Data Sheet

PMST3906
40 V, 200 mA PNP switching transistor
Rev. 05 — 29 April 2009
Product data sheet
1. Product profile
1.1 General description
PNP switching transistor in a SOT323 (SC-70) very small Surface-Mounted Device (SMD)
plastic package.
NPN complement: PMST3904.
1.2 Features
n Collector current: IC ≤ −200 mA
n Collector-emitter voltage: VCEO ≤ −40 V
n Very small SMD plastic package
1.3 Applications
n General amplification and switching
1.4 Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter voltage
open base
-
-
−40
V
IC
collector current
-
-
−200
mA
2. Pinning information
Table 2.
Pinning
Pin
Description
1
base
2
emitter
3
collector
Simplified outline
Graphic symbol
3
3
1
1
2
2
sym013
PMST3906
NXP Semiconductors
40 V, 200 mA PNP switching transistor
3. Ordering information
Table 3.
Ordering information
Type number
PMST3906
Package
Name
Description
Version
SC-70
plastic surface-mounted package; 3 leads
SOT323
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
PMST3906
*2A
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
-
−40
V
VCEO
collector-emitter voltage
open base
-
−40
V
VEBO
emitter-base voltage
open collector
-
−6
V
IC
collector current
-
−200
mA
ICM
peak collector current
single pulse;
tp ≤ 1 ms
-
−200
mA
IBM
peak base current
single pulse;
tp ≤ 1 ms
-
−100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
-
200
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from junction
to ambient
in free air
[1]
Min
Typ
Max
Unit
-
-
625
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
PMST3906_5
Product data sheet
[1]
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 29 April 2009
2 of 10
PMST3906
NXP Semiconductors
40 V, 200 mA PNP switching transistor
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
ICBO
collector-base cut-off IE = 0 A; VCB = −30 V
current
IEBO
emitter-base cut-off
current
IC = 0 A; VEB = −6 V
hFE
DC current gain
VCE = −1 V
collector-emitter
saturation voltage
Max
Unit
-
-
−50
nA
-
-
−50
nA
60
-
-
IC = −1 mA
80
-
-
IC = −10 mA
100
-
300
IC = −50 mA
60
-
-
30
-
-
IC = −10 mA; IB = −1 mA
-
-
−250
mV
IC = −50 mA; IB = −5 mA
-
-
−400
mV
IC = −10 mA; IB = −1 mA
-
-
−850
mV
IC = −50 mA; IB = −5 mA
-
-
−950
mV
IC = −10 mA;
IBon = −1 mA;
IBoff = 1 mA
-
-
35
ns
-
-
35
ns
-
-
70
ns
VBEsat
base-emitter
saturation voltage
td
delay time
tr
rise time
ton
turn-on time
ts
storage time
-
-
225
ns
tf
fall time
-
-
75
ns
toff
turn-off time
-
-
300
ns
Cc
collector capacitance IE = ie = 0 A; VCB = −5 V;
f = 1 MHz
-
-
4.5
pF
Ce
emitter capacitance
IC = ic = 0 A;
VEB = −500 mV;
f = 1 MHz
-
-
10
pF
fT
transition frequency
IC = −10 mA;
VCE = −20 V;
f = 100 MHz
250
-
-
MHz
NF
noise figure
IC = −100 µA;
VCE = −5 V; RS = 1 kΩ;
f = 10 Hz to 15.7 kHz
-
-
4
dB
PMST3906_5
Product data sheet
Typ
IC = −0.1 mA
IC = −100 mA
VCEsat
Min
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 29 April 2009
3 of 10
PMST3906
NXP Semiconductors
40 V, 200 mA PNP switching transistor
mhc459
600
hFE
006aab475
−250
IC
(mA)
IB (mA) = −1.5
−200
−1.35
(1)
−1.20
400
−150
−0.90
−0.75
−0.60
−100
(2)
−1.05
−0.45
200
−0.30
(3)
0
−10−1
−1
−50
−10
−102
IC (mA)
0
−103
VCE = −1 V
−0.15
0
−2
−4
−6
−8
−10
VCE (V)
Tamb = 25 °C
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig 1.
