Data Sheet

2PA1576
PNP general-purpose transistor
Rev. 06 — 17 November 2009
Product data sheet
1. Product profile
1.1 General description
PNP transistor in a SOT323 (SC-70) plastic package. The NPN complement is 2PC4081.
1.2 Features
„ Low current (max. 150 mA)
„ Low voltage (max. 50 V)
„ Low collector capacitance (typ. 2.5 pF)
1.3 Applications
„ General-purpose switching and amplification
2. Pinning information
Table 1.
Pinning
Pin
Description
1
base
2
emitter
3
collector
Simplified outline
Symbol
3
3
1
1
2
2
sym013
3. Ordering information
Table 2.
Ordering information
Type number
2PA1576Q
2PA1576R
2PA1576S
Package
Name
Description
Version
SC-70
plastic surface mounted package; 3 leads
SOT323
2PA1576
NXP Semiconductors
PNP general-purpose transistor
4. Marking
Table 3.
Marking codes
Type number
Marking code[1]
2PA1576Q
F*Q
2PA1576R
F*R
2PA1576S
F*S
[1]
* = -: made in Hong Kong
* = t: made in Malaysia
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Conditions
Min
Max
Unit
VCBO
Symbol Parameter
collector-base voltage
open emitter
-
−60
V
VCEO
collector-emitter voltage
open base
-
−50
V
VEBO
emitter-base voltage
open collector
-
−6
V
IC
collector current (DC)
-
−150
mA
ICM
peak collector current
-
−200
mA
IBM
peak base current
-
−200
mA
-
200
mW
Ptot
total power dissipation
Tamb ≤ 25 °C
[1]
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
[1]
Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
6. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Rth(j-a)
thermal resistance from
junction to ambient
[1]
Conditions
Min
Typ
Max
Unit
-
-
625
K/W
Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
2PA1576_6
Product data sheet
[1]
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 17 November 2009
2 of 7
2PA1576
NXP Semiconductors
PNP general-purpose transistor
7. Characteristics
Table 6.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ICBO
collector-base
cut-off current
IE = 0 A; VCB = −30 V
-
IE = 0 A; VCB = −30 V;
Tj = 150 °C
-
-
−100
nA
-
−5
μA
IEBO
emitter-base
cut-off current
IC = 0 A; VEB = −4 V
-
-
−100
nA
hFE
DC current gain
IC = −1 mA; VCE = −6 V
2PA1576Q
120
-
270
2PA1576R
180
-
390
270
-
560
-
-
−500
mV
2PA1576S
VCEsat
collector-emitter
saturation
voltage
IC = −50 mA;
IB = −5 mA
Cc
collector
capacitance
IE = ie = 0 A;
VCB = −12 V; f = 1 MHz
-
2.5
3.5
pF
fT
transition
frequency
IC = −2 mA;
VCE = −12 V;
f = 100 MHz
100
-
-
MHz
[1]
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
2PA1576_6
Product data sheet
[1]
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 17 November 2009
3 of 7
2PA1576
NXP Semiconductors
PNP general-purpose transistor
8. Package outline
Plastic surface-mounted package; 3 leads
SOT323
D
E
B
A
X
HE
y
v M A
3
Q
A
A1
c
1
2
e1
bp
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.8
0.1
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.23
0.13
0.2
0.2
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT323
Fig 1.
JEITA
SC-70
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
Package outline SOT323 (SC-70)
2PA1576_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 17 November 2009
4 of 7
2PA1576
NXP Semiconductors
PNP general-purpose transistor
9. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
2PA1576_6
20091117
Product data sheet
-
2PA1576_5
Modifications:
•
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
•
Figure 1 “Package outline SOT323 (SC-70)”: updated
2PA1576_5
20041124
Product data sheet
-
2PA1576_4
2PA1576_4
19990531
Product specification
-
2PA1576_3
2PA1576_3
19970328
Objective specification
-
2PA1576_2
2PA1576_2
19931213
n.a.
-
n.a.
2PA1576_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 17 November 2009
5 of 7
2PA1576
NXP Semiconductors
PNP general-purpose transistor
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
2PA1576_6
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 06 — 17 November 2009
6 of 7
2PA1576
NXP Semiconductors
PNP general-purpose transistor
12. Contents
1
1.1
1.2
1.3
2
3
4
5
6
7
8
9
10
10.1
10.2
10.3
10.4
11
12
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
1
2
2
2
3
4
5
6
6
6
6
6
6
7
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 November 2009
Document identifier: 2PA1576_6