AUA0000CE2

NTC Thermistors for automotive devices (chip type)
Multilayer NTC Thermistors
Series:
ERTJ
Features
● Surface Mount Device (0402, 0603)
● Highly reliable multilayer / monolithic structure
● Wide temperature operating range (–40 to 150
● Environmentally-friendly lead-free
● RoHS compliant
°C)
Recommended Applications
● For
● For
● For
● For
● For
● For
car audio system
ECUs
electric pumps and compressors
LED lights
batteries
temperature detection of various circuits
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
R
T
J
0
E
G
1
0
3
F
M
Common Code
Product Code
Type Code
ERT NTC
J Chip Type (SMD)
Thermistors
Multilayer Type
Size Code
0 “0402”
1 “0603”
Packaging
Style Code
E
V
“0402”
Pressed Carrier
Taping
Punched Carrier
Taping
(Pitch : 2 mm)
“0603”
Punched Carrier
Taping
(Pitch : 4 mm)
B Value Class Code
2701 to 2800
A
3301 to 3400
G
3801 to 3900
M
4001 to 4100
P
4201 to 4300
R
4301 to 4400
S
4401 to 4500
T
4601 to 4700
V
Nominal Resistance
R25 (Ω)
The first two digits
are significant figures
of resistance and the
third one denotes
the number of zeros
following them.
(Example)
Resistance Tolerance
Code
G
±1% Narrow
Tolerance
±2% Type
H
J
±3% Standard
±5% Type
F
M
Automotive
component
Construction
3
4
5
1
2
No.
Name
A
Semiconductive Ceramics
B
Internal electrode
C
D
E
Terminal
electrode
Substrate electrode
Intermediate electrode
External electrode
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jun. 2015
NTC Thermistors for automotive devices (chip type)
Ratings
Size code (EIA)
Operating Temperature Range
Rated Maximum Power Dissipation✽1
Dissipation Factor✽2
0(0402)
1(0603)
–40 to 150 °C
66 mW
Approximately 2 mW/°C
100 mW
Approximately 3 mW/°C
✽1 Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature.
· The maximum value of power, and rated power is same under the condition of ambient temperature 25 °C or less. If the temperature exceeds
25 °C, rated power depends on the decreased power dissipation curve.
· Please see “Operating Power” for details.
✽2 Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 °C through self heat generation under stable temperatures.
· Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT).
Part Number List
● 0402(EIA)
Part Number
ERTJ0EG103□M
ERTJ0EP473□M
ERTJ0ER104□M
ERTJ0EV104□M
● 0603(EIA)
Nominal Resistance
at 25 °C
10 kΩ
47 kΩ
100 kΩ
100 kΩ
B Value
B Value
at 25/50(K) at 25/85(K)
3380 K±1 % 3435 K±1 %
4050 K±1 %
(4100 K)
4250 K±1 %
(4300 K)
4700 K±1 %
(4750 K)
Nominal Resistance
at 25 °C
ERTJ1VG103□M
10 kΩ
ERTJ1VP473□M
47 kΩ
ERTJ1VV104□M
100 kΩ
Part Number
B Value
B Value
at 25/50(K) at 25/85(K)
3380 K±1 % 3435 K±1 %
4100 K±1 %
(4150 K)
4700 K±1 %
(4750 K)
□ : Resistance Tolerance Code (F : ±1%, G : ±2%, H : ±3%, J : ±5%)
□ : Resistance Tolerance Code (F : ±1%, G : ±2%, H : ±3%, J : ±5%)
● Temperature
B25/50
B25/85
T(°C)
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
105
110
115
120
125
B25/50=
and Resistance value (the resistance value at 25 °C is set to 1)/ Reference values
