Data Sheet

PDTC123Y series
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 10 kΩ
Rev. 04 — 16 November 2009
Product data sheet
1. Product profile
1.1 General description
NPN Resistor-Equipped Transistors (RET) family.
Table 1.
Product overview
Type number
Package
PNP complement
NXP
JEITA
JEDEC
PDTC123YE
SOT416
SC-75
-
PDTA123YE
PDTC123YK
SOT346
SC-59A
TO-236
PDTA123YK
PDTC123YM
SOT883
SC-101
-
PDTA123YM
PDTC123YS[1]
SOT54
SC-43A
TO-92
PDTA123YS
PDTC123YT
SOT23
-
TO-236AB
PDTA123YT
PDTC123YU
SOT323
SC-70
-
PDTA123YU
[1]
Also available in SOT54A and SOT54 variant packages (see Section 2).
1.2 Features
„ Built-in bias resistors
„ Simplifies circuit design
„ Reduces component count
„ Reduces pick and place costs
1.3 Applications
„ General-purpose switching and
amplification
„ Inverter and interface circuits
„ Circuit drivers
1.4 Quick reference data
Table 2.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter voltage
open base
-
-
50
V
IO
output current (DC)
-
-
100
mA
R1
bias resistor 1 (input)
1.54
2.2
2.86
kΩ
R2/R1
bias resistor ratio
3.6
4.5
5.5
PDTC123Y series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 10 kΩ
2. Pinning information
Table 3.
Pin
Pinning
Description
Simplified outline
Symbol
SOT54
1
input (base)
2
output (collector)
3
2
R1
GND (emitter)
1
2
3
1
R2
001aab347
3
006aaa145
SOT54A
1
input (base)
2
output (collector)
3
2
R1
GND (emitter)
1
2
1
R2
3
001aab348
3
006aaa145
SOT54 variant
1
input (base)
2
output (collector)
3
2
R1
GND (emitter)
1
2
3
1
R2
001aab447
3
006aaa145
SOT23; SOT323; SOT346; SOT416
1
input (base)
2
GND (emitter)
3
3
3
R1
output (collector)
1
R2
1
2
2
006aaa144
sym007
SOT883
1
input (base)
2
GND (emitter)
3
output (collector)
1
3
3
2
R1
1
Transparent
top view
R2
2
sym007
PDTC123Y_SER_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 16 November 2009
2 of 11
PDTC123Y series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 10 kΩ
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
PDTC123YE
SC-75
plastic surface mounted package; 3 leads
SOT416
PDTC123YK
SC-59A
plastic surface mounted package; 3 leads
SOT346
PDTC123YM
SC-101
leadless ultra small plastic package; 3 solder lands;
body 1.0 × 0.6 × 0.5 mm
SOT883
PDTC123YS[1]
SC-43A
plastic single-ended leaded (through hole) package;
3 leads
SOT54
PDTC123YT
-
plastic surface mounted package; 3 leads
SOT23
PDTC123YU
SC-70
plastic surface mounted package; 3 leads
SOT323
[1]
Also available in SOT54A and SOT54 variant packages (see Section 2 and Section 9).
4. Marking
Table 5.
Marking codes
Type number
Marking code[1]
PDTC123YE
19
PDTC123YK
31
PDTC123YM
G7
PDTC123YS
TC123Y
PDTC123YT
*AL
PDTC123YU
*19
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
PDTC123Y_SER_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 16 November 2009
3 of 11
PDTC123Y series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 10 kΩ
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
VCEO
collector-emitter voltage
open base
-
50
V
-
50
V
VEBO
emitter-base voltage
open collector
-
5
V
VI
input voltage
positive
-
+12
V
negative
-
−5
V
-
100
mA
-
100
mA
IO
output current (DC)
ICM
peak collector current
single pulse;
tp ≤ 1ms
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT416
[1]
-
150
mW
SOT346
[1]
-
250
mW
SOT883
[2][3]
-
250
mW
SOT54
[1]
-
500
mW
SOT23
[1]
-
250
mW
SOT323
[1]
-
200
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Reflow soldering is the only recommended soldering method.
[3]
Device mounted on an FR4 PCB with 60 μm copper strip line, standard footprint.
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from
junction to ambient
in free air
Min
Typ
Max
Unit
[1]
-
-
833
K/W
SOT346
[1]
-
-
500
K/W
SOT883
[2][3]
-
-
500
K/W
SOT54
[1]
-
-
250
K/W
SOT23
[1]
-
-
500
K/W
SOT323
[1]
-
-
625
K/W
SOT416
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Reflow soldering is the only recommended soldering method.
[3]
Device mounted on an FR4 PCB with 60 μm copper strip line, standard footprint.
PDTC123Y_SER_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 16 November 2009
4 of 11
PDTC123Y series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 10 kΩ
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ICBO
collector-base cut-off
current
VCB = 50 V; IE = 0 A
-
-
100
nA
ICEO
collector-emitter
cut-off current
VCE = 30 V; IB = 0 A
-
-
1
μA
VCE = 30 V; IB = 0 A;
Tj = 150 °C
-
-
50
μA
IEBO
emitter-base cut-off
current
VEB = 5 V; IC = 0 A
-
-
700
μA
hFE
DC current gain
VCE = 5 V; IC = 5 mA
35
-
-
VCEsat
collector-emitter
saturation voltage
IC =10 mA; IB = 0.5 mA
-
-
150
mV
VI(off)
off-state input voltage
VCE = 5 V; IC = 100 μA
-
0.75
0.3
V
VI(on)
on-state input voltage
VCE = 300 mV; IC = 20 mA
2.5
1.15
-
V
kΩ
R1
bias resistor 1 (input)
1.54
2.2
2.86
R2/R1
bias resistor ratio
3.6
4.5
5.5
Cc
collector capacitance
-
-
2
VCB = 10 V; IE = ie = 0 A;
f = 1 MHz
PDTC123Y_SER_4
Product data sheet
pF
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 16 November 2009
5 of 11
PDTC123Y series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 10 kΩ
006aaa095
103
hFE
(2)
(1)
006aaa096
1
VCEsat
(V)
(3)
102
10−1
(1)
(2)
10
(3)
1
10−1
1
102
10
10−2
1
102
10
IC (mA)
I C (mA)
VCE = 5 V
IC/IB = 20
(1) Tamb = 100 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
(3) Tamb = −40 °C
Fig 1.
