Product Brief DrBlade 1.0 The Revolutionary Next Packaging Generation Features DrBlade, the new ultra-compact integrated MOSFET halfbridge with driver for DC/DC buck converter applications, is the first member of Infineon’s Blade package family, Compatible to Intel® VR12 Driver and Mosfets Module (DrMOS) functionality High current capability 40 A Capable of operating up to 1.2MHz switching frequency- Fast switching technology for improved performance Small package size and low profile: 5 x 5 x 0.5 mm³ Optimized footprint for DC/DC converter layout and improved cooling to the PCB Low thermal resistance to the top side RoHS compliant and halogen free realized by chip embedding packaging technology. By replacing standard packaging processes like bonding or molding a 30% reduced package footpint can be realized. New silicon technologies achieve lowest RDS(on) values and power losses. In achieving highest power density without compromising in performance, the interconnect and cooling are becoming the limiting factors. The Blade packaging technology realizes a low package resistance and inductance as well as high current handling capability at a significant reduced form factor. Additionally, the thermal resistances to the package bottom and top side are optimized. With multiple routing layers compact integrated products can be realized. DrBlade is realized in a revolutionary new packaging technology and a new, ideal solution for buck converter applications with highest efficiency and power density requirements. Benefits Packaging Technology Comparison 94% peak efficiency at 1.2V 1) Compact and simplified layout for a DC/DC converter Optimized cooling system Environmentally friendly 1) Conventional NEW: Blade packaging technology 5.0 Applications mm 5.0 mm Typical power stage efficiency, VIN=12V, VDRV=VCIN=5V, fSW=300kHz, L=210nH, 0.2mΩ, no air flow, no heat sink www.infineon.com/drblade High performance desktop and server DCDC-converters Single Phase and Multiphase DCDC point of load (PoL) converters CPU/GPU voltage regulation in Desktop Graphics Cards, DDR Memory, Graphic Memory High Power Density Voltage Regulator Modules (VRM) Product Brief DrBlade 1.0 The Revolutionary Next Packaging Generation Efficiency Measurement Efficiency measurement of a 4-phase DC/DC converter (measurement conditions: Vin 12V, Vout 1.2V, Lout 210nH (DCR 0.29 mOhm), fswitch 313kHz, Tambient = 25°C, 300lfm, included losses: power stage, inductor and controller) DC/DC converter stage 95 94 (left DrBlade, right DrMOS) 93 92 Efficiency [%] 91 90 89 88 87 86 85 84 DrBlade DrMOS 83 82 81 80 0 20 40 60 80 100 120 140 160 Output current [A] Thermal Measurement Thermal performance at 40 A. Vin 12V, Vout 1.2V, fswitch 450kHz, 100 lfm, no heatsink, Tambient 25°C, 1 phase operation. Thermal equilibrium, 10 min at 40 A Spot 65.5°C Area Max. 65.9°C Spot 75.7°C Area Max. 76.5°C DrBladeDrMOS DrBlade Product Specification Iout max. fswitch max. Rthjc typ. bottom side Rthjc typ. top side [A] [MHz] low-side [K/W] low-side [K/W] 40 1,2 1,0 2,0 TDA21310 Next generation DrBlade in development Published by Infineon Technologies Austria AG 9500 Villach, Austria © 2013 Infineon Technologies AG. All Rights Reserved. Visit us: www.infineon.com Order Number: B111-H9793-X-X-7600-DB2013-0002 Date: 03 / 2013 Attention please! The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/ or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.