ERTJ□□G~
(3380 K)
3435 K
ERTJ□□P~
4050 K
(4100 K)
ERTJ□□P~
4100 K
(4150 K)
ERTJ□□R~
4250 K
(4300 K)
ERTJ□□V~
4700 K
(4750 K)
20.52
15.48
11.79
9.069
7.037
5.507
4.344
3.453
2.764
2.227
1.806
1.474
1.211
1
0.8309
0.6941
0.5828
0.4916
0.4165
0.3543
0.3027
0.2595
0.2233
0.1929
0.1672
0.1451
0.1261
0.1097
0.09563
0.08357
0.07317
0.06421
0.05650
0.04986
33.10
24.03
17.63
13.06
9.761
7.362
5.599
4.291
3.312
2.574
2.013
1.584
1.255
1
0.8016
0.6461
0.5235
0.4266
0.3496
0.2881
0.2386
0.1985
0.1659
0.1393
0.1174
0.09937
0.08442
0.07200
0.06166
0.05306
0.04587
0.03979
0.03460
0.03013
34.56
24.99
18.26
13.48
10.04
7.546
5.720
4.369
3.362
2.604
2.030
1.593
1.258
1
0.7994
0.6426
0.5194
0.4222
0.3451
0.2837
0.2344
0.1946
0.1623
0.1359
0.1143
0.09658
0.08189
0.06969
0.05957
0.05117
0.04415
0.03823
0.03319
0.02886
42.40
29.96
21.42
15.50
11.33
8.370
6.244
4.699
3.565
2.725
2.098
1.627
1.271
1
0.7923
0.6318
0.5069
0.4090
0.3320
0.2709
0.2222
0.1831
0.1516
0.1261
0.1054
0.08843
0.07457
0.06316
0.05371
0.04585
0.03929
0.03378
0.02913
0.02519
59.76
41.10
28.61
20.14
14.33
10.31
7.482
5.481
4.050
3.015
2.262
1.710
1.303
1
0.7734
0.6023
0.4721
0.3723
0.2954
0.2356
0.1889
0.1523
0.1236
0.1009
0.08284
0.06834
0.05662
0.04712
0.03939
0.03308
0.02791
0.02364
0.02009
0.01712
kn (R25/R50)
1/298.15–1/323.15
B25/85=
kn (R25/R85)
1/298.15–1/358.15
R25=Resistance at 25.0±0.1 °C
R50=Resistance at 50.0±0.1 °C
R85=Resistance at 85.0±0.1 °C
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jun. 2015
NTC Thermistors for automotive devices (chip type)
Specification and Test Method
Item
Specification
Rated Zero-power Within the specified tolerance.
Resistance (R25)
Test Method
The value is measured at a power that the influence
of self-heat generation can be negligible (0.1mW or
less), at the rated ambient temperature of 25.0±0.1°C.
B Value
The Zero-power resistances; R1 and R2, shall be
measured respectively at T1 (deg.C) and T2 (deg.C).
The B value is calculated by the following equation.
Shown in each Individual Specification.
✽ Individual Specification shall specify B25/50 or
B25/85.
BT1/T2=
T1
25.0 ±0.1 °C
25.0 ±0.1 °C
B25/50
B25/85
Adhesion
kn (R1)–kn (R2)
1/(T1+273.15)–1/(T2+273.15)
T2
50.0 ±0.1 °C
85.0 ±0.1 °C
The terminal electrode shall be free from peeling Applied force :
or signs of peeling.
Size 0402, 0603 : 5 N
Duration : 10 s
Size : 0402
1.0
0.5
0.5R
Test Sample
Board
1.0
Size : 0603
Test
Sample
Bending distance : 2 mm
Bending speed : 1 mm/s
20
R340
45±2
Bending
distance
Bending Strength There shall be no cracks and other mechanical
damage.
R25 change : within ±5 %
Unit : mm
45±2
Unit : mm
Resistance to
Vibration
There shall be no cracks and other mechanical
damage.
R25 change
:
B Value change :
Resistance to
Impact
within ±2 %
within ±1 %
There shall be no cracks and other mechanical
damage.
R25 change
:
B Value change :
within ±2 %
within ±1 %
Solder samples on a testing substrate, then
apply vibration to them.
