PMSTA55; PMSTA56 500 mA PNP general-purpose transistors Rev. 05 — 1 February 2010 Product data sheet 1. Product profile 1.1 General description PNP transistors in a SOT323 (SC-70) very small Surface-Mounted Device (SMD) plastic package. Table 1. Product overview Type number Package PMSTA55 NPN complement NXP JEITA SOT323 SC-70 PMSTA05 PMSTA56 PMSTA06 1.2 Features High current (max. 500 mA) Collector-emitter voltage: 60 V (PMSTA55) 80 V (PMSTA56) 1.3 Applications Intended for telephony and professional communication equipment. 2. Pinning information Table 2. Pinning Pin Description 1 base 2 emitter 3 collector Simplified outline Graphic symbol 3 3 1 1 2 2 006aab259 PMSTA55; PMSTA56 NXP Semiconductors 500 mA PNP general-purpose transistors 3. Ordering information Table 3. Ordering information Type number PMSTA55 Package Name Description Version SC-70 plastic surface-mounted package; 3 leads SOT323 PMSTA56 4. Marking Table 4. Marking codes Type number Marking code[1] PMSTA55 *2H PMSTA56 *2G [1] * = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VCBO collector-base voltage open emitter VCEO Min Max Unit PMSTA55 - −60 V PMSTA56 - −80 V - −60 V collector-emitter voltage open base PMSTA55 - −80 V - −4 V collector current - −500 mA ICM peak collector current - −500 mA IBM peak base current Ptot total power dissipation Tj PMSTA56 VEBO emitter-base voltage IC open collector - −500 mA - 200 mW junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Tamb ≤ 25 °C Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. PMSTA55_56_5 Product data sheet [1] © NXP B.V. 2010. All rights reserved. Rev. 05 — 1 February 2010 2 of 8 PMSTA55; PMSTA56 NXP Semiconductors 500 mA PNP general-purpose transistors 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Rth(j-a) [1] Conditions thermal resistance from junction to ambient in free air [1] Min Typ Max Unit - - 625 K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 7. Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current PMSTA55 VCB = −60 V; IE = 0 A - - −100 nA PMSTA56 VCB = −80 V; IE = 0 A - - −100 nA nA IEBO emitter-base cut-off current VEB = −4 V; IC = 0 A - - −500 hFE DC current gain VCE = −1 V; IC = −10 mA 100 - - 100 - - VCE = −1 V; IC = −100 mA VCEsat collector-emitter saturation voltage IC = −100 mA; IB = −10 mA - - −250 mV VBE base-emitter voltage IC = −100 mA; VCE = −1 V - - −1.2 mV fT transition frequency 50 - - MHz [1] VCE = −1 V; IC = −100 mA; f = 100 MHz Pulse test: tp ≤ 300 μs; δ ≤ 0.02. PMSTA55_56_5 Product data sheet [1] © NXP B.V. 2010. All rights reserved. Rev. 05 — 1 February 2010 3 of 8 PMSTA55; PMSTA56 NXP Semiconductors 500 mA PNP general-purpose transistors 8. Package outline 2.2 1.8 1.1 0.8 0.45 0.15 3 2.2 1.35 2.0 1.15 1 2 0.4 0.3 0.25 0.10 1.3 Dimensions in mm Fig 1. 04-11-04 Package outline SOT323 (SC-70) 9. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PMSTA55 Package Description SOT323 4 mm pitch, 8 mm tape and reel Packing quantity 3000 10000 -115 -135 PMSTA56 [1] For further information and the availability of packing methods, see Section 12. PMSTA55_56_5 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 05 — 1 February 2010 4 of 8 PMSTA55; PMSTA56 NXP Semiconductors 500 mA PNP general-purpose transistors 10. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes PMSTA55_56_5 20100201 Product data sheet - PMSTA55_56_N_4 Modifications: • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • • • • • • • Legal texts have been adapted to the new company name where appropriate. Section 1 “Product profile”: amended Table 2 “Pinning”: amended Section 3 “Ordering information”: added Section 4 “Marking”: amended Figure 1: superseded by minimized package outline drawing Section 9 “Packing information”: added Section 11 “Legal information”: updated PMSTA55_56_N_4 20080117 Product data sheet - PMSTA55_56_3 PMSTA55_56_3 19990422 Product specification - PMSTA55_56_2 PMSTA55_56_2 19980721 Product specification - PMSTA55_56_1 PMSTA55_56_1 19970602 Product specification - - PMSTA55_56_5 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 05 — 1 February 2010 5 of 8 PMSTA55; PMSTA56 NXP Semiconductors 500 mA PNP general-purpose transistors 11. Legal information 11.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 11.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 11.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 11.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. PMSTA55_56_5 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 05 — 1 February 2010 6 of 8 PMSTA55; PMSTA56 NXP Semiconductors 500 mA PNP general-purpose transistors 12. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PMSTA55_56_5 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 05 — 1 February 2010 7 of 8 PMSTA55; PMSTA56 NXP Semiconductors 500 mA PNP general-purpose transistors 13. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 8 9 10 11 11.1 11.2 11.3 11.4 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 2 2 2 3 3 4 4 5 6 6 6 6 6 7 8 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 1 February 2010 Document identifier: PMSTA55_56_5