 6 V C O 2 0 k W D e la y T im e L P F 1 _ IN 1 5 L P F 1 _ O U T 0 .1 m F 1 0 0 0 p F 1 0 m F S u rro u n d M o d e O u tp u t 1 2 1 4 1 3 1 2 O P 2 _ O U T 0 .1 m F 1 0 k W 3 .3 k W L P F 2 _ IN 8 4 .7 m F 4 .3 k W L P F 2 _ O U T 7 4 .3 k W 1 0 0 k W 1 6 D G N D 2 0 k W O S C 6 8 0 0 p F 2 2 m F V C C 1 0 0 m F 2 0 k W 3 9 p F 4 .7 k W 1 M IC V O L 4 7 k W 1 0 0 m F V C C 4 .7 m F 1 4 5 5 8 C C 1 O P 2 _ IN C C 0 O P 1 _ IN O P 1 _ O U T 1 1 4 .3 k W 5 6 0 p F 1 0 k W 4 .3 k W 6 8 0 0 p F 6 8 0 0 p F 9 1 0 6 8 0 0 p F H T 8 9 7 2 Note: 1. : Analog ground, : Digital ground 2. When the value of the Rosc increases, the range of the Delay time also increases. Please refer to the ROSC-fOSC-Delay_time-Distortion Cross table for the ROSC & Delay time values. Rev. 1.00 7 December 23, 2008 HT8972 Package Information 16-pin DIP (300mil) Outline Dimensions A B A 1 6 9 1 8 B 1 6 9 1 8 H H C C D D G E G E I F I F Fig1. Full Lead Packages Fig2. 1/2 Lead Packages · MS-001d (see fig1) Symbol Dimensions in mil Min. Nom. Max. A 780 ¾ 880 B 240 ¾ 280 C 115 ¾ 195 D 115 ¾ 150 E 14 ¾ 22 F 45 ¾ 70 G ¾ 100 ¾ H 300 ¾ 325 I ¾ ¾ 430 · MS-001d (see fig2) Symbol Rev. 1.00 Dimensions in mil Min. Nom. Max. A 735 ¾ 775 B 240 ¾ 280 C 115 ¾ 195 D 115 ¾ 150 E 14 ¾ 22 F 45 ¾ 70 G ¾ 100 ¾ H 300 ¾ 325 I ¾ ¾ 430 8 December 23, 2008 HT8972 · MO-095a (see fig2) Symbol A Rev. 1.00 Dimensions in mil Min. Nom. Max. 745 ¾ 785 B 275 ¾ 295 C 120 ¾ 150 D 110 ¾ 150 E 14 ¾ 22 F 45 ¾ 60 G ¾ 100 ¾ H 300 ¾ 325 I ¾ ¾ 430 9 December 23, 2008 HT8972 16-pin SOP (300mil) Outline Dimensions 1 6 9 A B 1 8 C C ' G H D E a F · MS-013 Symbol Rev. 1.00 Dimensions in mil Min. Nom. Max. A 393 ¾ 419 B 256 ¾ 300 C 12 ¾ 20 C¢ 398 ¾ 413 D ¾ ¾ 104 E ¾ 50 ¾ F 4 ¾ 12 G 16 ¾ 50 H 8 ¾ 13 a 0° ¾ 8° 10 December 23, 2008 HT8972 Product Tape and Reel Specifications Reel Dimensions D T 2 A C B T 1 SOP 16W (300mil) Symbol Description A Reel Outer Diameter Dimensions in mm 330.0±1.0 B Reel Inner Diameter 100.0±1.5 C Spindle Hole Diameter 13.0+0.5/-0.2 D Key Slit Width T1 Space Between Flange T2 Reel Thickness Rev. 1.00 2.0±0.5 16.8+0.3/-0.2 22.2±0.2 11 December 23, 2008 HT8972 Carrier Tape Dimensions P 0 D P 1 t E F W C D 1 B 0 P K 0 A 0 R e e l H o le IC p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e . SOP 16W (300mil) Symbol Description Dimensions in mm W Carrier Tape Width 16.0±0.2 P Cavity Pitch 12.0±0.1 E Perforation Position 1.75±0.10 F Cavity to Perforation (Width Direction) D Perforation Diameter 1.50+0.10/-0.00 D1 Cavity Hole Diameter 1.50+0.25/-0.00 P0 Perforation Pitch 7.5±0.1 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 10.9±0.1 B0 Cavity Width 10.8±0.1 K0 Cavity Depth 3.0±0.1 t Carrier Tape Thickness 0.30±0.05 C Cover Tape Width 13.3±0.1 Rev. 1.00 12 December 23, 2008 HT8972 Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) G Room, 3 Floor, No.1 Building, No.2016 Yi-Shan Road, Minhang District, Shanghai, China 201103 Tel: 86-21-5422-4590 Fax: 86-21-5422-4705 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, Gaoxin M 2nd, Middle Zone Of High-Tech Industrial Park, ShenZhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 86-10-6641-0030, 86-10-6641-7751, 86-10-6641-7752 Fax: 86-10-6641-0125 Holtek Semiconductor Inc. (Chengdu Sales Office) 709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016 Tel: 86-28-6653-6590 Fax: 86-28-6653-6591 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright Ó 2008 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 13 December 23, 2008