DC current gain as a function of collector
current; typical values
Fig 2.
006aaa097
10
VI(on)
(V)
Collector-emitter saturation voltage as a
function of collector current; typical values
006aaa098
10
VI(off)
(V)
(1)
1
(1)
1
(2)
(2)
(3)
(3)
10−1
10−1
1
102
10
10−1
10−1
IC (mA)
VCE = 0.3 V
VCE = 5 V
(1) Tamb = −40 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
(3) Tamb = 100 °C
On-state input voltage as a function of
collector current; typical values
Fig 4.
Off-state input voltage as a function of
collector current; typical values
PDTC123Y_SER_4
Product data sheet
10
IC (mA)
(1) Tamb = −40 °C
Fig 3.
1
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 16 November 2009
6 of 11
PDTC123Y series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 10 kΩ
8. Package outline
3
3
0.45
0.15
1
2
1
0.30
0.15
2
0.25
0.10
Dimensions in mm
04-11-04
Package outline SOT416 (SC-75)
0.62
0.55
0.55
0.47
Dimensions in mm
Fig 6.
0.50
0.46
0.26
0.10
04-11-11
Package outline SOT346 (SC-59A/TO-236)
0.45
0.38
4.2
3.6
3
0.30
0.22
0.48
0.40
1.02
0.95
0.65
1
2
4.8
4.4
2
2.54
3
1
0.20
0.12
5.2
5.0
0.35
Dimensions in mm
Fig 7.
0.50
0.35
1.9
1
0.30
0.22
0.6
0.2
3.0 1.7
2.5 1.3
1.75 0.9
1.45 0.7
Fig 5.
1.3
1.0
3.1
2.7
0.95
0.60
1.8
1.4
03-04-03
Package outline SOT883 (SC-101)
14.5
12.7
Dimensions in mm
Fig 8.
04-11-16
Package outline SOT54 (SC-43A/TO-92)
0.45
0.38
0.45
0.38
4.2
3.6
1.27
4.2
3.6
1.27
0.48
0.40
3 max
1
2.5
max
0.48
0.40
1
2
4.8
4.4
5.08
2.54
2
4.8
4.4
2.54
3
1.27
3
5.2
5.0
Dimensions in mm
Fig 9.
5.2
5.0
14.5
12.7
Package outline SOT54A
04-06-28
Dimensions in mm
05-01-10
Fig 10. Package outline SOT54 variant
PDTC123Y_SER_4
Product data sheet
14.5
12.7
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 16 November 2009
7 of 11
PDTC123Y series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 10 kΩ
3.0
2.8
1.1
0.9
2.2
1.8
1.1
0.8
0.45
0.15
3
3
0.45
0.15
2.5 1.4
2.1 1.2
2.2 1.35
2.0 1.15
1
1
2
1.9
0.48
0.38
2
0.4
0.3
0.15
0.09
Dimensions in mm
04-11-04
Fig 11. Package outline SOT23 (TO-236AB)
0.25
0.10
1.3
Dimensions in mm
04-11-04
Fig 12. Package outline SOT323 (SC-70)
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
5000
10000
PDTC123YE
SOT416
4 mm pitch, 8 mm tape and reel
-115
-
-135
PDTC123YK
SOT346
4 mm pitch, 8 mm tape and reel
-115
-
-135
PDTC123YM
SOT883
2 mm pitch, 8 mm tape and reel
-
-
-315
PDTC123YS
SOT54
bulk, straight leads
-
-412
-
SOT54A
tape and reel, wide pitch
-
-
-116
tape ammopack, wide pitch
-
-
-126
SOT54 variant
bulk, delta pinning
-
-112
-
PDTC123YT
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-235
PDTC123YU
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-135
[1]
For further information and the availability of packing methods, see Section 12.
PDTC123Y_SER_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 16 November 2009
8 of 11
PDTC123Y series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 10 kΩ
10. Revision history
Table 10.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PDTC123Y_SER_4
20091116
Product data sheet
-
PDTC123Y_SER_3
Modifications:
•
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
PDTC123Y_SER_3
20050324
Product data sheet
-
PDTC123YT_2
PDTC123YT_2
20040510
Objective data sheet
-
PDTC123YT_1
PDTC123YT_1
20040406
Objective data sheet
-
-
PDTC123Y_SER_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 16 November 2009
9 of 11
PDTC123Y series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 10 kΩ
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
Definition
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
11.3
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
PDTC123Y_SER_4
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 04 — 16 November 2009
10 of 11
PDTC123Y series
NXP Semiconductors
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = 10 kΩ
13. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contact information. . . . . . . . . . . . . . . . . . . . . 10
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 16 November 2009
Document identifier: PDTC123Y_SER_4
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