Data Sheet

SO
T8
9
PXT2222A
NPN switching transistors
2 April 2014
Product data sheet
1. General description
NPN switching transistor in a medium power flat lead SOT89 (SC-62/TO-243) SurfaceMounted Device (SMD) plastic package.
PNP complement: PXT2907A
2. Features and benefits
•
•
High current: max. 600 mA
Low voltage: max. 40 V
3. Applications
•
Switching and linear amplification
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter
voltage
open base
-
-
40
V
IC
collector current
-
-
600
mA
hFE
DC current gain
100
-
300
VCE = 10 V; IC = 150 mA; Tamb = 25 °C;
δ ≤ 0.02; tp ≤ 300 µs; pulsed
5. Pinning information
Table 2.
Pinning information
Pin
Symbol Description
1
E
emitter
2
C
collector
3
B
base
Simplified outline
C
B
3
2
1
SOT89
Scan or click this QR code to view the latest information for this product
Graphic symbol
E
sym123
PXT2222A
NXP Semiconductors
NPN switching transistors
6. Ordering information
Table 3.
Ordering information
Type number
Package
PXT2222A
Name
Description
Version
SOT89
plastic surface-mounted package; die pad for good heat transfer; SOT89
3 leads
7. Marking
Table 4.
Marking codes
Type number
Marking code
[1]
PXT2222A
%1P
[1]
% = placeholder for manufacturing site code
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
-
60
V
VCEO
collector-emitter voltage
open base
-
40
V
VEBO
emitter-base voltage
open collector
-
6
V
IC
collector current
-
600
mA
ICM
peak collector current
-
800
mA
IBM
peak base current
-
200
mA
Ptot
total power dissipation
[1]
-
0.5
W
[2]
-
0.8
W
[3]
-
1.1
W
tp ≤ 1 ms; single pulse
Tamb ≤ 25 °C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-65
150
°C
Tstg
storage temperature
-65
150
°C
[1]
[2]
[3]
PXT2222A
Product data sheet
Transistor mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
2
Transistor mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm .
2
Transistor mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm .
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PXT2222A
NXP Semiconductors
NPN switching transistors
006aaa238
1600
Ptot
(mW)
1200
(1)
(2)
800
(3)
400
0
- 75
- 25
25
75
125
175
Tamb (°C)
2
(1) FR4 PCB; 6 cm mounting pad for collector.
2
(2) FR4 PCB; 1 cm mounting pad for collector.
(3) FR4 PCB; standard footprint.
Fig. 1.
Power derating curves
9. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
Rth(j-sp)
thermal resistance
from junction to solder
point
PXT2222A
Product data sheet
Min
Typ
Max
Unit
[1]
-
-
250
K/W
[2]
-
-
156
K/W
[3]
-
-
113
K/W
-
-
30
K/W
[1]
[2]
Transistor mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3]
Transistor mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm .
2
Transistor mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm .
2
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PXT2222A
NXP Semiconductors
NPN switching transistors
006aaa235
103
Zth
(K/W)
duty cycle = 1
0.75
102
0.5
0.33
0.2
0.1
0.05
10
0.02
0
1
10-5
0.01
10-4
10-3
10-2
10-1
1
10
102
tp (s)
103
Mounted on FR4 PCB; standard footprint.
Fig. 2.
Transient thermal impedance as a function of pulse time; typical values
006aaa236
103
Zth
(K/W)
duty cycle = 1
102
0.75
0.33
0.5
0.2
0.1
10
0
1
10-5
0.05
0.02
0.01
10-4
10-3
10-2
10-1
1
10
102
tp (s)
103
2
Mounted on FR4 PCB; mounting pad for collector 1 cm .
Fig. 3.
Transient thermal impedance as a function of pulse time; typical values
PXT2222A
Product data sheet
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PXT2222A
NXP Semiconductors
NPN switching transistors
006aaa237
103
Zth
(K/W)
102
duty cycle = 1
0.75
0.33
0.5
0.2
10
0.1
0.05
0.02
0
1
10-5
0.01
10-4
10-3
10-2
10-1
1
10
102
tp (s)
103
Mounted on FR4 PCB; mounting pad for collector 6 cm2.
Fig. 4.
