PMBT2222; PMBT2222A NPN switching transistors Rev. 6 — 12 November 2010 Product data sheet 1. Product profile 1.1 General description NPN switching transistors in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package. Table 1. Product overview Type number Package PMBT2222 PNP complement NXP JEDEC SOT23 TO-236AB PMBT2907 PMBT2222A PMBT2907A 1.2 Features and benefits High current (max. 600 mA) Low voltage (max. 40 V) 1.3 Applications Switching and linear amplification 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions VCEO collector-emitter voltage open base IC hFE [1] Min Typ Max Unit PMBT2222 - - 30 V PMBT2222A - - 40 V mA collector current - - 600 100 - 300 DC current gain VCE = 10 V; IC = 150 mA [1] PMBT2222 VCE = 10 V; IC = 500 mA [1] 30 - - PMBT2222A VCE = 10 V; IC = 500 mA [1] 40 - - Pulse test: tp ≤ 300 μs; δ ≤ 0.02. PMBT2222; PMBT2222A NXP Semiconductors NPN switching transistors 2. Pinning information Table 3. Pinning Pin Description 1 base 2 emitter 3 collector Simplified outline Graphic symbol 3 3 1 1 2 2 sym021 3. Ordering information Table 4. Ordering information Type number PMBT2222 Package Name Description Version - plastic surface-mounted package; 3 leads SOT23 PMBT2222A 4. Marking Table 5. Marking codes Marking code[1] Type number PMBT2222 *1B PMBT2222A *1P [1] PMBT2222_PMBT2222A Product data sheet * = placeholder for manufacturing site code All information provided in this document is subject to legal disclaimers. Rev. 6 — 12 November 2010 © NXP B.V. 2010. All rights reserved. 2 of 12 PMBT2222; PMBT2222A NXP Semiconductors NPN switching transistors 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCBO collector-base voltage open emitter Min Max Unit PMBT2222 - 60 V PMBT2222A - 75 V - 30 V - 40 V PMBT2222 - 5 V PMBT2222A - 6 V IC collector current - 600 mA ICM peak collector current - 800 mA IBM peak base current - 200 mA - 250 mW VCEO collector-emitter voltage open base PMBT2222 PMBT2222A VEBO emitter-base voltage open collector Tamb ≤ 25 °C [1] Ptot total power dissipation Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 7. Symbol Rth(j-a) [1] PMBT2222_PMBT2222A Product data sheet Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air [1] Min Typ Max Unit - - 500 K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. All information provided in this document is subject to legal disclaimers. Rev. 6 — 12 November 2010 © NXP B.V. 2010. All rights reserved. 3 of 12 PMBT2222; PMBT2222A NXP Semiconductors NPN switching transistors 7. Characteristics Table 8. Characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter ICBO collector-base cut-off current PMBT2222 Conditions Min Typ Max Unit VCB = 50 V; IE = 0 A - - 10 nA VCB = 50 V; IE = 0 A; Tj = 125 °C - - 10 μA VCB = 60 V; IE = 0 A - - 10 nA VCB = 60 V; IE = 0 A; Tj = 125 °C - - 10 μA - 10 nA collector-base cut-off current PMBT2222A IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A - hFE DC current gain VCE = 10 V; IC = 0.1 mA 35 VCE = 10 V; IC = 1 mA 50 - - VCE = 10 V; IC = 10 mA 75 - - VCE = 10 V; IC = 10 mA; Tamb = −55 °C 35 - - VCE = 10 V; IC = 150 mA [1] 100 - 300 VCE = 1 V; IC = 150 mA [1] 50 - - VCE = 10 V; IC = 500 mA [1] 30 - - 40 - - - - 400 mV - - 300 mV PMBT2222 - - 1.6 V PMBT2222A - - 1 V DC current gain PMBT2222 PMBT2222A VCEsat collector-emitter saturation voltage IC = 150 mA; IB = 15 mA [1] PMBT2222 PMBT2222A collector-emitter saturation voltage PMBT2222_PMBT2222A Product data sheet IC = 500 mA; IB = 50 mA All information provided in this document is subject to legal disclaimers. Rev. 6 — 12 November 2010 [1] © NXP B.V. 2010. All rights reserved. 