Fine Pitch Bump Adapters FEATURES • Adapt to fine pitch footprints including TSSOPs and QFPs with pitches down to 0.4mm • Features raised connection pads up to 0.010" • Available in tape and reel for high speed SMT assembly • Can be manufactured for RoHS compliance GENERAL SPECIFICATIONS • BOARD MATERIAL: 0.032 [0.81] thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu traces, both sides • PADS: finished with ENIG (Electroless Ni Immersion Au), NSMD • TRACE WIDTHS/SPACE: 0.003 [0.076] • OPERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Pb-free MOUNTING CONSIDERATIONS • Solders to existing PCB footprints for QFPs, TSSOPs, and many other fine pitch devices down to 0.4mm CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ORDERING INFORMATION ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED • • • • • To obtain a quote for a specific adapter, please email a request to [email protected] with the following information: Your name, company name, and telephone number A drawing or data sheet of the device to be placed on adapter (top image) A drawing or data sheet of the target footprint for the adapter (bottom image) A list of any other design parameters or restrictions that must be considered The quantity of adapters to be quoted Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18107 Rev. AC