LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 176 PIN PLASTIC FPT-176P-M02 176-pin plastic LQFP Lead pitch 0.50 mm Package width × package length 24 × 24 mm Lead shape Gullwing Sealing method Plastic mold (FPT-176P-M02) 176-pin plastic LQFP (FPT-176P-M02) +0.20 26.00±0.20(1.024±.008)SQ 1.50 –0.10 (Mounting height) +.008 .059 –.004 24.00±0.10(.945±.004)SQ 132 89 133 88 0(0)MIN (STAND OFF) 21.50 (.846) REF 25.00 (.984) NOM Details of "A" part 0.25(.010) 0.20(.008) 0.15(.006)MAX INDEX 0.40(.016)MAX 176 45 "A" LEAD No. 1 Details of "B" part 44 0.50(.0197)TYP 0.20±0.10 (.008±.010) 0.08(.003) M 0.125±0.05 (.006±.002) 0 0.10(.004) C 1995 FUJITSU LIMITED F176006S-1C-2 "B" 10° 0.50±0.20 (.020±.008) Dimensions in mm (inches). The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. 9711