Acceleration
:5G
Vibrational frequency : 10 to 2000 Hz
Sweep time
: 20 minutes
12 cycles in three directions,
which are perpendicular to each other
Solder samples on a testing substrate, then apply
impacts to them.
Pulse waveform
: Semisinusoidal wave, 11 ms
Impact acceleration : 50 G
Impact direction
: X-X', Y-Y', Z-Z' In 6 directions,
three times each
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jun. 2015
NTC Thermistors for automotive devices (chip type)
Specification and Test Method
Item
Resistance to
Soldering Heat
Specification
There shall be no cracks and other mechanical
damage.
R25 change
:
B Value change :
within ±2 %
within ±1 %
Test Method
Soldering bath method
Solder temperature : 260 ±5 °C, 270 ±5 °C
Dipping period
: 3.0 ±0.5 s, 10.0 ±0.5 s
Preheat condition :
Step
1
2
Temp (°C)
80 to 100
150 to 200
Period (s)
120 to 180
120 to 180
Solderability
More than 95 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period
: 4 ±1 s
Solder
: Sn-3.0Ag-0.5Cu
Temperature
Cycling
R25 change
:
B Value change :
within ±2 %
within ±1 %
Conditions of one cycle
Step 1 : –55±3 °C, 30±3 min.
Step 2 : Room temp., 3 min. max.
Step 3 : 125±5 °C, 30±3 min.
Step 4 : Room temp., 3 min. max.
Number of cycles: 2000 cycles
Humidity
R25 change
:
B Value change :
within ±2 %
within ±1 %
Temperature
: 85 ±2 °C
Relative humidity : 85 ±5 %
Test period
: 2000 +48/0 h
Biased Humidity
R25 change
:
B Value change :
within ±2 %
within ±1 %
Temperature
: 85 ±2 °C
Relative humidity : 85 ±5 %
Applied power : 10 mW(D.C.)
Test period
: 2000 +48/0 h
Low Temperature
Exposure
R25 change
:
B Value change :
within ±2 %
within ±1 %
Temperature
Test period
: –40 ±3 °C
: 2000 +48/0 h
High Temperature R25 change
:
Exposure 1
B Value change :
within ±2 %
within ±1 %
Temperature
Test period
: 125 ±3 °C
: 2000 +48/0 h
High Temperature R25 change
:
Exposure 2
B Value change :
within ±3 %
within ±2 %
Temperature
Test period
: 150 ±3 °C
: 1000 +48/0 h
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jun. 2015
NTC Thermistors for automotive devices (chip type)
Dimensions in mm (not to scale)
L
W
(Unit : mm)
Size Code (EIA)
L
W
T
L1, L2
0 (0402)
1.0±0.1
0.50±0.05
0.50±0.05
0.25±0.15
1 (0603)
1.60±0.15
0.8±0.1
0.8±0.1
0.3±0.2
T
L2
L1
Packaging Methods
Size
Code
● Reel
Packing Quantities
Thickness
(mm)
0 (0402)
0.5
1 (0603)
0.8
for Taping
Pitch Quantity
(mm) (pcs./reel)
Kind of Taping
Punched Carrier Taping
2
10,000
4
4,000
W1
E
C
B
● Standard
D
● Pitch
W2
2 mm (Punched Carrier Taping) : Size 0402
A
Feeding hole
fD0
t1
Chip pocket
E
Symbol
(mm)
fB
fA
180
0
–3
60.0
+1.0
0
C
D
E
13.0±0.5 21.0±0.8 2.0±0.5
W1
9.0
+1.0
0
W2
11.4±1.0
B
F
W
A
Dim.
t2
Chip component
A
Symbol
B
W
P1 P2
F
E
P0
P1
P2
Tape running direction
P0
fD 0
t1
Dim. 0.62 1.12 8.0 3.50 1.75 2.00 2.00 4.0 1.5+0.1 0.7
(mm)
±0.05 ±0.05 ±0.2 ±0.05 ±0.10 ±0.05 ±0.05 ±0.1
● Pitch
0
t2
Feeding hole
fD0
Part and Taped End
Leader part
Top cover tape
1.0
max. max.
