Aries Electronics QFP-to-PGA Adapter for EIAJ 208-Position, 0.0197" [0.50mm] Pitch PDF

P/N 96-208M50 QFP-to-PGA EIAJ
208-Position, 0.0197 [0.50] Pitch Adapter
FEATURES
•Convert surface-mount QFP packages to a 17x17 PGA footprint.
•Reduce costs by using less-expensive QFP packages to replace PGA footprints in
existing designs.
•Pins are mechanically fastened and soldered to board using Aries’ patented process,
creating a reliable electrical connection and rugged contact.
•Consult factory for Panelized Form or for mounting of consigned chips.
GENERAL SPECIFICATIONS
•ADAPTER BODY: FR-4 with 1-oz. Cu traces
•PADS: bare Cu protected with Entek® by Enthone or immersion white Sn to
eliminate coplanarity concerns and solder bridges associated with hot air solder
leveling
•PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
•MALE PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ
[2.54µ] Ni per SAE AMS-QQ-N-29
•OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
•SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
•Standard: will plug into PGA sockets
CUSTOMIZATION: In addition to the standard products shown
on this page, Aries specializes in custom design and production.
Special materials, platings, sizes, and configurations can be
furnished, depending on the quantity. NOTE: Aries reserves the
right to change product general specifications without notice.
ORDERING INFORMATION
P/N 96-208M50
P/N 96-208M50-P for Panelized Form
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
ROW-TO-ROW ±0.003 [±0.08]
PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • [email protected]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
18031
Rev. 1.2
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