CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy

CSP Test Socket for Optical Laser Failure Analysis
w/Emission Microscopy*
Available with or without filters for UV, infrared and full spectrum applications, this optical test
socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using
an infrared head sensor. The optical test socket line can accommodate many different optical window
and lens materials, including glass, sapphire, and plastic depending on operational requirements. The standard optical grade window on the 24XXX socket uses a high-quality quartz V077
glass with a 98% transmission rate from <260nm in the UV to >2000nm in the infrared.
FEATURES
•Aries unique universal socketing system allows the socket to be easily configured for
any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time.
•For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP,
TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be
compatible with PGA packaged devices.
•Quick and easy Probe Replacement System: the complete set of probes can be
removed and a new set (interposer) can be inserted quickly and easily. The old set
can be returned to the factory for repair and sent back within one day.
•Socket lid nests device into socket for a reliable connection.
•ZIF style socket using Aries solderless, Au-plated pressure mount Spring-Probe.
•Special lid designs and/or materials can be quoted.
•Socket easily located, mounted & removed from PCB.
•Signal path during test only 0.077 [1.96].
•Available with Spring-Probes or Kapton Elastomer Interposer.
•4-point crown insures “scrub” on solder oxides. Consult factory for other available probe styles.
•The Au over Ni-plated compression Spring-Probes leave very small witness marks on the bottom surface
of the device solder balls.
GENERAL SPECIFICATIONS
•BODY MATERIAL: Ultem® or Torlon®
EMMI images showing
•1dB BANDWIDTH: 18.5 GHz, <3dB to 39.7 GHz (0.50mm pitch) (large probe)
light emission from failed
•ESTIMATED CONTACT LIFE: 500,000 cycles
devices at several loca •COMPRESSION SPRING PROBES: heat-treated BeCu with 30µ [0.75µ] min. Au per MIL-G-45204
tions (front side top)
over 30µ [0.75µ] min. Ni per SAE AMS-QQ-N-290
•CONTACT FORCE: 6g per contact on 0.20-0.29mm pitch
: 15g per contact on 0.30-0.35mm pitch
ORDERING INFORMATION
: 16g per contact on 0.40-0.45mm pitch
Consult Factory
: 25g per contact on 0.50-0.75mm pitch
: 25g per contact on 0.80mm pitch or larger
CLEANING, HANDLING, MOUNTING
•SCREWS AND ALIGNMENT PINS: Stainless Steel
& PROBE REPLACEMENT INFO
•INSERTS: Brass per QQ-B-626
•OPERATING TEMPERATURE RANGE: -55ºC to 150ºC [-67º to 302º]
MOUNTING CONSIDERATIONS
•NOTE: Sockets must be handled with care when mounting or removing sockets to/from PCB
•TEST PCB MINIMUM DIAMETER “P”: 0.025 [0.64] (large probe 0.80mm pitch and larger)
: 0.015 [0.38] (small probe 0.50-0.75mm pitch)
: 0.012 [0.31] (small probe 0.40-0.45mm pitch)
: 0.009 [0.23] (small probe 0.30-0.35mm pitch)
: 0.004 [0.10] (small probe 0.20-0.20mm pitch)
•TEST PCB DIAMETER SPRING PROBE PAD & KIP PLATING: 30µ [0.75µ] min. Au per MIL-G-45204 over 30µ [0.75µ] min. Ni
per SEA AMS-QQ-N-290. Pad must be the same height as top surface of PCB. Please refer to the Custom Socket Drawing
supplied by Aries after receipt of your order for your specific application.
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • [email protected]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24014
1 of 3
Rev. 1.2
CSP Test Socket for Optical Laser Failure Analysis
w/Emission Microscopy*
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CONSULT FACTORY for DIM. “A” - “K”
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general
specifications without notice.
FULL-ARRAY SHOWN AS AN EXAMPLE; YOUR SPECIFIC DEVICE
PATTERN/FOOTPRINT WILL BE SUPPLIED WHEN ORDERED.
* Emission Microscopy (EMMI) is a powerful early-stage noninvasive failure analysis technique localizing failures and requiring little
sample preparation. Flip-chip devices, difficult to study by other means, are easily studied through the die without decapsulation and often without thinning, making it an efficient optical analysis technique that will detect and localize certain integrated
circuit failures. It can be performed from either the front or back sides of devices.
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • [email protected]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24014
2 of 3
Rev. 1.2
CSP Test Socket for Optical Laser Failure Analysis
w/Emission Microscopy*
A detailed device drawing must be
sent to Aries to quote and design
a socket.
__________________________
See Data Sheet for...
CSP Sockets
23016 Hybrid Socket
23021 µBGA up to 6.5mm
23017 µBGA up to 13mm
23018 µBGA up to 27mm
23018-APP w/Adj Pressure Pad
23019 µBGA up to 40mm
23020 µBGA up to 55mm
SPRING PROBES
RF Sockets
24013 RF up to 6.5mm
24008 RF up to 13mm
24009 RF up to 27mm
24009-APP w/Adj Pressure Pad
24011 RF up to 40mm
24012 RF up to 55mm
24010 RF Machined Socket
23022 Kelvin Test Socket
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • [email protected]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
24014
3 of 3
Rev. 1.2
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