4 mm (Punched Carrier Taping) : Size 0603
100 min.
Vacant position
400 min.
Chip pocket
Taped end
E
t1
● Leader
B
F
W
A
t2
Symbol
160 min.
Vacant position
(Unit : mm)
ERTJ0 (0402)
Minimum Quantity/ Packing
Unit
10,000
Packing Quantity
in Carton
200,000
Carton
L×W×H (mm)
250×200×200
ERTJ1 (0603)
4,000
80,000
250×200×200
A
Dim. 1.0
(mm)
P1
Chip component
±0.1
B
1.8
±0.1
W
F
E
P2
Tape running direction
P0
P1
P2
P0
fD 0
t1
t2
8.0 3.50 1.75 4.0 2.00 4.0 1.5+0.1 1.1 1.4
±0.2 ±0.05 ±0.10 ±0.1 ±0.05 ±0.1
0 max. max.
Minimum Quantity / Packing Unit
Part Number (Size)
Part No., quantity and country of origin are designated on outer packages in English.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jun. 2015
NTC Thermistors for automotive devices (chip type)
Multilayer NTC Thermistors
Series:
ERTJ
Handling Precautions
Safety Precautions
The NTC Thermistors for automotive devices (chip type), hereafter referred to as Thermisotrs, is designed for
use in automotive devices. When subjected to severe electrical, environmental, and/or mechanical stress beyond
the specifications, as noted in the Ratings and Specified Conditions section, the Thermistors’ performance may
be degraded, or become failure mode, such as short circuit mode and open-circuit mode. If you use under the
condition of short-circuit, heat generation of thermistors will occur by running large current due to application of
voltage. There are possibilities of smoke emission, substrate burn-out, and, in the worst case, fire.
For products which require higher safety levels, please carefully consider how a single malfunction can affect your
product. In order to ensure the safety in the case of a single malfunction, please design products with fail-safe,
such as setting up protecting circuits, etc.
● For the following applications and conditions, please contact us for product of special specification not found in
this document.
· When your application may have difficulty complying with the safety or handling precautions specified below.
· High-quality and high-reliability required devices that have possibility of causing hazardous conditions, such as
death or injury (regardless of directly or indirectly), due to failure or malfunction of the product.
1 Aircraft and Aerospace Equipment (artificial satellite, rocket, etc.)
2 Submarine Equipment (submarine repeating equipment, etc.)
3 Transportation Equipment (airplanes, trains, ship, traffic signal controllers, etc.)
4 Power Generation Control Equipment (atomic power, hydroelectric power, thermal power plant control system, etc.)
5 Medical Equipment (life-support equipment, pacemakers, dialysis controllers, etc.)
6 Information Processing Equipment (large scale computer systems, etc.)
7 Electric Heating Appliances, Combustion devices (gas fan heaters, oil fan heaters, etc.)
8 Rotary Motion Equipment
9 Security Systems
J And any similar types of equipment
1. Circuit Design
1.1 Operating Temperature and Storage Temperature
When operating a components-mounted circuit,
please be sure to observe the “Operating Temperature
Range”, written in delivery specifications. Please
remember not to use the product under the condition
that exceeds the specified maximum temperature.
Storage temperature of PCB after mounting
Thermistors, which is not operated, should be within
the specified “Storage Temperature Range” in the
delivery specifications.
1.2 Operating Power
The electricity applied to between terminals of
Thermistors should be under the specified maximum
power dissipation.
There are possibilities of breakage and burn-out due
to excessive self-heating of Thermistors, if the power
exceeds maximum power dissipation when operating.
Please consider installing protection circuit for your
circuit to improve the safety, in case of abnormal
voltage application and so on.
Thermistors’ performance of temperature detection
would be deteriorated if self-heating occurs,
even when you use it under the maximum power
dissipation.
