Data Sheet

PEMD19; PUMD19
NPN/PNP resistor-equipped transistors;
R1 = 22 kΩ, R2 = open
Rev. 01 — 17 February 2005
Product data sheet
1. Product profile
1.1 General description
NPN/PNP resistor-equipped transistors.
Table 1:
Product overview
Type number
Package
Philips
JEITA
PNP/PNP
complement
NPN/NPN
complement
PEMD19
SOT666
-
PEMB19
PEMH19
PUMD19
SOT363
SC-88
PUMB19
PUMH19
1.2 Features
■
■
■
■
Built-in bias resistors
Simplifies circuit design
Reduces component count
Reduces pick and place cost
1.3 Applications
■ Low current peripheral driver
■ Control of IC inputs
■ Replacement of general-purpose transistors in digital applications
1.4 Quick reference data
Table 2:
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter voltage
open base
-
-
50
V
IO
output current (DC)
-
-
100
mA
R1
bias resistor 1 (input)
15.4
22
28.6
kΩ
PEMD19; PUMD19
Philips Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
2. Pinning information
Table 3:
Pinning
Pin
Description
Simplified outline
1
GND (emitter) TR1
2
input (base) TR1
3
output (collector) TR2
4
GND (emitter) TR2
5
input (base) TR2
6
output (collector) TR1
6
5
4
Symbol
6
5
4
R1
TR2
TR1
1
2
3
R1
001aab555
1
2
3
006aaa269
3. Ordering information
Table 4:
Ordering information
Type number
Package
Name
Description
Version
PEMD19
-
plastic surface mounted package; 6 leads
SOT666
PUMD19
SC-88
plastic surface mounted package; 6 leads
SOT363
4. Marking
Table 5:
Marking codes
Type number
Marking code [1]
PEMD19
6E
PUMD19
T4*
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
9397 750 14408
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 17 February 2005
2 of 11
PEMD19; PUMD19
Philips Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
5. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor; for the PNP transistor with negative polarity
VCBO
collector-base voltage
open emitter
-
50
V
VCEO
collector-emitter voltage
open base
-
50
V
VEBO
emitter-base voltage
open collector
-
5
V
IO
output current (DC)
-
100
mA
ICM
peak collector current
-
100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT363
[1]
-
200
mW
SOT666
[1] [2]
-
200
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Per device
total power dissipation
Ptot
Tamb ≤ 25 °C
SOT363
[1]
-
300
mW
SOT666
[1] [2]
-
300
mW
[1]
Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
[2]
Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
Table 7:
Symbol
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
Per transistor
Rth(j-a)
thermal resistance from
junction to ambient
Tamb ≤ 25 °C
SOT363
[1]
-
-
625
K/W
SOT666
[1] [2]
-
-
625
K/W
SOT363
[1]
-
-
416
K/W
SOT666
[1] [2]
-
-
416
K/W
Per device
Rth(j-a)
thermal resistance from
junction to ambient
Tamb ≤ 25 °C
[1]
Device mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
[2]
Reflow soldering is the only recommended soldering method.
9397 750 14408
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 17 February 2005
3 of 11
PEMD19; PUMD19
Philips Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
7. Characteristics
Table 8:
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Per transistor; for the PNP transistor with negative polarity
ICBO
collector-base cut-off
current
VCB = 50 V; IE = 0 A
-
-
100
nA
ICEO
collector-emitter
cut-off current
VCE = 30 V; IB = 0 A
-
-
1
µA
VCE = 30 V; IB = 0 A;
Tj = 150 °C
-
-
50
µA
nA
IEBO
emitter-base cut-off
current
VEB = 5 V; IC = 0 A
-
-
100
hFE
DC current gain
VCE = 5 V; IC = 1 mA
100
-
-
VCEsat
collector-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA
-
-
150
mV
R1
bias resistor 1 (input)
15.4
22
28.6
kΩ
Cc
collector capacitance
TR1 (NPN)
-
-
2.5
pF
TR2 (PNP)
-
-
3
pF
VCB = −10 V; IE = ie = 0 A;
f = 1 MHz
9397 750 14408
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 17 February 2005
4 of 11
PEMD19; PUMD19
Philips Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
006aaa172
500
006aaa173
103
hFE
(1)
VCEsat
(mV)
400
(2)
102
300
(2) (1)
(3)
(3)
200
100
10−1
1
102
10
10
1
102
10
I C (mA)
I C (mA)
VCE = 5 V
IC/IB = 20
(1) Tamb = 100 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
(3) Tamb = −40 °C
Fig 1. TR1 (NPN): DC current gain as a function of
collector current; typical values
006aaa196
103
Fig 2. TR1 (NPN): Collector-emitter saturation voltage
as a function of collector current; typical values
006aaa197
−1
(1)
hFE
VCEsat
(V)
(2)
(3)
−10−1
102
(1)
10
−10−1
−1
−10
−102
−10−2
−10−1
IC (mA)
(3)
−10
−102
IC (mA)
VCE = −5 V
IC/IB = 20
(1) Tamb = 100 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(2) Tamb = 25 °C
(3) Tamb = −40 °C
(3) Tamb = −40 °C
Fig 3. TR2 (PNP): DC current gain as a function of
collector current; typical values
Fig 4. TR2 (PNP): Collector-emitter saturation voltage
as a function of collector current; typical values
9397 750 14408
Product data sheet
−1
(2)
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 17 February 2005
5 of 11
PEMD19; PUMD19
Philips Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
8. Package outline
Plastic surface mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
SOT363
JEDEC
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
04-11-08
Fig 5. Package outline SOT363 (SC-88)
9397 750 14408
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 17 February 2005
6 of 11
PEMD19; PUMD19
Philips Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
Plastic surface mounted package; 6 leads
SOT666
D
E
A
X
Y S
S
HE
6
5
4
pin 1 index
A
1
2
e1
c
3
bp
w M A
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
bp
c
D
E
e
e1
HE
Lp
w
y
mm
0.6
0.5
0.27
0.17
0.18
0.08
1.7
1.5
1.3
1.1
1.0
0.5
1.7
1.5
0.3
0.1
0.1
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
01-08-27
04-11-08
SOT666
Fig 6. Package outline SOT666
9397 750 14408
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 17 February 2005
7 of 11
PEMD19; PUMD19
Philips Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
9. Packing information
Table 9:
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
Type number
Package
[1]
Description
Packing quantity
3000
4000
10000
PEMD19
SOT666
4 mm pitch, 8 mm tape and reel
-
-115
-
PUMD19
SOT363
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-
-135
PUMD19
SOT363
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-
-165
[1]
For further information and the availability of packing methods, see Section 14.
[2]
T1: normal taping
[3]
T2: reverse taping
9397 750 14408
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 17 February 2005
8 of 11
PEMD19; PUMD19
Philips Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
10. Revision history
Table 10:
Revision history
Document ID
Release date
PEMD19_PUMD19_1 20050217
Data sheet status
Change notice
Doc. number
Supersedes
Product data sheet
-
9397 750 14408
-
9397 750 14408
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 17 February 2005
9 of 11
PEMD19; PUMD19
Philips Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
11. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
13. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
9397 750 14408
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 01 — 17 February 2005
10 of 11
PEMD19; PUMD19
Philips Semiconductors
NPN/PNP resistor-equipped transistors; R1 = 22 kΩ, R2 = open
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information. . . . . . . . . . . . . . . . . . . . . . 8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 10
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Contact information . . . . . . . . . . . . . . . . . . . . 10
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 17 February 2005
Document number: 9397 750 14408
Published in The Netherlands
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