Aries Electronics High-Frequency Center Probe™ Test Socket for Devices up to 55mm Square PDF

High-Frequency Center Probe Test Socket
for Devices up to 55mm Square
FEATURES
• Aries unique universal socketing system allows the socket to be easily configured for any package, on any
pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra
lead-time.
• For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA,
LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA packaged devices.
• Quick and easy Probe Replacement System: the complete set of probes can be removed and a new set
(interposer) can be inserted quickly and easily. The old set can be returned to the factory for repair and sent
back within one day.
• 4-point crown insures scrub on solder oxides, while pointed probe works with LGA’s, MLF’s, etc.
• Single-point Probes available for small land area contact pads.
• Signal path during test only 0.077 [1.96].
• Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression Spring-Probes which, are
accurately located by two molded plastic alignment pins and mounted with four stainless steel screws.
• The Au over Ni-plated compression Spring-Probes leave very small witness marks on the bottom surface of the device solder balls.
• Standard molded socket format can accommodate any device package of 55mm
square or smaller.
ORDERING INFORMATION
• The spring loaded, cam actuated Pressure Pad applies proper force against the device
Consult Factory
after the lid is closed, latched and the cam is rotated to it’s detected location. Reversing
the cam removes the force applied to the device prior to unlatching the spring loaded
CLEANING, HANDLING, MOUNTING
lid to it’s upright position.
& PROBE REPLACEMENT INFO
GENERAL SPECIFICATIONS
• MUTUAL CAPACITANCE: 0.012pF
• MOLDED SOCKET COMPONENTS: UL 94V-0 PEEK and/or Ultem
• 1dB BANDWIDTH: to 18.5GHz (0.50mm pitch) (small probe) <3dB to 39.7GHz
A detailed device drawing must be
• PIN SELF-INDUCTANCE: 0.59nH
sent to Aries to quote and design
• CONTACT RESISTANCE: <40 mΩ
a socket.
__________________________
• ESTIMATED CONTACT LIFE: 500,000 cycles
See Data Sheet for...
• COMPRESSION SPRING PROBES: heat-treated BeCu with 30µ [0.75µ] min. Au per MilG-45204 over 30µ [0.75µ] min. Ni per SAE AMS-QQ-N-290
CSP Sockets
• CONTACT FORCE : 6g per contact on 0.20-0.29mm pitch
23016 Hybrid Socket
: 15g per contact on 0.30-0.35mm pitch
23021 µBGA up to 6.5mm
: 16g per contact on 0.40-0.45mm pitch
23017 µBGA up to 13mm
: 25g per contact on 0.50-0.75mm pitch
23018 µBGA up to 27mm
: 25g per contact on 0.80mm pitch or larger
23018-APP w/Adj Pressure Pad
• OPERATING TEMPERATURE: -55°C [-67°F] min. to 150°C [302°F] max.
• ALL HARDWARE: Stainless Steel
23019 µBGA up to 40mm
MOUNTING CONSIDERATIONS
23020 µBGA up to 55mm
• See “PCB FOOTPRINT TOP VIEW” for requirements
23023 Optical Failure Analysis
• NOTE: Sockets must be handled with care when mounting or removing sockets to/from PCB
RF Sockets
• TEST PCB MINIMUM DIAMETER “G” : 0.025 [0.64] (large probe 0.80mm pitch and larger)
: 0.015 [0.38] (small probe 0.50-0.75mm pitch)
24013 RF up to 6.5mm
: 0.012 [0.31] (small probe 0.40-0.45mm pitch)
24008 RF up to 13mm
: 0.009 [0.23] (small probe 0.30-0.35mm pitch)
24009 RF up to 27mm
: 0.004 [0.10] (small probe 0.20-0.20mm pitch)
24009-APP w/Adj Pressure Pad
• TEST PCB DIAMETER SPRING PROBE PAD PLATING: 30µ [0.75µ] min. Au per MIL-G-45204
over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top surface 24011 RF up to 40mm
of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of your order
24010 RF Machined Socket
for your specific application.
23022 Kelvin Test Socket
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • [email protected]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24012
1 of 2
Rev. 1.6
High-Frequency Center Probe Test Socket
for Devices up to 55mm Square
FULL-ARRAY SHOWN AS AN EXAMPLE; YOUR SPECIFIC DEVICE
PATTERN/FOOTPRINT WILL BE SUPPLIED WHEN ORDERED.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13]
UNLESS OTHERWISE SPECIFIED
CUSTOMIZATION: In addition to the
standard products shown on this
page, Aries specializes in custom
design and production. Special materials, platings, sizes, and configurations can be furnished, depending on
the quantity. NOTE: Aries reserves
the right to change product general
specifications without notice.
SPRING PROBES
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • [email protected]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24012
2 of 2
Rev. 1.6
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