Please consider the maximum power dissipation and
dissipation factor.
[Maximum power dissipation]
· The Maximum power that can be continuously
applied under static air at a certain ambient
temperature. The Maximum power dissipation under
an ambient temperature of 25 °C or less is the same
with the rated maximum power dissipation, and
Maximum power dissipation beyond 25 °C depends
on the Decreased power dissipation curve below.
Decreased power dissipation curve
Maximum power dissipation/
Rated maximum power dissipation (%)
Operating Conditions and Circuit Design
120
100
80
60
40
20
0
−25
0
25 50 75 100 125 150 175
Ambient temperature (°C)
[Dissipation factor]
· The constant amount power required to raise the
temperature of the Thermistor 1 °C through self
heat generation under stable temperatures.
Dissipation factor (mW/°C) = Power consumption
of Thermistor / Temperature rise of element
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jun. 2015
NTC Thermistors for automotive devices (chip type)
1.3 Environmental Restrictions
The Thermistors shall not be operated and/or
stored under the following conditions.
(1) Environmental conditions
(a) Under direct exposure to water or salt water
(b) Under conditions where water can condense
and/or dew can form
(c) Under conditions containing corrosive gases
such as hydrogen sulfide, sulfurous acid,
chlorine and ammonia
(2) Mechanical conditions
The place where vibration or impact that
exceeds specified conditions written in delivery
specification is loaded.
1.4 Measurement of Resistance
The resistance of the Thermistors varies depending
on ambient temperatures and self-heating. To
measure the resistance value when examining circuit
configuration and conducting receiving inspection
and so on, the following points should be taken into
consideration:
1 Measurement temp : 25±0.1 °C
Measurement in liquid (silicon oil, etc.) is
recommended for a stable measurement temperature.
2 Power : 0.10 mW max.
4 terminal measurement with a constant-current
power supply is recommended.
(2) The land size shall be designed to have equal
space, on both right and left sides. If the
amount of solder on both sides is not equal,
the component may be cracked by stress,
since the side with a larger amount of solder
solidifies later during cooling.
Recommended Amount of Solder
(a) Excessive amount
There is a possibility of performance deterioration
by heat shock (temperature cycles), which causes
cracks, from alumina substrate.
Please confirm that the substrate you use does
not deteriorate the Thermistors’ quality.
(1) Solder resist shall be utilized to equalize the
amounts of solder on both sides.
(2) Solder resist shall be used to divide the
pattern for the following cases;
· Components are arranged closely.
· The Thermistor is mounted near a component
with lead wires.
· The Thermistor is placed near a chassis.
Refer to the table below.
Prohibited Applications and Recommended Applications
Item
Mixed mounting
with a component
with lead wires
Arrangement
near chassis
2.2 Design of Land Pattern
(1) Recommended land dimensions are shown below.
Use the proper amount of solder in order
to prevent cracking. Using too much solder
places excessive stress on the Thermistors.
Retro-fitting of
component with
lead wires
Lateral
arrangement
Solder resist
c
Land
b
Unit (mm)
Size Code
(EIA)
The lead wire of a
component with lead wires
Chassis
Solder
(Ground solder)
Improved applications
by pattern division
Solder resist
Solder resist
A lead wire of
Soldering Retro-fitted
component
iron
Portion to be
excessively soldered
Land
Solder resist
Solder resist
2.4 Component Layout
a
Component
dimensions
L
W
T
Prohibited
applications
Electrode pattern
Recommended Land Dimensions
SMD
(c) Insufficient amount
2.3 Utilization of Solder Resist
2. Design of Printed Circuit Board
2.1 Selection of Printed Circuit Boards
(b) Proper amount
a
b
c
0(0402)
1.0
0.5
0.5
0.4 to 0.5
0.4 to 0.5
0.4 to 0.5
1(0603)
1.6
0.8
0.8
0.8 to 1.0
0.6 to 0.8
0.6 to 0.8
To prevent the crack of Thermistors, try to
place it on the position that could not easily
be affected by the bending stress of substrate
while mounting procedures or procedures
afterwards.
