8972v100.pdf

HT8972
Voice Echo
Features
· Operating voltage: 4.5V~5.5V
· Low distortion rate
- Echo mode: 1%
- Surround mode: 0.2%
· ADM algorithm
· Low noise
- Echo mode: -85dB
- Surround mode: -90dB
· Built-in 40Kb SRAM
· Automatic reset function
· 16-pin DIP/SOP package
Applications
· Television
· Video disc player
· Karaoke systems
· Sound equipments
General Description
The HT8972 is an echo/surround effect processor. It is
designed for various audio systems including karaoke,
television, sound equipments, etc. The chip consists of
a built-in pre-amplifier, VCO or Voltage Control OSC,
40Kb SRAM, A/D and D/A converters as well as delay
time control logic.
Its built-in 40Kb SRAM can generate delay time effect
and can control the delay time value through the external VCO resistor.
The VCO circuit can reduce external components and
make it easy to adjust the delay time.
Block Diagram
L P F 1 _ IN
L P F 1 _ O U T
L P F 2 _ O U T
L P F 2 _ IN
O P 2 _ O U T
4 .7 k W
C O M P
O P 2 _ IN
O P 1 _ IN
4 .7 k W
O P 1 _ O U T
C C 0
C C 1
M O D
D E M
L P F 2
L P F 1
1 /2 V C C
A U T O
R E S E T
V C C
Rev. 1.00
R E F
D O 0
D I
M O
A G N D
M I
4 0 K B its
R A M
D G N D
D O 1
C L O C K
V C O
O S C _ O
v c o
1
December 23, 2008
HT8972
Pin Assignment
V C C
1
1 6
L P F 1 _ IN
R E F
2
1 5
L P F 1 _ O U T
A G N D
3
1 4
L P F 2 _ O U T
D G N D
4
1 3
L P F 2 _ IN
O S C _ O
5
1 2
O P 2 _ O U T
V C O
6
1 1
O P 2 _ IN
C C 1
7
1 0
O P 1 _ IN
C C 0
8
9
O P 1 _ O U T
H T 8 9 7 2
1 6 D IP -A /S O P -A
Pad Assignment
D G N D
A G N D
R E F
V C C
L P F 1 _ IN
L P F 1 _ O U T
L P F 2 _ O U T
L P F 2 _ IN
1
1 6
1 5
1 4
1 3
1 2
1 1
1 0
(0 ,0 )
7
8
9
O P 2 _ O U T
O P 2 _ IN
O P 1 _ IN
V C O
6
O P 1 _ O U T
O S C _ O
5
4
C C 0
3
C C 1
2
Chip size: 2475´2065 (mm)2
* The IC substrate should be connected to VSS in the PCB layout artwork.
Rev. 1.00
2
December 23, 2008
HT8972
Pad Coordinates
Pad No.
Unit: mm
X
Y
Pad No.
X
Y
-892.700
890.431
1
-883.875
861.250
9
1027.425
2
-865.105
-891.900
10
907.375
3
-564.105
-892.700
11
715.175
890.429
4
-892.700
12
467.375
890.431
5
-44.775
147.425
-892.700
13
275.175
890.429
6
395.225
-892.700
14
60.790
879.700
7
587.425
-892.700
15
-203.150
868.440
8
835.225
-892.700
16
-783.875
861.250
Pad Description
Pad No.
Pad Name
I/O
Internal Connection
Description
1
DGND
I
¾
Digital ground
2
OSC_O
O
¾
System oscillator output
3
VCO
I
¾
System oscillator input, system frequency adjustable pin
4
CC1
¾
¾
Current control 1
5
CC0
¾
¾
Current control 0
6
OP1_OUT
O
¾
OP1 output
7
OP1_IN
I
¾
OP1 input
8
OP2_IN
I
¾
OP2 input
9
OP2_OUT
O
¾
OP2 output
10
LPF2_IN
I
¾
Low pass filter 2 input
11
LPF2_OUT
O
¾
Low pass filter 2 output
12
LPF1_OUT
O
¾
Low pass filter 1 output
13
LPF1_IN
I
¾
Low pass filter 1 input
14
VCC
I
¾
Analog and positive power supply
15
REF
I
¾
Analog reference voltage
16
AGND
I
¾
Analog ground
Absolute Maximum Ratings
Supply Voltage ...........................VSS-0.3V to VSS+6.0V
Storage Temperature ............................-50°C to 125°C
Input Voltage..............................VSS-0.3V to VDD+0.3V
Operating Temperature .............................-20°C to 70°
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Rev. 1.00
3
December 23, 2008
HT8972
Electrical Characteristics
Symbol
Parameter
Ta=25°C
Test Conditions
VDD
Conditions
Min.
Typ.
Max.
