Data Sheet

DISCRETE SEMICONDUCTORS
DATA SHEET
PEMH7; PUMH7
NPN/NPN resistor-equipped
transistors; R1 = 4.7 kΩ, R2 = open
Product data sheet
Supersedes data of 2001 Oct 22
2003 Oct 02
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = open
FEATURES
PEMH7; PUMH7
QUICK REFERENCE DATA
• Built-in bias resistors
SYMBOL
• Simplified circuit design
VCEO
TYP.
MAX.
UNIT
collector-emitter
voltage
−
50
V
IO
output current (DC)
−
100
mA
TR1
NPN
−
−
−
APPLICATIONS
TR2
NPN
−
−
−
• Low current peripheral driver
R1
bias resistor
4.7
−
kΩ
• Replacement of general purpose transistors in digital
applications
R2
bias resistor
open
−
−
• Reduction of component count
• Reduced pick and place costs.
PARAMETER
• Control of IC inputs.
DESCRIPTION
NPN/NPN resistor-equipped transistors (see “Simplified
outline, symbol and pinning” for package details).
PRODUCT OVERVIEW
PACKAGE
PHILIPS
NPN/PNP
COMPLEMENT
MARKING CODE(1)
TYPE NUMBER
EIAJ
PNP/PNP
COMPLEMENT
PEMH7
SOT666
−
H3
PEMD6
PEMB3
PUMH7
SOT363
SC-88
H*7
PUMD6
PUMB3
Note
1. * = p: Made in Hong Kong.
* = t: Made in Malaysia.
SIMPLIFIED OUTLINE, SYMBOL AND PINNING
PINNING
TYPE NUMBER
SIMPLIFIED OUTLINE AND SYMBOL
PIN
PEMH7
PUMH7
handbook, halfpage
6
5
6
4
5
4
R1
TR2
TR1
R1
1
Top view
2003 Oct 02
2
3
1
MAM453
2
2
3
DESCRIPTION
1
emitter TR1
2
base TR1
3
collector TR2
4
emitter TR2
5
base TR2
6
collector TR1
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = open
PEMH7; PUMH7
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PEMH7
−
Plastic surface mounted package; 6 leads
SOT666
PUMH7
−
Plastic surface mounted package; 6 leads
SOT363
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Per transistor
VCBO
collector-base voltage
open emitter
−
50
V
VCEO
collector-emitter voltage
open base
−
50
V
VEBO
emitter-base voltage
open collector
−
5
V
IO
output current (DC)
−
100
mA
ICM
peak collector current
−
100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT363
note 1
−
200
mW
SOT666
notes 1 and 2
−
200
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Tamb
operating ambient temperature
−65
+150
°C
Per device
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT363
note 1
−
300
mW
SOT666
notes 1 and 2
−
300
mW
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
2003 Oct 02
3
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = open
PEMH7; PUMH7
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Per transistor
Rth j-a
Tamb ≤ 25 °C
thermal resistance from junction to ambient
SOT363
note 1
625
K/W
SOT666
notes 1 and 2
625
K/W
Per device
Rth j-a
Tamb ≤ 25 °C
thermal resistance from junction to ambient
SOT363
note 1
416
K/W
SOT666
notes 1 and 2
416
K/W
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Per transistor
ICBO
collector-base cut-off current
VCB = 50 V; IE = 0
−
−
100
nA
ICEO
collector-emitter cut-off current
VCE = 30 V; IB = 0
−
−
1
μA
VCE = 30 V; IB = 0; Tj = 150 °C
−
−
50
μA
IEBO
emitter-base cut-off current
VEB = 5 V; IC = 0
−
−
100
nA
hFE
DC current gain
VCE = 5 V; IC = 1 mA
200
330
−
VCEsat
collector-emitter saturation voltage
IC = 5 mA; IB = 0.25 mA
−
−
100
mV
R1
input resistor
3.3
4.7
6.1
kΩ
Cc
collector capacitance
−
−
2.5
pF
2003 Oct 02
VCB = 10 V; IE = ie = 0; f = 1 MHz
4
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = open
PEMH7; PUMH7
PACKAGE OUTLINE
Plastic surface mounted package; 6 leads
SOT666
D
E
A
X
Y S
S
HE
6
5
4
pin 1 index
A
1
2
e1
c
3
bp
w M A
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
bp
c
D
E
e
e1
HE
Lp
w
y
mm
0.6
0.5
0.27
0.17
0.18
0.08
1.7
1.5
1.3
1.1
1.0
0.5
1.7
1.5
0.3
0.1
0.1
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
01-01-04
01-08-27
SOT666
2003 Oct 02
EUROPEAN
PROJECTION
5
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = open
PEMH7; PUMH7
Plastic surface mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
v M A
4
5
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
SOT363
2003 Oct 02
REFERENCES
IEC
JEDEC
EIAJ
SC-88
6
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
NXP Semiconductors
Product data sheet
NPN/NPN resistor-equipped transistors;
R1 = 4.7 kΩ, R2 = open
PEMH7; PUMH7
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Qualification
This document contains data from the preliminary specification.
Product data sheet
Production
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
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products are sold subject to the general terms and
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http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
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reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
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of an NXP Semiconductors product can reasonably be
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property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
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national authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2003 Oct 02
7
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were
made to the content, except for the legal definitions and disclaimers.
Contact information
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© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/03/pp8
Date of release: 2003 Oct 02
Document order number: 9397 750 11873
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