HS-26CLV32RH TM Data Sheet August 2000 Radiation Hardened 3.3V Quad Differential Line Receiver The Intersil HS-26CLV32RH is a radiation hardened 3.3V quad differential line receiver designed for digital data transmission over balanced lines, in low voltage, RS-422 protocol applications. Radiation hardened CMOS processing assures low power consumption, high speed, and reliable operation in the most severe radiation environments. The HS-26CLV32RH has an input sensitivity of 200mV (Typ) over a common mode input voltage range of -4V to +7V. The receivers are also equipped with input fail safe circuitry, which causes the outputs to go to a logic “1” when the inputs are open. The device has unique inputs that remain high impedance when the receiver is disabled or powered-down, maintaining signal integrity in multi-receiver applications. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-95689. A “hot-link” is provided on our homepage for downloading. www.intersil.com/spacedefense/space.asp INTERNAL MKT. NO. • Electrically Screened to SMD # 5962-95689 • QML Qualified per MIL-PRF-38535 Requirements • 1.2 Micron Radiation Hardened CMOS - Total Dose. . . . . . . . . . . . . . . . . . . . . 300 krad(Si)(Max) - Single Event Upset LET . . . . . . . . . . .100MeV/mg/cm2) - Single Event Latch-up Immune • Low Stand-by Current. . . . . . . . . . . . . . . . . . . 13mA(Max) • Operating Supply Range . . . . . . . . . . . . . . . . 3.0V to 3.6V • Enable Input Levels . . . . VIH > (.7)(VDD); VIL < (.3)(VDD) • CMOS Output Levels . . . . . . . . VOH > 2.55V; VOL < 0.4V • Input Fail Safe Circuitry • High Impedance Inputs when Disabled or Powered-down • Full -55oC to 125oC Military Temperature Range Pinouts HS1-26CLV32RH 16 LEAD CERAMIC SIDEBRAZE DIP MIL-STD-1835: CDIP2-T16 TOP VIEW TEMP. RANGE (oC) 5962F9568902QEC HS1-26CLV32RH-8 -55 to 125 5962F9568902QXC HS9-26CLV32RH-8 -55 to 125 5962F9568902V9A HS0-26CLV32RH-Q 25 5962F9568902VEC HS1-26CLV32RH-Q -55 to 125 5962F9568902VXC HS9-26CLV32RH-Q -55 to 125 ENABLE DIN DIN + - DOUT CIN CIN + - COUT 1 BIN BIN + - BOUT AIN AIN + - 16 VDD AIN 2 15 BIN 3 14 BIN 13 BOUT ENABLE 4 COUT 5 12 ENABLE CIN 6 11 DOUT CIN 7 10 DIN GND 8 9 DIN HS9-26CLV32RH 16 LEAD FLATPACK MIL-STD-1835: CDFP4-F16 TOP VIEW HS9-26CLV32RH/PROTO HS9-26CLV32RH/PROTO -55 to 125 ENABLE AIN 1 AOUT HS1-26CLV32RH/PROTO HS1-26CLV32RH/PROTO -55 to 125 Logic Diagram 4907 Features Ordering Information ORDERING NO. File Number AIN 1 16 VDD AIN 2 15 BIN AOUT 3 14 BIN ENABLE 4 13 BOUT COUT 5 12 ENABLE CIN 6 11 DOUT CIN 7 10 DIN GND 8 9 DIN AOUT CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000 HS-26CLV32RH Die Characteristics DIE DIMENSIONS: Metallization: 84 mils x 130 mils x 21 mils (2140µm x 3290µm) Bottom: Mo/Tiw Thickness: 5800Å ±1kÅ Top: Al/Si/Cu Thickness: 10kÅ ±1kÅ INTERFACE MATERIALS: Glassivation: Worst Case Current Density: Type: PSG (Phosphorus Silicon Glass) Thickness: 8kÅ ± 1kÅ <2.0 x 105A/cm2 Bond Pad Size: Substrate: 110µm x 100µm AVLSI1RA, Silicon backside, VDD backside potential Metallization Mask Layout HS-26CLV32RH AIN (1) VDD (16) BIN (15) (14) BIN AIN (2) (13) BOUT AOUT (3) ENAB (4) (12) ENAB COUT (5) (11) DOUT (10) DIN CIN (6) (7) CIN 2 (8) GND (9) DIN HS-26CLV32RH All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 3 ASIA Intersil Ltd. 8F-2, 96, Sec. 1, Chien-kuo North, Taipei, Taiwan 104 Republic of China TEL: 886-2-2515-8508 FAX: 886-2-2515-8369