Unit
VCC
Operating Voltage
¾
¾
4.5
5.0
5.5
V
ICC
Operating Current
5V
¾
¾
15
30
mA
GV
Voltage Gain
5V
RL=47kW
¾
-0.9
2.5
dB
VOMAX
Maximum Output Voltage
5V
THD=10%
0.9
1.8
¾
Vrms
THD
Total Harmonic Distortion
5V
Filter= A-Weighting
¾
0.7
1.5
%
NO
Output Noise Voltage
5V
Filter= A-Weighting
¾
-85
-60
dBV
PSRR
Power Supply Rejection Ratio
5V
DVCC=-20dBV (0.1Vrms)
f=100Hz
¾
-40
-30
dB
Rev. 1.00
4
December 23, 2008
HT8972
Functional Description
· Echo mode
The HT8972 is an echo/surround effect generator with
built-in 40Kb SRAM. It ensures low distortion as well as
low noise for processing audio signal delay. The chip
provides two playing modes (echo and surround) and
the playing function block diagrams are shown as follows.
V
V
IN
L P F 1
O U T
A /D
D e la y
D /A
L P F 2
· Surround mode
V
IN
L P F 1
A /D
D e la y
D /A
V
L P F 2
O U T
ROSC-fOSC-Delay_time-Distortion Cross table
ROSC
56.2
44
36.3
30.6
25.9
23.1
20.7
kW
fOSC
2
2.5
3
3.5
4
4.5
5
MHz
Td
320
264
219
188
164
147
132
ms
THD
1.3
1.05
0.815
0.625
0.58
0.525
0.43
%
ROSC
18.5
16.7
15.1
14.5
13.9
11.9
10.9
kW
fOSC
5.5
6
6.5
7
7.5
8
8.5
MHz
Td
120
110
102
93
88
82
78
ms
THD
0.4
0.335
0.315
0.3
0.275
0.26
0.25
%
ROSC
10
9
8.06
7.3
6.4
5.8
5.3
kW
fOSC
9
10
11
12
13
14
15
MHz
Td
73.2
65.6
59.2
54.4
50
46
44
ms
THD
0.23
0.218
0.205
0.19
0.17
0.1675
0.1575
%
ROSC
4.8
4.4
4
3.7
3.3
3
2.8
kW
fOSC
16
17
18
19
20
21
22
MHz
Td
41.2
38.4
36
33.6
33
32
30
ms
THD
0.16
0.145
0.14
0.14
0.13
0.125
0.12
%
Rev. 1.00
5
December 23, 2008
HT8972
Application Circuits
Echo Mode
1 m F
1 m F
1 k W
9 V
1 k W
3
M IC
2
8
4 .7 k W
4 .7 k W
4
4 7 k W
3 9 p F
4 .7 k W
5 6 0 W
4 .7 k W
1
V C C
2
0 .1 m F
4 7 m F
3
R E F
4
A G N D
R
1 6
L P F 1 _ IN
1 5
L P F 1 _ O U T
5
O S C _ O
6
V C O
2 0 k W
D e la y T im e
1 4
1 3
1 2
O P 2 _ O U T
0 .1 m F
0 .1 m F
4 .7 m F
4 .7 m F
2 .7 k W
4 .7 k W
C C 1
O P 2 _ IN
C C 0
O P 1 _ IN
O P 1 _ O U T
1 0 0 k W
1 0 m F
1 0 m F
0 .0 3 3 m F
L P F 2 _ IN
8
4 .3 k W
1 0 0 0 p F
3 .3 k W
L P F 2 _ O U T
7
1 0 k W
4 .3 k W
D G N D
2 0 k W
O S C
6 8 0 0 p F
2 2 m F
V C C
1 0 0 m F
2 0 k W
M IC V O L
4 7 k W
1 0 0 m F
V C C
4 .7 m F
1
4 5 5 8
E c h o M o d e
F e e d B a c k
O u tp u t
1
2
5 0 k W
4 .3 k W
5 6 0 p F
1 0 k W
4 .3 k W
6 8 0 0 p F
6 8 0 0 p F
1 1
9
1 0
6 8 0 0 p F
H T 8 9 7 2
Note: 1.
: Analog ground,
: Digital ground
2. When the value of the Rosc increases, the range of the Delay time also increases. Please refer to the
ROSC-fOSC-Delay_time-Distortion Cross table for the ROSC & Delay time values.
