Aries Electronics Fine Pitch Bump Adapters PDF

Fine Pitch Bump Adapters
FEATURES
• Adapt to fine pitch footprints including TSSOPs and QFPs with pitches down to
0.4mm
• Features raised connection pads up to 0.010"
• Available in tape and reel for high speed SMT assembly
• Can be manufactured for RoHS compliance
GENERAL SPECIFICATIONS
• BOARD MATERIAL: 0.032 [0.81] thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu
traces, both sides
• PADS: finished with ENIG (Electroless Ni Immersion Au), NSMD
• TRACE WIDTHS/SPACE: 0.003 [0.076]
• OPERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Pb-free
MOUNTING CONSIDERATIONS
• Solders to existing PCB footprints for QFPs, TSSOPs, and many other fine pitch
devices down to 0.4mm
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity. NOTE: Aries reserves the
right to change product general specifications without notice.
ORDERING INFORMATION
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
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To obtain a quote for a specific adapter,
please email a request to
[email protected]
with the following information:
Your name, company name, and telephone
number
A drawing or data sheet of the device to
be placed on adapter (top image)
A drawing or data sheet of the target
footprint for the adapter (bottom image)
A list of any other design parameters or
restrictions that must be considered
The quantity of adapters to be quoted
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • [email protected]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18107
Rev. AC
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