DC current gain as a function of collector
current; typical values
mhc461
−1200
VBE
(mV)
Fig 2.
Collector current as a function of
collector-emitter voltage; typical values
mhc462
−1200
VBEsat
(mV)
−1000
−1000
(1)
(1)
−800
(2)
−600
−800
(2)
−600
(3)
(3)
−400
−400
−200
−10−1
−1
−10
−102
−103
−200
−10−1
−1
IC (mA)
VCE = −1 V
−103
IC/IB = 10
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = 150 °C
(3) Tamb = 150 °C
Base-emitter voltage as a function of collector
current; typical values
Fig 4.
Base-emitter saturation voltage as a function
of collector current; typical values
PMST3906_5
Product data sheet
−102
IC (mA)
(1) Tamb = −55 °C
Fig 3.
−10
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 29 April 2009
4 of 10
PMST3906
NXP Semiconductors
40 V, 200 mA PNP switching transistor
mhc463
−103
VCEsat
(mV)
(1)
(2)
−102
(3)
−10
−10−1
−1
−102
−10
IC (mA)
−103
IC/IB = 10
(1) Tamb = 150 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig 5.
Collector-emitter saturation voltage as a function of collector current;
typical values
8. Test information
VBB
RB
VCC
RC
Vo
(probe)
oscilloscope
450 Ω
(probe)
450 Ω
oscilloscope
R2
VI
DUT
R1
mgd624
VI = 5 V; t = 500 µs; tp = 10 µs; tr = tf ≤ 3 ns
R1 = 56 Ω; R2 = 2.5 kΩ; RB = 3.9 kΩ; RC = 270 Ω
VBB = 1.9 V; VCC = −3 V
Oscilloscope: input impedance ZI = 50 Ω
Fig 6.
Test circuit for switching times
PMST3906_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 29 April 2009
5 of 10
PMST3906
NXP Semiconductors
40 V, 200 mA PNP switching transistor
9. Package outline
2.2
1.8
1.1
0.8
0.45
0.15
3
2.2 1.35
2.0 1.15
1
2
0.4
0.3
0.25
0.10
1.3
Dimensions in mm
Fig 7.
04-11-04
Package outline SOT323 (SC-70)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
PMST3906
[1]
Package Description
SOT323
4 mm pitch, 8 mm tape and reel
3000
10000
-115
-135
For further information and the availability of packing methods, see Section 14.
PMST3906_5
Product data sheet
Packing quantity
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 29 April 2009
6 of 10
PMST3906
NXP Semiconductors
40 V, 200 mA PNP switching transistor
11. Soldering
2.65
1.85
1.325
solder lands
solder resist
2
2.35
0.6
(3×)
3
solder paste
1.3
1
occupied area
0.5
(3×)
Dimensions in mm
0.55
(3×)
Fig 8.
sot323_fr
Reflow soldering footprint SOT323 (SC-70)
4.6
2.575
1.425
(3×)
solder lands
solder resist
occupied area
1.8
3.65 2.1
09
(2×)
Dimensions in mm
preferred transport
direction during soldering
sot323_fw
Fig 9.
Wave soldering footprint SOT323 (SC-70)
PMST3906_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 29 April 2009
7 of 10
PMST3906
NXP Semiconductors
40 V, 200 mA PNP switching transistor
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMST3906_5
20090429
Product data sheet
-
PMST3906_4
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
•
•
•
•
Legal texts have been adapted to the new company name where appropriate.
Figure 2: updated
Figure 5: figure notes order amended
Section 10 “Packing information” added
Section 11 “Soldering”: added
Section 13 “Legal information”: updated
PMST3906_4
20040121
Product specification
-
PMST3906_3
PMST3906_3
19990422
Product specification
-
PMST3906_CNV_2
PMST3906_CNV_2
19970527
Product specification
-
-
PMST3906_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 29 April 2009
8 of 10
PMST3906
NXP Semiconductors
40 V, 200 mA PNP switching transistor
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PMST3906_5
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 05 — 29 April 2009
9 of 10
PMST3906
NXP Semiconductors
40 V, 200 mA PNP switching transistor
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information. . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 29 April 2009
Document identifier: PMST3906_5
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