Transient thermal impedance as a function of pulse time; typical values
PXT2222A
Product data sheet
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PXT2222A
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NPN switching transistors
10. Characteristics
Table 7.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ICBO
collector-base cut-off
current
VCB = 60 V; IE = 0 A; Tamb = 25 °C
-
-
10
nA
VCB = 60 V; IE = 0 A; Tj = 125 °C
-
-
10
µA
IEBO
emitter-base cut-off
current
VEB = 5 V; IC = 0 A; Tamb = 25 °C
-
-
10
nA
hFE
DC current gain
VCE = 10 V; IC = 0.1 mA; Tamb = 25 °C
35
-
-
VCE = 10 V; IC = 1 mA; Tamb = 25 °C
50
-
-
VCE = 10 V; IC = 10 mA; Tamb = 25 °C
75
-
-
VCE = 10 V; IC = 10 mA; Tj = -55 °C
35
-
-
VCE = 1 V; IC = 150 mA; tp ≤ 300 µs;
50
-
-
100
-
300
40
-
-
IC = 150 mA; IB = 15 mA; Tamb = 25 °C
-
-
300
mV
IC = 500 mA; IB = 50 mA; Tamb = 25 °C
-
-
1
V
base-emitter saturation IC = 150 mA; IB = 15 mA; Tamb = 25 °C
voltage
IC = 500 mA; IB = 50 mA; Tamb = 25 °C
0.6
-
1.2
V
-
-
2
V
delay time
IC = 150 mA; IBon = 15 mA;
-
-
15
ns
tr
rise time
IBoff = -15 mA; Tamb = 25 °C
-
-
20
ns
ton
turn-on time
-
-
35
ns
ts
storage time
-
-
200
ns
tf
fall time
-
-
60
ns
toff
turn-off time
-
-
250
ns
CC
collector capacitance
-
-
8
pF
-
-
25
pF
300
-
-
MHz
-
-
4
dB
δ ≤ 0.02; Tamb = 25 °C; pulsed
VCE = 10 V; IC = 150 mA; tp ≤ 300 µs;
δ ≤ 0.02; Tamb = 25 °C; pulsed
VCE = 10 V; IC = 500 mA; tp ≤ 300 µs;
δ ≤ 0.02; Tamb = 25 °C; pulsed
VCEsat
VBEsat
td
collector-emitter
saturation voltage
VCB = 10 V; IE = 0 A; ie = 0 A;
f = 1 MHz; Tamb = 25 °C
CE
emitter capacitance
VEB = 500 mV; IC = 0 A; ic = 0 A;
f = 1 MHz; Tamb = 25 °C
fT
transition frequency
VCE = 10 V; IC = 20 mA; f = 100 MHz;
Tamb = 25 °C
NF
noise figure
VCE = 5 V; IC = 200 µA; RS = 2 kΩ;
f = 1 kHz; B = 200 Hz; Tamb = 25 °C
PXT2222A
Product data sheet
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PXT2222A
NXP Semiconductors
NPN switching transistors
aaa-011462
600
0.8
IC
(A)
hFE
aaa-011463
IB = 13 mA
11.7
9.1
10.4
6.5
0.6
400
7.8
5.2
3.9
(1)
2.6
0.4
(2)
200
1.3
0.2
(3)
0
10-1
1
10
102
IC (mA)
0
103
VCE = 10 V
2
4
6
8
VCE (V)
10
Tamb = 25 °C
(1) Tamb = 150 °C
Fig. 6.
(2) Tamb = 25 °C
Collector current as a function of collectoremitter voltage; typical values
(3) Tamb = −55 °C
Fig. 5.
0
DC current gain as a function of collector
current; typical values
aaa-011464
1.2
aaa-011465
1.2
VBEsat
(V)
VBE
(V)
1.0
0.8
(1)
0.8
(1)
(2)
(2)
0.6
0.4
(3)
0.4
0
10-1
Fig. 7.
1
10
102
IC (mA)
0.2
10-1
103
(3)
1
VCE = 1 V
IC/IB = 10
(1) Tamb = −55 °C
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = 150 °C
(3) Tamb = 150 °C
Base-emitter voltage as a function of collector
current; typical values
PXT2222A
Product data sheet
Fig. 8.
102
IC (mA)
103
Base-emitter saturation voltage as a function of
collector current; typical values
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PXT2222A
NXP Semiconductors
NPN switching transistors
aaa-011466
1
VCEsat
(V)
(1)
(2)
10-1
(3)
10-2
10-1
1
10
102
IC (mA)
103
IC/IB = 10
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig. 9.