Placement of the Thermistors near heating
elements also requires the great care to be
taken in order to avoid stresses from rapid
heating and cooling.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jun. 2015
NTC Thermistors for automotive devices (chip type)
(1) To minimize mechanical stress caused by the
warp or bending of a PC board, please follow
the recommended Thermistors’ layout below.
Prohibited layout
Recommended layout
Layout the Thermistors sideways
against the stressing direction
(2) The following layout is for your reference since
mechanical stress near the dividing/breaking
position of a PC board varies depending on
the mounting position of the Thermistors.
E
D
Perforation
C
A
B
Slit
Magnitude of stress A>B=C>D>E
(3) The magnitude of mechanical stress applied to
the Thermistors when dividing the circuit board
in descending order is as follows:
push back < slit < V-groove < perforation.
Also take into account the layout of the
Thermistors and the dividing/breaking method.
(4) When the Thermistors are placed near heating
elements such as heater, etc., cracks from thermal
stresses may occur under following situation:
· Soldering the Thermistors directly to heating
elements.
· Sharing the land with heating elements.
If planning to conduct above-mentioned mounting
and/or placement, please contact us in advance.
2.5 Mounting Density and Spaces
Intervals between components should not be too
narrow to prevent the influence from solder bridges
and solder balls. The space between components
should be carefully determined.
Precautions for Assembly
1. Storage
(1) The Thermistors shall be stored between 5 to
40 °C and 20 to 70 % RH, not under severe
conditions of high temperature and humidity.
(2) If stored in a place where humidity, dust, or
corrosive gasses (hydrogen sulfide, sulfurous
acid, hydrogen chloride and ammonia, etc.) are
contained, the solderability of terminal electrodes
will be deteriorated.
In addition, storage in a places where the heat
or direct sunlight exposure occur will cause
mounting problems due to deformation of tapes
and reels and components and taping/reels
sticking together.
(3) Do not store components longer than 6
months. Check the solderability of products
that have been stored for more than 6 months
before use
2. Chip Mounting Consideration
(1) When mounting the Thermistors/components
on a PC board, the Thermistor bodies shall
be free from excessive impact loads such
as mechanical impact or stress due to the
positioning, pushing force and displacement of
vacuum nozzles during mounting.
(2) Maintenance and inspection of the Chip
Mounter must be performed regularly.
(3) If the bottom dead center of the vacuum
nozzle is too low, the Thermistor will crack from
excessive force during mounting.
The following precautions and recommendations
are for your reference in use.
(a) Set and adjust the bottom dead center of the
vacuum nozzles to the upper surface of the PC
board after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle
during mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a
supporting pin on the rear surface of the PC
board to suppress the bending of the PC
board in order to minimize the impact of the
vacuum nozzles. Typical examples are shown
in the table below.
Item
Single surface
mouting
Prohibited mounting
Crack
Recommended mounting
The supporting pin does not necessarily
have to be positioned beneath the
Thermistor.
Supporting
pin
Double surface
mounting
Separation of Solder
Crack
Supporting
pin
(d) Adjust the vacuum nozzles so that their bottom
dead center during mounting is not too low.
(4) The closing dimensions of the positioning
chucks shall be controlled. Maintenance
and replacement of positioning chucks shall
be performed regularly to prevent chipping
or cracking of the Thermistors caused by
mechanical impact during positioning due to
worn positioning chucks.
(5) Maximum stroke of the nozzle shall be
adjusted so that the maximum bending of PC
board does not exceed 0.5 mm at 90 mm
span. The PC board shall be supported by an
adequate number of supporting pins.
3. Selection of Soldering Flux
Soldering flux may seriously affect the performance
of the Thermistors. The following shall be confirmed
before use.
(1) The soldering flux should have a halogen based
content of 0.1 wt% (converted to chlorine) or below.
Do not use soldering flux with strong acid.