4 of 12 PMBT2222; PMBT2222A NXP Semiconductors NPN switching transistors Table 8. Characteristics …continued Tj = 25 °C unless otherwise specified. Symbol VBEsat Parameter Conditions base-emitter saturation IC = 150 mA; voltage IB = 15 mA Product data sheet Max Unit - - 1.3 V PMBT2222A 0.6 - 1.2 V [1] PMBT2222 - - 2.6 V PMBT2222A - - 2 V - - 8 pF Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz Ce emitter capacitance VEB = 500 mV; IC = ic = 0 A; f = 1 MHz PMBT2222 - - 30 pF PMBT2222A - - 25 pF PMBT2222 250 - - MHz PMBT2222A 300 - - MHz transition frequency VCE = 20 V; IC = 20 mA; f = 100 MHz NF noise figure VCE = 5 V; IC = 100 μA; RS = 1 kΩ; f = 1 kHz - - 4 dB td delay time - - 15 ns tr rise time ton turn-on time VCC = 10 V; IC = 150 mA; IBon = 15 mA; IBoff = −15 mA ts - - 20 ns - - 35 ns storage time - - 200 ns tf fall time - - 60 ns toff turn-off time - - 250 ns [1] PMBT2222_PMBT2222A Typ PMBT2222 base-emitter saturation IC = 500 mA; IB = 50 mA voltage fT Min [1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02. All information provided in this document is subject to legal disclaimers. Rev. 6 — 12 November 2010 © NXP B.V. 2010. All rights reserved. 5 of 12 PMBT2222; PMBT2222A NXP Semiconductors NPN switching transistors 8. Test information IB input pulse (idealized waveform) 90 % IBon (100 %) 10 % IBoff output pulse (idealized waveform) IC 90 % IC (100 %) 10 % t td ts tr ton Fig 1. tf toff 006aaa003 Switching time definition VBB RB VCC RC Vo (probe) oscilloscope 450 Ω (probe) 450 Ω oscilloscope R2 VI DUT R1 mlb826 VCC = 10 V; IC = 150 mA; IBon = 15 mA; IBoff = −15 mA Fig 2. Test circuit for switching times 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. PMBT2222_PMBT2222A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 12 November 2010 © NXP B.V. 2010. All rights reserved. 6 of 12 PMBT2222; PMBT2222A NXP Semiconductors NPN switching transistors 9. Package outline 3.0 2.8 1.1 0.9 3 0.45 0.15 2.5 1.4 2.1 1.2 1 2 1.9 0.48 0.38 Dimensions in mm Fig 3. 0.15 0.09 04-11-04 Package outline SOT23 (TO-236AB) 10. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMBT2222 Package SOT23 Description 4 mm pitch, 8 mm tape and reel Packing quantity 3000 10000 -215 -235 PMBT2222A [1] PMBT2222_PMBT2222A Product data sheet For further information and the availability of packing methods, see Section 14. All information provided in this document is subject to legal disclaimers. Rev. 6 — 12 November 2010 © NXP B.V. 2010. All rights reserved. 7 of 12 PMBT2222; PMBT2222A NXP Semiconductors NPN switching transistors 11. Soldering 3.3 2.9 1.9 solder lands solder resist 3 2 1.7 solder paste 0.6 (3×) 0.7 (3×) occupied area Dimensions in mm 0.5 (3×) 0.6 (3×) 1 Fig 4. sot023_fr Reflow soldering footprint SOT23 (TO-236AB) 2.2 1.2 (2×) 1.4 (2×) solder lands 4.6 solder resist 2.6 occupied area Dimensions in mm 1.4 preferred transport direction during soldering 2.8 4.5 Fig 5. PMBT2222_PMBT2222A Product data sheet sot023_fw Wave soldering footprint SOT23 (TO-236AB) All information provided in this document is subject to legal disclaimers. Rev. 6 — 12 November 2010 © NXP B.V. 2010. All rights reserved. 8 of 12 PMBT2222; PMBT2222A NXP Semiconductors NPN switching transistors 12. Revision history Table 10. Revision history Document ID Release date Data sheet status Change notice Supersedes PMBT2222_PMBT2222A v.6 20101112 Product data sheet - PMBT2222_2222A_5 Modifications: • • • • • • Section 4 “Marking”: updated Figure 1 “Switching time definition”: added Section 8 “Test information”: updated Section 10 “Packing information”: added Section 11 “Soldering”: added Section 13 “Legal information”: updated PMBT2222_2222A_5 20040122 Product specification - PMBT2222_2222A_4 PMBT2222_2222A_4 19990427 Product specification - PMBT2222_3 PMBT2222_3 19970909 Product specification - - PMBT2222_PMBT2222A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 12 November 2010 © NXP B.V. 2010. All rights reserved. 9 of 12 PMBT2222; PMBT2222A NXP Semiconductors NPN switching transistors 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. PMBT2222_PMBT2222A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 12 November 2010 © NXP B.V. 2010. All rights reserved. 10 of 12 PMBT2222; PMBT2222A NXP Semiconductors NPN switching transistors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PMBT2222_PMBT2222A Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 6 — 12 November 2010 © NXP B.V. 2010. All rights reserved. 11 of 12 NXP Semiconductors PMBT2222; PMBT2222A NPN switching transistors 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information . . . . . . . . . . . . . . . . . . . . . 7 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 12 November 2010 Document identifier: PMBT2222_PMBT2222A