Aries Electronics Machined High-Frequency Center Probe Test Socket for BGA, CSP & MLF Packages PDF

Machined High-Frequency Center Probe
Test Socket for BGA, CSP, & MLF Packages
FEATURES
•Aries unique universal socketing system allows the socket to be easily configured for any package,
on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling
charge or extra lead-time.
•For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP,
SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA
packaged devices.
•Quick and easy Probe Replacement System: the complete set of probes can be removed and a
new set (interposer) can be inserted quickly and easily. The old set can be returned to the factory for
repair and sent back within one day.
•Solderless Spring-Probes pressure mount to the test board and device solder ball or pad.
•Only 0.077 [1.96] signal path.
ORDERING INFORMATION
•Very low inductance and capacitance.
Consult Factory
•Small footprint allows max. use of test board area.
•Chip guides allow accurate device location.
CLEANING, HANDLING, MOUNTING
•Spring loaded contacts provide high cycle life.
•4-point edge male contacts provide accurate mating.
& PROBE REPLACEMENT INFO
•Socket locating posts provide accurate socket location to board.
•Bottom contact allows for via in center of PCB pad.
GENERAL SPECIFICATIONS
•SOCKET BODY MATERIAL: Torlon PAI
•HARDWARE: Stainless Steel
•SPRING LOADED CONTACTS: Au-plated BeCu
•CONTACT RESISTANCE: <40 mΩ
•ACCEPTS SOLDER BALL SIZES: 0.15mm-0.93mm
•ESTIMATED CONTACT LIFE: 500,000 cycles
•CONTACT FORCE: 6g per contact on 0.20-0.29mm pitch
: 15g per contact on 0.30-0.35mm pitch
: 16g per contact on 0.40-0.45mm pitch
: 25g per contact on 0.50-0.75mm pitch
: 25g per contact on 0.80mm pitch or larger
•PROBE SELF INDUCTANCE: 0.51nH (large probe); 0.59nH (small probe)
•INSERTION LOSS: 1dB to 10.1GHz (larger probe at 0.80mm pitch); 1dB to 18.7Ghz (smaller
probe at 0.50mm pitch)
MOUNTING CONSIDERATIONS
•SUGGESTED LOCATING PIN HOLE SIZE: 0.063 [1.6mm] 2 places
•SUGGESTED MOUNTING HOLE SIZE: 0.120 [3.05mm] 4 places for #4-40 screws
•TEST PCB MINIMUM DIAMETER “G”: 0.025 [0.64] (large probe 0.80mm pitch and larger)
: 0.015 [0.38] (small probe 0.50-0.75mm pitch)
: 0.012 [0.31] (small probe 0.40-0.45mm pitch)
: 0.009 [0.23] (small probe 0.30-0.35mm pitch)
: 0.004 [0.10] (small probe 0.20-0.20mm pitch)
•TEST PCB DIAMETER SPRING PROBE PAD PLATING: 30µ [0.75µ] min. Au per MIL-G-45204
over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top
surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of
your order for your specific application.
A detailed device drawing must be
sent to Aries to quote and design
a socket.
__________________________
See Data Sheet for...
CSP Sockets
23016 Hybrid Socket
23021 µBGA up to 6.5mm
23017 µBGA up to 13mm
23018 µBGA up to 27mm
23018-APP w/Adj Pressure Pad
23019 µBGA up to 40mm
23020 µBGA up to 55mm
23023 Optical Failure Analysis
RF Sockets
24013 RF up to 6.5mm
24008 RF up to 13mm
24009 RF up to 27mm
24009-APP w/Adj Pressure Pad
24011 RF up to 40mm
24012 RF up to 55mm
23022 Kelvin Test Socket
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • [email protected]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24010
1 of 2
Rev. 1.5
Machined High-Frequency Center Probe
Test Socket for BGA, CSP, & MLF Packages
“-24DL” DOUBLE-LATCHED REMOVABLE
LID VERSION SHOWN
“-24HL” HINGED LID VERSION SHOWN
FULL-ARRAY SHOWN AS AN EXAMPLE; YOUR SPECIFIC DEVICE
PATTERN/FOOTPRINT WILL BE SUPPLIED WHEN ORDERED.
“-24HL” HINGED LID VERSION SECTION
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13]
UNLESS OTHERWISE SPECIFIED
CUSTOMIZATION: In addition to the
standard products shown on this
page, Aries specializes in custom
design and production. Special materials, platings, sizes, and configurations can be furnished, depending on
the quantity. NOTE: Aries reserves
the right to change product general
specifications without notice.
SPRING PROBES
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • [email protected]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24010
2 of 2
Rev. 1.5
Similar pages