Datasheet

SSF7NS60F
Main Product Characteristics:
VDSS
600V
RDS(on)
0.54Ω(typ.)
ID
7A ①
TO220F
Marking and pin
Schematic diagram
Assignment
Features and Benefits:
Feathers:

High dv/dt and avalanche capabilities

100% avalanche tested

Low input capacitance and gate charge

Low gate input resistance
Description:
The SSF7NS60F series MOSFETs is a new technology, which combines an innovative super junction
technology and advance process.
This new technology achieves low Rdson, energy saving,
high
reliability and uniformity, superior power density and space saving.
Absolute max Rating:
Symbol
Parameter
Max.
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
7①
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
5①
IDM
Pulsed Drain Current ②
28
Power Dissipation ③
32
W
Linear Derating Factor
0.26
W/°C
VDS
Drain-Source Voltage
600
V
VGS
Gate-to-Source Voltage
± 30
V
EAS
Single Pulse Avalanche Energy @ L=15.2mH
68
mJ
IAR
Avalanche Current @ L=15.2mH
3
A
-55 to + 150
°C
PD @TC = 25°C
TJ
TSTG
Operating Junction and Storage Temperature Range
©Silikron Semiconductor CO.,LTD.
2012.02.26
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Version : 1.0
Units
A
page 1 of 8
SSF7NS60F
Thermal Resistance
Symbol
Characterizes
Typ.
Max.
Units
RθJC
Junction-to-case ③
—
3.9
℃/W
RθJA
Junction-to-ambient (t ≤ 10s) ④
—
80
℃/W
Electrical Characterizes @TA=25℃ unless otherwise specified
Symbol
Parameter
Min.
V(BR)DSS
Drain-to-Source breakdown voltage
RDS(on)
Static Drain-to-Source on-resistance
VGS(th)
Gate threshold voltage
IDSS
Drain-to-Source leakage current
IGSS
Gate-to-Source forward leakage
Qg
Typ.
Max.
Units
V
Conditions
600
—
—
—
0.54
0.65
—
1.57
—
2
—
4
—
2.82
—
—
—
1
—
—
50
—
—
100
—
—
-100
Total gate charge
—
15.1
—
Qgs
Gate-to-Source charge
—
3.8
—
Qgd
Gate-to-Drain("Miller") charge
—
7.0
—
VGS = 10V
td(on)
Turn-on delay time
—
11.0
—
VGS=10V, VDS =380V,
tr
Rise time
—
22.2
—
td(off)
Turn-Off delay time
—
23.8
—
tf
Fall time
—
17.8
—
ID =7.3A
Ciss
Input capacitance
—
475
—
VGS = 0V
Coss
Output capacitance
—
399
—
Crss
Reverse transfer capacitance
—
4
—
Ω
V
μA
nA
VGS = 0V, ID = 250μA
VGS=10V,ID = 4.6A
TJ = 125℃
VDS = VGS, ID = 350μA
TJ = 125℃
VDS = 600V,VGS = 0V
TJ = 125°C
VGS =30V
VGS = -30V
ID = 7.3A,
nC
ns
pF
VDS=300V,
RL=52Ω,
RGEN=12Ω
VDS = 25V
ƒ = 1MHz
Source-Drain Ratings and Characteristics
Symbol
IS
ISM
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Min.
Typ.
Max.
Units
—
—
7①
A
—
—
28
A
Conditions
MOSFET symbol
showing
the
integral reverse
p-n junction diode.
VSD
Diode Forward Voltage
—
0.95
1.3
V
IS=7.3A, VGS=0V
trr
Reverse Recovery Time
—
123
—
nS
TJ = 25°C, IF =1A, di/dt =
Qrr
Reverse Recovery Charge
—
638
—
nC
100A/μs
©Silikron Semiconductor CO.,LTD.
2012.02.26
www.silikron.com
Version : 1.0
page 2 of 8
SSF7NS60F
Test circuits and Waveforms
Switch Waveforms:
Notes:
①Calculated continuous current based on maximum allowable junction temperature. Package
limitation current is 75A.
②Repetitive rating; pulse width limited by max. junction temperature.
③The power dissipation PD is based on max. junction temperature, using junction-to-case thermal
resistance.
④The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a
still air environment with TA =25°C
⑤These curves are based on the junction-to-case thermal impedence which is measured with the
device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=175°C.
©Silikron Semiconductor CO.,LTD.
2012.02.26
www.silikron.com
Version : 1.0
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SSF7NS60F
Typical electrical and thermal characteristics
Figure 2. Gate to source cut-off voltage
Figure 1: Typical Output Characteristics
Figure 3. Drain-to-Source Breakdown Voltage vs.
Temperature
©Silikron Semiconductor CO.,LTD.
Figure 4: Normalized On-Resistance Vs. Case
Temperature
2012.02.26
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SSF7NS60F
Typical electrical and thermal characteristics
Figure 5. Maximum Drain Current Vs. Case