(2) When applying water-soluble soldering flux,
wash the Thermistors sufficiently because
the soldering flux residue on the surface of
PC boards may deteriorate the insulation
resistance on the Thermistors’ surface.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jun. 2015
NTC Thermistors for automotive devices (chip type)
4. Soldering
4.1 Reflow Soldering
The reflow soldering temperature conditions are
composed of temperature curves of Preheating,
Temp. rise, Heating, Peak and Gradual cooling.
Large temperature difference inside the Thermistors
caused by rapid heat application to the Thermistors
may lead to excessive thermal stresses, contributing
to the thermal cracks. The Preheating temperature
requires controlling with great care so that tombstone
phenomenon may be prevented.
Temperature
140 to 180 °C
Preheating temp
2Temp. rise
to Peak temp.
220 °C min.
3Heating
260 °C max.
4Peak
Peak temp.
5Gradual cooling
to 140 °C
Period or Speed
60 to 120 sec
Item
1Preheating
1 to 4 °C /sec
△T
Temperature (°C)
△T
3 sec max.
△T : Allowable temperature difference △T < 150 °C
2 Temp. rise
5 Gradual
cooling
180
Preheating
60 to 120 sec
4 Peak
140
3 Heating
Time
60 to 120 sec
Gradual cooling
60 sec max.
10 sec max.
260
1 Preheating
Recommended profile of Hand soldering (EX)
2 to 5 °C /sec
Recommended profile of Reflow soldering (EX)
220
(b) Preheating:
Conduct sufficient pre-heating, and make
sure that the temperature difference
between solder and Thermistors’ surface
is 150 °C or less.
(c) Temperature of Iron tip: 300 °C max.
(The required amount of solder shall be
melted in advance on the soldering tip.)
(d) Gradual cooling:
After soldering, the Thermistors shall be
cooled gradually at room temperature.
60 sec max.
△T : Allowable temperature difference △T < 150 °C
The rapid cooling (forced cooling) during Gradual
cooling part should be avoided, because this may
cause defects such as the thermal cracks, etc.
When the Thermistors are immersed into a cleaning
solvent, make sure that the surface temperatures of
the devices do not exceed 100 °C.
Per for ming reflow soldering twice under
the conditions shown in the figure above
[Recommended profile of Reflow soldering (EX)] will
not cause any problems. However, pay attention to
the possible warp and bending of the PC board.
4.2 Hand Soldering
Hand soldering typically causes significant temperature
change, which may induce excessive thermal stresses
inside the Thermitors, resulting in the thermal cracks, etc.
In order to prevent any defects, the following should
be observed.
· The temperature of the soldering tips should be
controlled with special care.
· The direct contact of soldering tips with the
Thermistors and/or terminal electrodes should be
avoided.
· Dismounted Thermistors shall not be reused.
(1) Condition 1 (with preheating)
(a) Soldering:
Use thread solder (f1 mm or below) which
contains flux with low chlorine, developed
for precision electronic equipment.
(2) Condition 2 (without preheating)
Hand soldering can be performed without
preheating, by following the conditions below:
(a) Soldering iron tip shall never directly
touch the ceramic and terminal electrodes
of the Thermistors.
(b) The lands are sufficiently preheated with a
soldering iron tip before sliding the soldering
iron tip to the terminal electrodes of the
Thermistors for soldering.
Conditions of Hand soldering without preheating
Item
Temperature of Iron tip
Wattage
Shape of Iron tip
Soldering time with
a soldering iron
Condition
270 °C max.
20 W max.
f3 mm max.
3 sec max.
5. Post Soldering Cleaning
5.1 Cleaning solvent
Soldering flux residue may remain on the PC
board if cleaned with an inappropriate solvent.
This may deteriorate the electrical characteristics
and reliability of the Thermistors.
5.2 Cleaning conditions
Inappropriate cleaning conditions such as insufficient
cleaning or excessive cleaning may impair the electrical
characteristics and reliability of the Thermistors.