Collector-emitter saturation voltage as a function of collector current; typical values
PXT2222A
Product data sheet
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PXT2222A
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NPN switching transistors
11. Test information
IB
input pulse
(idealized waveform)
90 %
IBon (100 %)
10 %
IBoff
output pulse
(idealized waveform)
IC
90 %
IC (100 %)
10 %
t
td
ts
tr
ton
tf
toff
006aaa003
Fig. 10. BISS transistor switching time definition
VBB
RB
VCC
RC
(probe)
oscilloscope
450 Ω
Vo
(probe)
450 Ω
R2
VI
oscilloscope
DUT
R1
mlb826
Fig. 11. Test circuit for switching times
PXT2222A
Product data sheet
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PXT2222A
NXP Semiconductors
NPN switching transistors
12. Package outline
4.6
4.4
1.8
1.4
1.6
1.4
2.6
2.4
4.25
3.75
1
0.53
0.40
1.5
2
1.2
0.8
3
0.48
0.35
0.44
0.23
3
Dimensions in mm
06-08-29
Fig. 12. Package outline SOT89
13. Soldering
4.75
2.25
2
1.9
1.2
0.2
0.85
solder lands
1.7
1.2
4.6
solder resist
0.5
1
(3×)
4.85
1.1
(2×)
1.5
solder paste
occupied area
Dimensions in mm
1.5
0.6
(3×)
0.7
(3×)
3.95
sot089_fr
Fig. 13. Reflow soldering footprint for SOT89
PXT2222A
Product data sheet
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PXT2222A
NXP Semiconductors
NPN switching transistors
6.6
2.4
3.5
solder lands
7.6
0.5
solder resist
occupied area
1.8
(2×)
Dimensions in mm
preferred transport direction during soldering
1.9
1.5
(2×)
1.9
0.7
5.3
sot089_fw
Fig. 14. Wave soldering footprint for SOT89
PXT2222A
Product data sheet
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PXT2222A
NXP Semiconductors
NPN switching transistors
14. Revision history
Table 8.
Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
PXT2222A v.5
20140402
Product data sheet
-
PXT2222A v.4
Modifications:
•
•
•
•
•
•
•
•
•
The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
General description: updated.
Quick refernce data: added.
Thermal characteristics: Figure 2 to 4 updated.
Limiting values: values of IC, ICM and IBM parameters corrected.
Characteristics: Figures 5 to 9 added.
Soldering information: added.
Legal information: updated.
PXT2222A v.4
20041122
Product specification
-
PXT2222A v.3
PXT2222A v.3
19990414
Product specification
-
PXT2222A v.2
PXT2222A v.2
19970505
Product specification
-
PXT2222A v.1
PXT2222A v.1
19940901
Product specification
-
-
PXT2222A
Product data sheet
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PXT2222A
NXP Semiconductors
NPN switching transistors
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punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
15. Legal information
15.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Document
status [1][2]
Product
status [3]
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification
This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Definition
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
15.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
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representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
PXT2222A
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
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No offer to sell or license — Nothing in this document may be interpreted
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PXT2222A
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or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
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Non-automotive qualified products — Unless this data sheet expressly
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the product is not suitable for automotive use. It is neither qualified nor
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NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
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customer (a) shall use the product without NXP Semiconductors’ warranty
of the product for such automotive applications, use and specifications, and
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Translations — A non-English (translated) version of a document is for
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between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, ICODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight,
MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug,
TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP
Semiconductors N.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
PXT2222A
Product data sheet
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PXT2222A
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NPN switching transistors
16. Contents
1
General description ............................................... 1
2
Features and benefits ............................................1
3
Applications ........................................................... 1
4
Quick reference data ............................................. 1
5
Pinning information ............................................... 1
6
Ordering information ............................................. 2
7
Marking ................................................................... 2
8
Limiting values .......................................................2
9
Thermal characteristics .........................................3
10
Characteristics ....................................................... 6
11
Test information ..................................................... 9
12
Package outline ................................................... 10
13
Soldering .............................................................. 10
14
Revision history ................................................... 12
15
15.1
15.2
15.3
15.4
Legal information .................................................13
Data sheet status ............................................... 13
Definitions ...........................................................13
Disclaimers .........................................................13
Trademarks ........................................................ 14
© NXP Semiconductors N.V. 2014. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 2 April 2014
PXT2222A
Product data sheet
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