Figure 6. Typical Capacitance Vs. Drain-to-Source
Temperature
Voltage
Figure7. Maximum Effective Transient Thermal Impedance, Junction-to-Case
©Silikron Semiconductor CO.,LTD.
2012.02.26
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Version : 1.0
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SSF7NS60F
Mechanical Data:
TO220F PACKAGE OUTLINE DIMENSION
Symbol
A
A1
A2
A3
B1
B2
B3
C
C1
C2
D
D1
D2
D3
E
E1
E2
E3
E4
Dimension In Millimeters
Min
Nom
Max
9.960
10.160
10.360
7.000
3.080
3.180
3.280
9.260
9.460
9.660
15.670
15.870
16.070
4.500
4.700
4.900
6.480
6.680
6.880
3.200
3.300
3.400
15.600
15.800
16.000
9.550
9.750
9.950
2.54 (TYP)
1.470
0.700
0.800
0.900
0.250
0.350
0.450
2.340
0.450
2.560
ϴ
©Silikron Semiconductor CO.,LTD.
2.540
0.700
1.0*450
0.500
2.760
2.740
0.600
2.960
300
Dimension In Inches
Nom
0.400
0.000
0.125
0.372
0.625
0.185
0.263
0.130
0.622
0.384
1.00 (TYP)
0.028
0.031
0.010
0.014
Min
0.392
0.276
0.121
0.365
0.617
0.177
0.255
0.126
0.614
0.376
0.092
0.018
0.101
0.100
0.028
1.0*450
0.020
0.109
Max
0.408
0.000
0.129
0.380
0.633
0.193
0.271
0.134
0.630
0.392
0.058
0.035
0.018
0.108
0.024
0.117
300
2012.02.26
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SSF7NS60F
Ordering and Marking Information
Device Marking: SSF7NS60F
Package (Available)
TO220F
Operating Temperature Range
C : -55 to 150 ºC
Devices per Unit
Package
Type
TO220F
Units/Tube
Tubes/Inner
Box
50
Reliability Test Program
Test Item
Conditions
High
Temperature
Reverse
Bias(HTRB)
High
Temperature
Gate
Bias(HTGB)
Units/Inner Inner
Box
Boxes/Carton
Box
20
1000
6
Duration
Sample Size
Tj=125℃ to 150℃ @
80% of Max
VDSS/VCES/VR
168 hours
500 hours
1000 hours
3 lots x 77 devices
Tj=150℃ @ 100% of
Max VGSS
168 hours
500 hours
1000 hours
3 lots x 77 devices
©Silikron Semiconductor CO.,LTD.
2012.02.26
www.silikron.com
Version : 1.0
Units/
Carton
Box
6000
page 7 of 8
SSF7NS60F
ATTENTION:
■
■
■
■
■
■
■
■
■
Any and all Silikron products described or contained herein do not have specifications that can handle applications
that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other
applications whose failure can be reasonably expected to result in serious physical and/or material damage.
Consult with your Silikron representative nearest you before using any Silikron products described or contained
herein in such applications.
Silikron assumes no responsibility for equipment failures that result from using products at values that exceed,
even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed
in products specifications of any and all Silikron products described or contained herein.
Specifications of any and all Silikron products described or contained herein stipulate the performance,
characteristics, and functions of the described products in the independent state, and are not guarantees of the
performance, characteristics, and functions of the described products as mounted in the customer’s products or
equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer
should always evaluate and test devices mounted in the customer’s products or equipment.
Silikron Semiconductor CO.,LTD. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to
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events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for
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Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the
Silikron product that you intend to use.
This catalog provides information as of Dec, 2008. Specifications and information herein are subject to change
without notice.
Customer Service
Worldwide Sales and Service:
[email protected]
Technical Support:
[email protected]
Suzhou Silikron Semiconductor Corp.
11A, 428 Xinglong Street, Suzhou Industrial Park, P.R.China
TEL: (86-512) 62560688
FAX: (86-512) 65160705
E-mail: [email protected]
©Silikron Semiconductor CO.,LTD.
2012.02.26
www.silikron.com
Version : 1.0
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