lsbi3833-l32.pdf

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LSBI3833/L32
DATA SHEET
DOC. NO
:
QW0905- LSBI3833/L32
REV.
:
A
DATE
: 28 - Apr. - 2008
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSBI3833/L32
Page 1/5
Package Dimensions
5.0
5.6
7.7
8.7
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
0°
-30°
30°
-60°
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
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Property of Ligitek Only
Page 2/5
PART NO. LSBI3833/L32
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
SBI
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
70
mA
Power Dissipation
PD
120
mW
Ir
50
μA
Electrostatic Discharge( * )
ESD
500
V
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Reverse Current @5V
Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* Static
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
COLOR
PART NO MATERIAL
Emitted
LSBI3833/L32 InGaN/SiC
Blue
Forward
Peak Dominant Spectral
voltage
wave
wave halfwidth
length length △λ nm @20mA(V)
λPnm λDnm
@20mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Typ. Max. Min. Typ.
Lens
Water Clear
Luminous
intensity
430
465
65
3.8
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
4.7
300
550
10
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Property of Ligitek Only
PART NO. LSBI3833/L32
Page 3/5
Typical Electro-Optical Characteristics Curve
SBI CHIP
Fig.2 Relative Intensity vs. Wavelength
30
1.0
Relative Intensity(%)
Forward Current(mA DC)
Fig.1 Forward current vs. Forward Voltage
25
20
15
10
5
0
1
2
3
4
0.5
0
380
5
Forward Voltage(V)
100
Relative Intensity
Relative Intensity(%)
580
630
680
10
75
50
25
0
5
10 15 20 25 30 35 40 45
Fig.5 Forward Current vs. Ambient Temperature
40
30
20
10
0
25
50
75
Ambient Temperature ( ℃)
1
0
0
25
50
75
Lead Temperature ( ℃)
Forward Current (mA DC)
Forward Current (mA DC)
530
Fig.4 Relative Intensity vs. Lead Temperature
125
0
480
Wavelength (nm)
Fig.3 Relative Intensity vs. Forward Current
0
430
100
100
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Property of Ligitek Only
PART NO. LSBI3833/L32
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350°C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2° C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
50
100
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
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Page 5/5
PART NO. LSBI3833/L32
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11