(1) Insufficient cleaning can lead to:
(a) The halogen substance found in the residue
of the soldering flux may cause the metal of
terminal electrodes to corrode.
(b) The halogen substance found in the residue
of the soldering flux on the surface of the
Thermistors may change resistance values.
(c) Water-soluble soldering flux may have more
remarkable tendencies of (a) and (b) above
compared to those of rosin soldering flux.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jun. 2015
NTC Thermistors for automotive devices (chip type)
(2) Excessive cleaning can lead to:
(a) When using ultrasonic cleaner, make sure that the
output is not too large, so that the substrate will
not resonate. The resonation causes the cracks
in Varistors and/or solders, and deteriorates the
strength of the terminal electrodes. Please follow
these conditions for Ultrasonic cleaning:
Ultrasonic wave output
: 20 W/L max.
Ultrasonic wave frequency
: 40 kHz max.
Ultrasonic wave cleaning time : 5 min. max.
5.3 Contamination of Cleaning solvent
Cleaning with contaminated cleaning solvent may
cause the same results as insufficient cleaning
due to the high density of liberated halogen.
(2) Dividing/Breaking of the PC boards shall be
done carefully at moderate speed by using a jig
or apparatus to protect the Thermistors on the
boards from mechanical damage.
(3) Examples of PCB dividing/breaking jigs:
The outline of PC board breaking jig is shown
below. When PC boards are broken or divided,
loading points should be close to the jig to minimize
the extent of the bending
Also, planes with no parts mounted on should be
used as plane of loading, in order to prevent tensile
stress induced by the bending, which may cause
cracks of the Thermistors or other parts mounted on
the PC boards.
Outline of Jig
6. Inspection Process
The pressure from measuring terminal pins might
bend the PCB when implementing circuit inspection
after mounting Thermistors on PCB, and as a result,
cracking may occur.
(1) Mounted PC boards shall be supported by an
adequate number of supporting pins on the back
with bend settings of 90 mm span 0.5 mm max.
(2) Confirm that the measuring pins have the right
tip shape, are equal in height, have the right
pressure, and are set in the correct positions.
The following figures are for your reference to
avoid bending the PC board.
Item
Prohibited setting
Recommended
setting
V-groove
PC board
splitting jig
Prohibited dividing
Recommended dividing
Loading direction
Loading
point
PC
board
PC
board
Chip
component
Loading direction
V-groove
Chip component
Loading
point
V-groove
Check pin
Check pin
9. Mechanical Impact
Bending of
PC board
Separated, Crack
PC board
Supporting pin
7. Protective Coating
When the surface of a PC board on which the
Thermistors have been mounted is coated with resin
to protect against moisture and dust, it shall be
confirmed that the protective coating does not affect the
performance of Varistors.
(1) Choose the material that does not emit the
decomposition and/or reaction gas. The Gas may
affect the composing members of the Varistors.
(2) Shrinkage and expansion of resin coating when
curing may apply stress to the Varistors and may
lead to occurrence of cracks.
(1) The Thermistors shall be free from any excessive
mechanical impact.
The Thermistor body is made of ceramics and
may be damaged or cracked if dropped.
N eve r use a T h ermisto r w hich has be en
dropped; their quality may be impaired and
failure rate increased.
(2) When handling PC boards with Thermistors mounted
on them, do not allow the Thermistors to collide
with another PC board.
When mounted PC boards are handled or stored
in a stacked state, the corner of a PC board might
strike Thermistors, and the impact of the strike may
cause damage or cracking and can deteriorate the
withstand voltage and insulation resistance of the
Thermistor.
8. Dividing/Breaking of PC Boards
Mounted PCB
(1) Please be careful not to stress the substrate with
bending/twisting when dividing, after mounting
components including Varistors. Abnormal and
excessive mechanical stress such as bending or
torsion shown below can cause cracking in the
Thermistors.
Bending
Torsion
Crack
Crack
Floor
Other
The various precautions described above are typical.
For special mounting conditions, please contact us.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Jun. 2015
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