Rev. 1.00
6
December 23, 2008
HT8972
Surround Mode
1 m F
1 m F
1 k W
9 V
1 k W
3
M IC
2
8
4 .7 k W
4 .7 k W
4
4 7 k W
5 6 0 W
4 .7 k W
V C C
2
0 .1 m F
4 7 m F
3
R E F
4
A G N D
R
5
O S C _ O
6
V C O
2 0 k W
D e la y T im e
L P F 1 _ IN
1 5
L P F 1 _ O U T
0 .1 m F
1 0 0 0 p F
1 0 m F
S u rro u n d M o d e
O u tp u t
1
2
1 4
1 3
1 2
O P 2 _ O U T
0 .1 m F
1 0 k W
3 .3 k W
L P F 2 _ IN
8
4 .7 m F
4 .3 k W
L P F 2 _ O U T
7
4 .3 k W
1 0 0 k W
1 6
D G N D
2 0 k W
O S C
6 8 0 0 p F
2 2 m F
V C C
1 0 0 m F
2 0 k W
3 9 p F
4 .7 k W
1
M IC V O L
4 7 k W
1 0 0 m F
V C C
4 .7 m F
1
4 5 5 8
C C 1
O P 2 _ IN
C C 0
O P 1 _ IN
O P 1 _ O U T
1 1
4 .3 k W
5 6 0 p F
1 0 k W
4 .3 k W
6 8 0 0 p F
6 8 0 0 p F
9
1 0
6 8 0 0 p F
H T 8 9 7 2
Note: 1.
: Analog ground,
: Digital ground
2. When the value of the Rosc increases, the range of the Delay time also increases. Please refer to the
ROSC-fOSC-Delay_time-Distortion Cross table for the ROSC & Delay time values.
Rev. 1.00
7
December 23, 2008
HT8972
Package Information
16-pin DIP (300mil) Outline Dimensions
A
B
A
1 6
9
1
8
B
1 6
9
1
8
H
H
C
C
D
D
G
E
G
E
I
F
I
F
Fig1. Full Lead Packages
Fig2. 1/2 Lead Packages
· MS-001d (see fig1)
Symbol
Dimensions in mil
Min.
Nom.
Max.
A
780
¾
880
B
240
¾
280
C
115
¾
195
D
115
¾
150
E
14
¾
22
F
45
¾
70
G
¾
100
¾
H
300
¾
325
I
¾
¾
430
· MS-001d (see fig2)
Symbol
Rev. 1.00
Dimensions in mil
Min.
Nom.
Max.
A
735
¾
775
B
240
¾
280
C
115
¾
195
D
115
¾
150
E
14
¾
22
F
45
¾
70
G
¾
100
¾
H
300
¾
325
I
¾
¾
430
8
December 23, 2008
HT8972
· MO-095a (see fig2)
Symbol
A
Rev. 1.00
Dimensions in mil
Min.
Nom.
Max.
745
¾
785
B
275
¾
295
C
120
¾
150
D
110
¾
150
E
14
¾
22
F
45
¾
60
G
¾
100
¾
H
300
¾
325
I
¾
¾
430
9
December 23, 2008
HT8972
16-pin SOP (300mil) Outline Dimensions
1 6
9
A
B
1
8
C
C '
G
H
D
E
a
F
· MS-013
Symbol
Rev. 1.00
Dimensions in mil
Min.
Nom.
Max.
A
393
¾
419
B
256
¾
300
C
12
¾
20
C¢
398
¾
413
D
¾
¾
104
E
¾
50
¾
F
4
¾
12
G
16
¾
50
H
8
¾
13
a
0°
¾
8°
10
December 23, 2008
HT8972
Product Tape and Reel Specifications
Reel Dimensions
D
T 2
A
C
B
T 1
SOP 16W (300mil)
Symbol
Description
A
Reel Outer Diameter
Dimensions in mm
330.0±1.0
B
Reel Inner Diameter
100.0±1.5
C
Spindle Hole Diameter
13.0+0.5/-0.2
D
Key Slit Width
T1
Space Between Flange
T2
Reel Thickness
Rev. 1.00
2.0±0.5
16.8+0.3/-0.2
22.2±0.2
11
December 23, 2008
HT8972
Carrier Tape Dimensions
P 0
D
P 1
t
E
F
W
C
D 1
B 0
P
K 0
A 0
R e e l H o le
IC p a c k a g e p in 1 a n d th e r e e l h o le s
a r e lo c a te d o n th e s a m e s id e .
SOP 16W (300mil)
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
16.0±0.2
P
Cavity Pitch
12.0±0.1
E
Perforation Position
1.75±0.10
F
Cavity to Perforation (Width Direction)
D
Perforation Diameter
1.50+0.10/-0.00
D1
Cavity Hole Diameter
1.50+0.25/-0.00
P0
Perforation Pitch
7.5±0.1
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
10.9±0.1
B0
Cavity Width
10.8±0.1
K0
Cavity Depth
3.0±0.1
t
Carrier Tape Thickness
0.30±0.05
C
Cover Tape Width
13.3±0.1
Rev. 1.00
12
December 23, 2008
HT8972
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
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Fax: 886-3-563-1189
http://www.holtek.com.tw
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Tel: 86-21-5422-4590
Fax: 86-21-5422-4705
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Copyright Ó 2008 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.
Rev. 1.00
13
December 23, 2008
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