LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY LA12B/12WK-2 DATA SHEET DOC. NO : QW0905-LA12B/12WK-2 REV. : B DATE : 11 - Jan - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA12B/12WK-2 Page 1/5 Package Dimensions WK WK WK WK WK WK WK WK WK WK WK WK 84.5 6.1 5.2 1.3 3.75 7.0X11=77.0 8.5 6.0 □0.5 TYP 25.0MIN - + 1.0MIN 2.54TYP. LWK5633 6.2 1.4 6.0 3.0 8.0 1.5MAX 25.0MIN □0.5 TYP. 2.54TYP 1.0MIN Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/5 PART NO. LA12B/12WK-2 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT WK Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 120 mW Reverse Current @5V Ir 50 μA Electrostatic Discharge ESD 150 V Operating Temperature Topr -20 ~ +80 ℃ ℃ Storage Temperature Tstg -30 ~ +100 ℃ ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from body) Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LA12B/12WK-2 InGaN/GaN White Lens Water Clear Chromaticity Coordinates Forward voltage @ 20mA(V) X Typ. Max. Min. Y 0.28 ±0.03 0.28±0.06 3.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 4.0 Luminous intensity @20mA(mcd) 65 Viewing angle 2 θ 1/2 (deg) Typ. 110 98 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA12B/12WK-2 Page 3/5 Chromaticity Coordinates Specifications for Bin Grading Rank Chromaticity Coordinates Rank Chromaticity Coordinates Rank Chromaticity Coordinates A X=0.23±0.02 Y=0.23±0.06 B X=0.28±0.03 Y=0.28±0.06 C X=0.33±0.02 Y=0.33±0.06 A-1 X=0.23±0.02 Y=0.2±0.03 B-1 X=0.28±0.03 Y=0.24±0.015 C-1 X=0.33±0.02 Y=0.3±0.03 A-2 X=0.23±0.02 Y=0.26±0.03 B-2 X=0.28±0.03 Y=0.26±0.015 C-2 X=0.33±0.02 Y=0.36±0.03 B-3 X=0.28±0.03 Y=0.29±0.015 B-4 X=0.28±0.03 Y=0.32±0.015 CIE Chromaticity Diagram C B A LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA12B/12WK-2 Page 4/5 Typical Electro-Optical Characteristics Curve WK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 SPECTRAL RADIANCE 100 Intensity 80 60 40 20 0 600 Wavelength (nm) 700 2.5 2.0 1.5 1.0 0.5 0.0 -20 0 20 40 60 80 Ambient Temperature( ℃) Fig.5 Luminous Spectrum(Ta=25 ℃) 500 3.0 -40 Ambient Temperature( ℃) 400 1000 Forward Current(mA) Forward Voltage(V) -40 100 800 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/5 PART NO. LA12B/12WK-2 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11