Gyro Sensors/EWTS9P MEMS Gyro Sensors for Consumers 2 shafts in a package, SMD type Type: EWTS9P□□□□ This sensor is an SMD-type two-axis integrated gyro sensorsr for consumer products. The ultra-miniature body is achieved by integrating two MEMS silicon tuning forks on which a piezoelectric thin film is directly formed, a bare IC chip, and other components into a single ceramic package. In addition to analog output as a replacement for the existing model, digital output is also available with this series. Therefore, this series is ideal for image stabilizers of DSCs and DVCs. Features ●2 shafts in a package, SMD type Low-height 4.6 mm×3.8 mm×0.9 mm (T) ● Capable of both analog and digital output ● RoHS compliant ● Compact, Recommended Applications ● For image stabilizers (DSCs, DVCs, and Cellular phones) Ratings Operating Voltage Range 2.7 to 3.3 V Rated Voltage 3V Absolute max. Rating 4.4 V Storage Temperature Range –40 °C to +85 °C Operating Temperature Range –10 °C to +75 °C 35 to 85 %RH Operating Humidity Range Electrical Characteristics Type EWTS9P Series (Analog Output) EWTS9P Series (Digital Output) ±300 °/s ±300 °/s 8 mA max. 9 mA max. Sleep Mode Current Consumption 1 mA max. 1 mA max. Zero Point Voltage : Outa/b 0.95±0.1 V 32768±4000 LSB Reference Voltage : Vref 0.95±0.05 V – 0.05 to 1.85 V 11500 to 54000 LSB Dynamic Range Current Consumption (1) Output Voltage Range Sensitivity Sensitivity Drift –1 –1 2 mV/ (° ·s )±5 % 50 LSB/ (° ·s )±5 % ±4 % ±4 % (1) Current consumption in sleep mode : Current consumption in standby mode when the SL terminal is set to H. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Jul. 2015 Gyro Sensors/EWTS9P Dimensions in mm (not to scale) ● EWTS9P Series Y axis CCW CW Terminal No. Recognition Mark f 0.25±0.1 (Up&Down Recognition Mark) 1.0 max. 16-f0.58±0.1 11 12 1 9 16 13 2 8 15 14 3 7 6 5 4 A CCW 3.8±0.3 Product Code for Panasonic Date (01 to 31) Month (1 to 9, X, Y, Z) End digit of Year Terminal No. Character Direction A 0.87±0.1 Panasonic Part No. (The 5 th to 7 th digit) 3.42±0.1 X axis 10 1.14 ±0.1 4.6±0.3 CW 1.14±0.1 Z axis 2.61±0.1 Output Detection axis OUT A around Y axis OUT B around X axis Digital output mode spec Function Analog output mode spec 1 Vcc Power supply for analog block 3 V±0.3 V 3 V±0.3 V 2 GND1 Ground Connect to ground (0V) Connect to analog ground (0V) 3 V1 Internal reference voltage 4 GND2 Ground 5 Vref/COSR Reference voltage/Capacitor for oscillator Connect to GND through capacitor (0.1 µF) Connect to analog GND through capacitor (0.1 µF) Connect to ground (0V) Connect to analog ground (0V) Connet to external amp cicuit Connect to analog ground (0V) 6 GND3 Ground Connect to ground (0V) Connect to analog ground (0V) 7 Vdd Power supply for digital interface 3 V±0.3 V 3V –1.2 V +0.6 V 8 CSB Chip Select (for Digital output mode) NC or Vdd Chip Select 9 SCLK Serial Clock (for Digital output mode) NC or Vdd Serial Clock 10 MISO/OUT A Serial Data Output (Master In Slave Out for Digital output mode) / Output A (for Analog output mode) Out A output Serial Data Output (Master In Slave Out) 11 MOSI/OUT B Serial Data Input (Master Out Slave In for Digital output mode) / Output B (for Analog output mode) Out B output Serial Data Input (Master Out Slave In) 12 SL Control terminal of sleep mode (for Analog output mode) Sleep mode : min.2.5 V ( to Vcc+0.3) Normal mode : Open or max. 0.5 V NC 13 OUT MODE Control terminal that select Analog output mode or Digital output mode Analog output mode : min. 2.6 V Digital output mode : max. 0.4 V 14 Vreg A Regulator for analog block 15 NC The terminal for internal adjustment Those with pull down resistance 16 Vreg D Regulator for digital block 5 Connect to GND through capacitor (0.1 µF) Connect to analog GND through capacitor (0.1 µF) Connect to ground (0V) Connect to GND through capacitor (0.1 µF) Connect to digital GND through capacitor (0.1 µF) 3 4 Connect to analog ground (0V) Layer (3) Base 8 1 7 6 Layer (2) 2 Sensor Cross Section Terminal Cross Section Layer (1) No. Name Number Material Name Material 1 Base 1 90 alumina Layer(1) Au plating (0.2 to 0.6 um) 2 IC 1 Silicon Layer(2) Ni plating (1 to 10 um) 3 Tuning fork 2 PZT on silicon Layer(3) W pattern 4 Au wire 12 Au 5 Cap 1 90 alumina 6 Underfill - Epoxy resin 7 T.F. glue - Epoxy resin 8 Cap glue - Epoxy resin Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Jul. 2015 Gyro Sensors/EWTS9P Safety Precautions (MEMS Gyro Sensors for Consumers/EWTS9P) 1. Soldering (1) Thickness of Solder Paste(Recommendation) : 0.10 mm to 0.15 mm (2) Flux : Use non-corrosive rosin, and alcohol based solvent with little chemical reaction (3) Pre-heat : Control the temperature on PWB to be under 180 °C and no longer than 120 s (4) Reflow Soldering condition : The Maximum temperature on PWB under 260 °C, Soldering time of the Maximum temperature within 10 s (5) Atmospheric Temperature : The atmospheric temperature should be under 300 °C (6) Number of times it can be Reflow Soldered : 2 time as the limit (7) Hand soldering : Do not apply Hand soldering or correction of soldering 2. Washing Since this sensor package is not sealed, do not apply any flux washing. And at the set assembly process, please do not let oil etc. adhered because it may interfere with the sensor behavior. 3. Handling (1) Handle with care. Do not drop or apply any strong impact to the sensor as it may degrade some performances. (2) Static Electricity Since CMOS IC is used, there is a possibility of static electricity destruction. Handle with care against static electricity. (3) Storage under the following condition should be avoided as it degrades the performance and solderability. a) Relative humidity more than 85 %, or outside of storage temp. range. b) Exposure to the direct rays of the sun. c) Atmospheres of corrosive gas (CI2, H2S, NH3, NOX, SO2 etc.) d) Long term storage of over 3 months after delivery Do not store the package under severe load and stress.. 4. Recommendation item on the circuit composition (1) Place a chip capacitor (0.01 µF to 0.1 µF) near Vdd terminal across GND. (2) Load of terminal OUTa and OUTb. Load Resistor (OUTa & OUTb to GND) : 100 kΩ min. or none. Load Capacitor (OUTa & OUTb to GND with series resistor 1kΩ) : 0.01 µF max. (3) When the sensor signal goes to an A/D converter, use the same 3 V power supply both for the sensor and for A/D converter. (4) Misconnection As misconnection causes a failure, do not reuse the sensor if once misconnected. 5. Caution of sensor layout (1) Do not locate the sensor close to heat radiating objects such as power transistors. Since the sensor has a little temp. drift by surrounding condition, carefully consider the location of the sensor. (2) Do not locate two or more sensors on the same PWB because periodical drift of zero point output may occur due to mutual interference by the vibration of each tuning fork of the sensor. 6. Caution of vibration from outside To prevent the PWB’s (mounted sensor) from resonating with external vibration, please follow the instructions below when designing PWB. (1) Rigid glass epoxy circuit board is recommended. Locate the sensor near the screws which fix the circuit board. (2) Place parts to avoid possible contacts with the sensor by external vibrations. (3) Since the tuning fork may be damaged by the impact of cutting a mother board or a router, please check carefully. (4) This sensor has oscillators (tuning forks), which have some resonant frequencies. Since the sensor may cause a malfunction by incoming frequencies similar to the sensor (41 kHz to 46 kHz), carefully check frequencies and locations of DC/DC converters. (5) Avoid screw loose of the circuit board. (6) Conduct vibration tests and carefully check the condition of sensor when attached to the system. If the location of the sensor is far from the screws of the circuit board, or the screws become loose, vibrations and temperature change may degrade the performance. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Jul. 2015 Gyro Sensors/EWTS9P 7. Recommended pattern design See the following recommended pattern design. (mm) 2.61±0.1 f 0.68 1.14±0.1 Parts mount side 3.42±0.1 0.87±0.1 (Solder mask) f 0.58 (Bare copper) Detail of sensor mounting land 16-Sensor mounting land 8. Limited Warranty (1) Customer acknowledges that the Gyro Sensors (“Product”) delivered to Customer by Panasonic Corporation. (“Panasonic”) is designed and manufactured by Panasonic, or its affiliates, only for the purpose of incorporation into Customer’s Digital Still Camera and Digital Video Camera system (hereinafter called “Purpose”). Accordingly, Customer understands that Panasonic or its affiliates, shall only guarantee the performance of the Product under this Product Specification for Information (this “Specification”) to the extent such Product is used by Customer for the Purpose defined in this paragraph. (2) Customer agrees that it shall, at its sole cost and responsibility, test and evaluate the performance of Customer’s system which incorporates the Product. (3) Customer agrees that Panasonic shall not be responsible for any loss or damage due to defective Product, including, but not limited to, economic loss, bodily injury or property damage, as far as Customer utilizes the Product for any purpose other than the Purpose defined in the above paragraph (1). Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 02 Jul. 2015